FET3576J-UP5 System on Module
CPU: Rockchip RK3576
Architecture: 4x Cortex-A72 + 4x Cortex-A53
Frequency: [email protected][email protected]
RAM: 8GB LPDDR4，2GB/4GB LPDDR4
ROM: 16GB eMMC，32GB/64GB eMMC
System: Android14，ForlinxDesktop 24.04，Linux 6.1
FET3576J-UP5 SoM | Rockchip RK3576 Industrial LGA System on Module
The FET3576J-UP5 is an industrial-grade System on Module/Computer on Module powered by the high-efficiency Rockchip RK3576 processor. Combining an octa-core compute engine with an integrated 6 TOPS NPU in a standardized 50mm × 50mm UP5 LGA package, it delivers high performance, low power consumption, and hardware-level security isolation for mission-critical AIoT, industrial control , and smart vision applications.
Highlights:
- Efficient Octa-Core Architecture: 4x Cortex-A72 @2.2GHz + 4x Cortex-A53 @2.0GHz, delivering balanced processing performance with optimized energy efficiency.
- 6 TOPS Dedicated Edge AI: Integrated tri-core NPU with 6 TOPS INT8 computing power, supporting mainstream deep learning frameworks for on-device AI inference.
- Advanced Multi-Screen Display: Supports tri-screen independent display, high-definition video encoding/decoding, and AI-powered intelligent image restoration.
- High-Bandwidth FlexBus Interface: Equipped with high-speed FlexBus parallel bus along with rich industrial I/O for flexible peripheral access and seamless data exchange.
- Hardware Firewall Security & Isolation: Built-in Firewall hardware resource isolation mechanism ensures safe, non-interfering operation between multi-domain application tasks.
- True Industrial Reliability & Long-Term Supply: Rigorously tested for harsh industrial operating environments, supporting multiple OS (Linux, Android) with guaranteed 10–15 years lifecycle availability.
FET3576-UP5 / FET3576J-UP5 SoM
FET3576J-UP5 SoM is equipped with the Rockchip RK3576 processor (4×A72 + 4×A53),
integrating a 6 TOPS NPU that delivers both high performance and low power consumption, providing strong support for AIoT and industrial applications.
The product has undergone rigorous testing in harsh industrial environments, ensuring exceptional stability, and offers long-term supply support of 10–15 years.
What is UP5 Packaging?
UP5 is a System on Module (SoM) packaging standard defined by Forlinx Embedded. "UP" stands for "Universal Package," while "5" indicates the ultra-compact board size of 50mm × 50mm.
This series employs a Land Grid Array (LGA) interface with a total of 624 pins. The LGA solder ball pitch measures 1.25mm, and each solder ball diameter is 0.8mm.
SoM UP5 Advantages
The UP5 series establishes an open standard for SoM hardware compatibility and interchangeability. By defining unified physical dimensions, soldering packages, and pin layouts, it minimizes R&D difficulty and risk.
Hardware Design Reusability: A single carrier board design can adapt to multiple SoM platforms across various performance tiers.
Supply Chain Flexibility: SoMs can utilize chips from multiple silicon vendors, effectively mitigating component supply risks.
Compact Size: The UP5 series balances size, thermal performance, and cost while maintaining pin standardization.
Wide Range of UP5 SoM Options
Forlinx Embedded currently offers UP5 products based on Rockchip RK3576 and RK3576 processors,
with additional UP5 family products continuously launching to support multi-tier platform scaling.
Boost Your AI Apps with 6TOPS Computing Power NPU
6TOPS super-computing power NPU, support INT4/INT8/INT16/FP16/BF16/TF32 operation, support dual-core work together or work independently,
support multi-task, multi-scenario parallel, support deep learning frameworks: TensorFlow, Caffe, Tflite, Pytorch, Onnx NN, Android NN, etc.
New Parallel Bus Interface for FlexBus
FlexBus: Flexible parallel bus interface, capable of emulating irregular or standard protocols, supporting 2/4/8/16-bit data parallel transmission, with a clock speed of up to 100MHz.
It also features a rich array of bus transfer interfaces including DSMC, CAN-FD, PCIe 2.1, SATA 3.0, USB 3.2, SAI, I2C, I3C, UART, and more.
