What is UP4 Package?

"UP" stands for Universal Package, and "4" defines the compact 40mm × 40mm form factor. This standardized design utilizes a hybrid interface of LCC (Leadless Chip Carrier) and LGA (Land Grid Array), providing a massive 487 pins for maximum expandability.

LCC
LCC Contact Pitch
1.0 mm
LGA
LGA Ball Pitch
1.27 mm
UP4 Pin Layout

One carrier board design,
seamless Pin-to-Pin evolution.

Forlinx P2P UP Carrier Board
Design Once, Smooth Evolution
Leverage a unified pin-out and form factor to derive high-end, mid-range, and entry-level products from a single carrier board. This drastically reduces the time, cost, and risk of hardware routing and driver development.
Seamless Performance Scaling
The UP4 architecture fully unleashes hardware potential without sacrificing standardization. Easily scale system performance up or down and optimize BOM costs at any stage of your product lifecycle.
Supply Chain Resilience
Break free from single-vendor lock-in. With pin-to-pin compatibility across major brands like NXP, Rockchip, and Allwinner, you can easily switch platforms to mitigate chip obsolescence and supply chain risks.
Compact Design & Reliable Delivery
UP4 achieves the perfect balance of compact size and cost optimization for space-constrained devices. This is backed by Forlinx's industrial-grade quality and a guaranteed annual production capacity of one million SoM units.