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公司动态
- Advance Hand in Hand | Forlinx Authorized as NXP Gold Partner 2021-01-07
- Forlinx Embedded Visits TI US Headquarter to Deepen Communication and Cooperation 2023-05-24
- First Day At Embedded World 2023 2023-03-15
- Forlinx Will Attend Embedded World 2023 2023-03-01
- Video Demo: Rockchip RK3588 Based System on Module And Matched Carrier Board 2023-01-05
- World Debut! FET-MX9352-C System on Modules was Launched 2023-01-03
行业动态
- Forlinx AM62x SoM Can Meet the Latest HMI Requirements 2023-05-25
- How to Configure NXP i.MX9352's GPIO? 2023-05-23
- Application Plan of Pressure Displacement Analyzer Based on i.MX8MM 2023-05-18
- NXP iMX8MP - Start, Programming and Simulation of M-core for Multi-core Heterogeneous Processor 2023-05-16
- M Core SPI Master-Slave Mode Communication of i.MX8M Plus Evaluation Kit 2023-05-09
- Introduction to OTA Upgrade Process of OK3568-C Development Board 2023-05-05