Firewall Enables True Isolation of Hardware Resource
RK3576 supports Firewall functionality, used to manage access permissions from the main device to peripheral devices and memory areas, achieving true hardware resource isolation.
This feature not only enhances system stability and security but also provides robust support for a variety of application scenarios.
Multiple Operating Systems Support
Forlinx Embedded customizes Android, Linux, and Forlinx Desktop operating systems for RK3576 development platforms.
Comprehensive multi-layer industrial testing guarantees 24/7 stable operation, accommodating diverse application workflows.
Wide Range of Application Scenarios
Supercharge your innovations with the versatile FET3576-C SoM! From industrial, AIoT, edge computing, smart mobile terminals, and various other digital multimedia-related fields.
With Forlinx's robust technical support services, accelerate your product's time-to-market and seize the lead in your industry.
Mechanical Dimensions
Equipped with the Rockchip RK3576/RK3576J industrial processor, the module adopts an LCC+LGA package (624 pins) that routes out all functional signals within a compact 50mm × 50mm size.
It enables flexible heat dissipation design and reduces structural enclosure volume for space-constrained installations.
Forlinx UP5 Standard
What is UP5? A Compatible and Compact Package
▊ Hardware Features
| Hardware Parameters of FET3576-UP5 | ||
|---|---|---|
| Processor | Rockchip RK3576 / RK3576J | |
| ARM: 4×Cortex-A72 + 4×Cortex-A53 | ||
| NPU | 6TOPS INT8, supports INT4/INT8/INT16/FP16/BF16/TF32 | |
| GPU | ARM Mali-G52 MC3, supports OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1 | |
| VPU |
Hardware Decoding: • H.264, H.265, VP9, AV1, AVS2, 8K@30fps or 4K@120fps |
|
|
Hardware Encoding: • H.264, H265, 4K@60fps |
||
| RAM | 2GB/4GB/8GB LPDDR4 | |
| ROM | 16GB/32GB/64GB eMMC | |
| Working Voltage | DC 5V-13V | |
| Operating Temperature |
FET3576-UP5 SoM: 0℃~+70℃ FET3576J-UP5 SoM: -40℃~+85℃ |
|
| Net Weight | 14.4g | |
| Connection | LGA (624 pins; the ball pitch of the LGA is 1.25 mm, and the diameter of a single ball is 0.8 mm) | |
| OS | Linux 84, Forlinx Desktop 24.04 (based on Ubuntu 24.04 file system), Android 14 | |
| Flashing method |
|
|
| SoM Function Parameters of FET3576-UP5 | ||||
|---|---|---|---|---|
| Function | Maximum Number | Parameter | Number of interfaces defined by UP5 | Parameter |
| MIPI CSI | 5 |
Supports 5 CSI-2 Interfaces: Four of these interfaces each have 2 D-PHY v1.2 data lanes, with 2.5 Gbps per lane; These four interfaces can be combined into two interfaces, each with 4 data lanes; The fifth interface supports either 4 D-PHY data lanes or 3 C-PHY trios; D-PHY v2.0 lane speed: 4.5 Gbps; C-PHY v1.1 trio speed: 2.4 Gsps. |
4 |
Supports 4 CSI-2 Interfaces Three of these interfaces each have 2 D-PHY v1.2 data lanes, with 2.5 Gbps per lane; The fourth interface supports either 4 D-PHY data lanes or 3 C- PHY trios; D-PHY v2.0 lane speed: 4.5 Gbps; C-PHY v1.1 trio speed: 2.4 Gsps. |
| DVP | 1 | Standard DVP interface (8/10/12/16-bit, up to 150 Mhz); Supports BT.601, BT.656, and BT.1120 VI interfaces | \ | |
| HDMI/eDP TX | 1 |
Supports 1 HDMI / eDP TX combined interface HDMI Interface HDMI v2.1 Supports up to 4K@120 Hz Data formats: RGB/YUV444/YUV422/YUV420 8/10-bit Supports CEC and ARC HDCP v2.3 and HDCP v1.4 eDP Interface eDP v1.3 Main link includes 4 physical lanes Supports up to 4K@60 Hz HDCP v1.3 |
