What is the UP Package Standard?

"UP" stands for Universal Package, a standardized System on Module (SoM) form factor defined by Forlinx Embedded. The trailing number represents the physical dimensions (e.g., "4" for 40×40mm, "5" for 50×50mm). This architecture provides massive pin counts for maximum expandability while ensuring seamless platform migration without carrier board redesigns.

UP4: 40mm × 40mm

Hybrid LCC (Leadless Chip Carrier) and LGA (Land Grid Array) interface, providing 487 pins.

Diagram illustrating the 1.0mm LCC contact pitch for the Forlinx UP4 System on Module.
LCC Contact Pitch
1.0 mm
Diagram illustrating the 1.27mm LGA ball pitch for the Forlinx UP4 System on Module.
LGA Ball Pitch
1.27 mm

UP5: 50mm × 50mm

High-density pure LGA (Land Grid Array) interface, providing 624 pins to unleash flagship CPU capabilities.

Diagram illustrating the tighter 1.25mm LGA ball pitch for the Forlinx UP5 System on Module.
LGA Ball Pitch
1.25 mm
624
Total Contacts
624 Pins
Visual comparison and pin layout diagram of the Forlinx UP Series (Universal Package) System on Modules, showcasing high-density LGA and LCC interfaces.

One carrier board design,
seamless Pin-to-Pin evolution.

Forlinx P2P UP Carrier Board
Design Once, Smooth Evolution
Leverage a unified pin-out and form factor to derive high-end, mid-range, and entry-level products from a single carrier board. This drastically reduces the time, cost, and risk of hardware routing and driver development.
Seamless Performance Scaling
The UP4 architecture fully unleashes hardware potential without sacrificing standardization. Easily scale system performance up or down and optimize BOM costs at any stage of your product lifecycle.
Supply Chain Resilience
Break free from single-vendor lock-in. With pin-to-pin compatibility across major brands like NXP, Rockchip, and Allwinner, you can easily switch platforms to mitigate chip obsolescence and supply chain risks.
Compact Design & Reliable Delivery
UP4 achieves the perfect balance of compact size and cost optimization for space-constrained devices. This is backed by Forlinx's industrial-grade quality and a guaranteed annual production capacity of one million SoM units.