Forlinx UP5 Standardized SoM: Rockchip RK3576 & RK3588 Modules for Edge AI - Blog

News
Blog

Forlinx Embedded Launches UP5 SoM: Standardized SoM Design, Cross-Platform Compatibility, and Enhanced Performance

To address industry challenges such as frequent hardware iteration cycles, difficult platform migration, and constrained supply chain sourcing, Forlinx Embedded has officially launched the UP5 standardized System on Module (SoM). The FET3576UP5/FET3576J-UP5 and FET3588UP5/FET3588J-UP5 series are being introduced simultaneously. Designed with a compact 50×50 mm LGA package and offers a choice between two powerful processors: the Rockchip RK3576 or RK3588. It provides an excellent combination of robust AI capabilities, advanced multimedia processing, and flexible I/O options—making it a highly adaptable hardware solution for applications in industrial automation, mobile robotics, edge computing, and other critical embedded systems where reliability is essential.

What is UP5 Packaging?

UP5 is a universal SoM (System on Module) package standard defined by Forlinx Embedded.

UP'' stands for Universal Package, and the number ''5'' represents the product size of 50mm × 50mm. It features a Land Grid Array (LGA) contact interface, totaling 624 pins with a 1.25mm ball pitch.

Diagram showing the UP5 universal System on Module (SoM) package standard by Forlinx Embedded, detailing the 50x50mm compact size and Land Grid Array (LGA) contact interface with 624 pins and 1.25mm ball pitch layout.

Identical package pinout compatibility: One carrier board design supports direct replacement of different UP5 SoMs with varying host controllers, eliminating the redesign.

Based on the UP5 packaging standard, the hardware design offers reusability, a wider range of supply chain options and a compact, space-saving form factor, which significantly reduces the complexity of developing embedded devices and the risks associated with iteration, whilst making subsequent product upgrades more flexible and convenient.

Three Core Advantages of the UP5 SoM

Hardware Design Reusability

One carrier board design fits multiple UP5 SoMs with different performance levels, eliminating repeated board revisions during product iteration, which significantly saves R&D costs

Diversified Supply Chain Options

The unified package supports multiple main control platform options, enriching chip selection and effectively mitigating the risk of supply chain disruptions.

Compact and Small Form Factor

The standardized 50mm × 50mm size optimizes both space and cost while ensuring full performance and comprehensive interfaces, making it ideal for space‑constrained devices.

Visual representation of the UP5 SoM's compact 50x50mm form factor, highlighting its space-saving design and comprehensive interface capabilities for space-constrained embedded devices.

Dual‑Core Launch: Covering Different Performance Tiers

FET3576UP5 / FET3576J‑UP5｜High‑Efficiency AIoT Performer

Powered by Rockchip RK3576 processor with an 8‑core ARM architecture (max. frequency up to 2.2GHz).
6 TOPS NPU computing power for strong support in AI vision recognition and edge algorithm inference.
Built-in Firewall‑based hardware resource isolation for hardware-level security partitioning, significantly enhancing device system security.
Triple‑display independent output and H.264/H.265 encoding/decoding, capable of decoding up to 8K video.
Equipped with the new FlexBus parallel bus interface for high‑speed peripheral expansion, greatly enhancing extensibility.

Product image of the FET3576UP5 and FET3576J-UP5 System on Module, illustrating a high-efficiency AIoT performer equipped with the Rockchip RK3576 processor, 6 TOPS NPU, and hardware-level security isolation.

FET3588UP5 / FET3588J‑UP5｜Flagship Multi‑Tasking & Multimedia Platform

Powered by Rockchip RK3588 flagship SoC (advanced 8nm process), with NPU computing power up to 6 TOPS, delivering strong edge‑side AI processing capabilities.
8‑core CPU (4×Cortex‑A76 + 4×Cortex‑A55) for effortless multitasking.
Triple‑core NPU supporting mixed computing, compatible with RKNN Toolkit2 toolchain for easier AI development.
8K display + 8K hardware encoding/decoding, supporting quad‑display independent output, ideal for multi‑screen scenarios.
New‑generation 48‑megapixel ISP significantly improves imaging quality.
Rich interface resources: PCIe, SATA, multi‑channel USB, Gigabit Ethernet, meeting high‑speed storage and peripheral expansion needs.

Product image of the FET3588UP5 and FET3588J-UP5 System on Module, demonstrating the flagship platform powered by the Rockchip RK3588 SoC with advanced 8nm process, up to 6 TOPS NPU, and rich PCIe/SATA interface resources.

Note: The two SoMs share identical hardware pinouts, meaning a single carrier board can directly accommodate either RK3576‑ or RK3588‑based modules, enabling flexible upgrades from mainstream to flagship performance—all without carrier board redesign. This streamlines R&D cycles and accelerates time‑to‑market.

Broad Industry Application Scenarios

The UP5 SoM series, with its strengths in computing power, multimedia, interfaces, and security, is widely applicable across various smart projects, including:

Industrial smart devices, edge AI computing, smart NVRs, AGV robots, large smart displays, intelligent terminals, HD vision devices, IoT gateways, and many other AIoT scenarios.

Infographic illustrating the broad industry application scenarios for the UP5 SoM series, including industrial smart devices, edge AI computing, smart NVRs, AGV robots, and other AIoT ecosystems.