1 |
Supports 1 HDMI_TX interface. HDMI Interface HDMI v2.1 Supports up to 4K@120 Hz Data formats: RGB/YUV444/YUV422/YUV420 8/10-bit Supports CEC and ARC HDCP v2.3 and HDCP v1.4 |
| DP&USB 3.2Gen1 OTG | 1 |
Supports 1 USB / DP combined interface. USB Interface USB 3.2 Gen1x1 Dual-Role Device (DRD) DisplayPort TX Interface DisplayPort v1.4 Supports 1/2/4 lanes with lane speeds of 1.62, 2.7, 5.4, and 8.1 Gbps Supports up to 4K@120 Hz Data formats: RGB/YUV444/YUV422/YUV420 8/10-bit Supports Multi-Stream Transport (MST) with 3 displays Supports DP Altmode on USB Type-C Supports HDCP v2.3 and HDCP v1.3 |
\ |
Supports 1 USB / DP combined interface. USB Interface USB 3.2 Gen1x1 Dual-Role Device (DRD) DisplayPort TX Interface DisplayPort v1.4 Supports 1/2/4 lanes with lane speeds of 1.62, 2.7, 5.4, and 8.1 Gbps Supports up to 4K@120 Hz Data formats: RGB/YUV444/YUV422/YUV420 8/10-bit Supports Multi-Stream Transport (MST) with 3 displays Supports DP Altmode on USB Type-C Supports HDCP v2.3 and HDCP v1.3 |
| MIPI DSI | 1 |
Supports 1 MIPI DSI-2 TX interface. D-PHY v2.0 or C-PHY v1.1 4 data lanes on D-PHY 3 data trios on C-PHY Supports up to 2560 × 1600@60 Hz Data format: RGB (up to 10-bit) |
1 |
Supports 1 MIPI DSI-2 TX interface. D-PHY v2.0 or C-PHY v1.1 4 data lanes on D-PHY 3 data trios on C-PHY Supports up to 2560 × 1600@60 Hz Data format: RGB (up to 10-bit) |
| Parallel | 1 |
Supports 1 parallel output interface. Supports RGB/BT.656/BT1120 Supports up to 1920 × 1080@60 Hz Data format: RGB (up to 10-bit) |
\ | |
| EBC | 1 |
Supports 1 EBC output interface. Supports E-ink EPD (Electronic Paper Display) Supports 2560 × 1920 hardware decoding Data bus width: 16-bit Supports up to 32-level gray scale Supports Direct mode, LUT mode, 3-window mode Supports window display mode |
\ | |
| SAI | ≤5 |
Supports 5 SAI interfaces. SAI 0/1 supports 4 TX lanes and 4 RX lanes. SAI 2/3/4 supports 1 TX lane and 1 RX lane. Supports I2S/TDM/PCM mode Maximum sample rate: 192 kHz Audio resolution: 16 to 32 bits |
1 |
Supports 1 SAI interface. SAI 2 supports 1 TX lane and 1 RX lane. Supports I2S/TDM/PCM mode Maximum sample rate: 192 kHz Audio resolution: 16 to 32 bits |
| SPDIF TX | ≤2 | · Supports 2 x SPDIF TX ports; | \ | |
| SPDIF RX | ≤2 | · Supports 2 x SPDIF RX ports; | \ | |
| PDM | ≤2 |
Up to 8 channels, audio resolution: 16-bit to 24-bit, sample rate up to 192 kHz; Supports PDM master receive mode |
\ | |
| Ethernet | ≤2 |
2 × GMAC with RGMII / RMII interfaces; Supports Data rates: 10/100/1000 Mbps |
2 |
2 × GMAC with RGMII / RMII interfaces; Supports Data rates: 10/100/1000 Mbps |
| Combo high speed interface | 2 |
Supports 1 x PCIe2.1/SATA3.1 interface with one data lane; Supports 1 x PCIe2.1/SATA3.1/USB3.2 Gen1x1 interface with one data lane |
2 | Supports 1 x PCIe2.1/SATA3.1 interface with one data lane |
| USB 2.0 OTG | 2 | · 2 x USB2.0 OTG | \ | |
| SDIO | ≤2 | ·SDIO v3.0, 4-bit data bus widths | 2 | ·SDIO v3.0, 4-bit data bus widths |
| SPI | ≤5 | Supports two chip-select in each interface; Supports serial-master and serial-slave mode | 2 | Supports two chip-select in each interface; Supports serial-master and serial-slave mode |
| I2C | ≤9 |
Supports 7-bit and 10-bit address modes; Data transmission rate of 100K bits/s in standard mode and 400k bits/s in fast mode. |
4 |
Supports 7-bit and 10-bit address modes; Data transmission rate of 100K bits/s in standard mode and 400k bits/s in fast mode. |
| I3C | ≤2 | ·Supports 2 x I3C master ports | \ | |
| UART | ≤12 |
Built-in 2 × 64-bit FIFO (separate TX/RX) Supports 5-, 6-, 7-, 8-bit serial data transmission Baud rate up to 4 Mbps 12 × UART all support auto-flow-control (AFC) mode 12 × UART all support RS-485 mode |
4 | Both UART support automatic flow control mode and RS485 mode. |
| CAN | ≤2 |
Compliant with CAN & CAN FD specifications; Supports standard & extended frame transmission 8192-bit receive FIFO; |
2 |
Compliant with CAN & CAN FD specifications; Supports standard & extended frame transmission 8192-bit receive FIFO; |
| DSMC | ≤1 |
·Supports up to select 4 chips ·Supports 8-wire and 16- wire serial transfer mode ·Supports configurable serial address width:16 bits or 32 bits |
\ | |
| FlexBus | ≤1 |
·Supports built-in DMA and ping- pong operation for allocating two address ·Supports transmission and receiving mode ·Supports single mode and continuous mode |
\ | |
| PWM | ≤16 | Supports up to 16 on-chip PWM with interrupt-based operation and capture mode; | 2 | Supports up to 2 on-chip PWM with interrupt-based operation and capture mode; |
| ADC | ≤8 | · Supports 8 x 12bit single-ended input SAR-ADC with sampling rate up to 1MS/s; | 4 | · Supports 4 x 12bit single-ended input SAR-ADC with sampling rate up to 1MS/s; |
| GPIO | n |
All GPIOs can be used to generate interrupts; Supports level-triggered and edge- triggered interrupts; Supports configuration of level- triggered polarity; Supports rising-edge, falling-edge and dual-edge interrupts; Supports configuration of pull- up/pull-down (weak pull-up and weak pull-down); Supports configuration of drive capability Configurable drive strength. |
16 |
All GPIOs can be used to generate interrupts; Supports level-triggered and edge- triggered interrupts; Supports configuration of level- triggered polarity; Supports rising-edge, falling-edge and dual-edge interrupts; Supports configuration of pull- up/pull-down (weak pull-up and weak pull-down); Supports configuration of drive capability Configurable drive strength. |
Note*: The maximum number of parameters in the table is the theoretical value of hardware design or CPU; The number of interface resources defined by UP5 in the table is the maximum number supported by the UP5 universal package.
▊ RK3576 UP5 Carrier Board
Build Faster with OK3576J-UP5 Development Board
Skip the complexity of hardware design with the OK3576J-UP5 development board. This production-ready platform combines a proven SoM + Carrier architecture, allowing you to bypass low-level circuitry and focus entirely on your application software. Seamlessly transition from initial concept to mass production with minimal risk, rich connectivity, and comprehensive multi-OS support.
▊ Accessories
Please click here to get more information about the supported modules and accessories.
▊ Documentation
Reference Manuals
Hardware Related
Product Datasheet
User Guide
Carrier Board Schematic
Carrier Board PCB
SoM Pinmux
Software & BSP
OS Image
Testing Demo
Source Code
Manual
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▊ Forlinx Recommended Products
Architecture: 4x Cortex-A76+4x Cortex-A55
Frequency: [email protected]/1.6GHz, [email protected]/1.3GHz
RAM: 4GB/8GB/16GB/32GB LPDDR4
ROM: 32GB/64GB/128GB eMMC
Architecture: 4x Cortex-A72 + 4x Cortex-A53
Frequency: [email protected][email protected]
RAM: 8GB LPDDR4，2GB/4GB LPDDR4
ROM: 16GB eMMC，32GB/64GB eMMC
