Forlinx Embedded Product Catalog
Explore High-Performance SoMs, Development Boards, and Embedded Computers
Premium Partners: NXP, Rockchip, TI, Allwinner
Industrial Grade Design
10-15 Years Longevity
AI Accelerator
FAI-ARA240-M AI Acceleration Card
NXP Ara240-powered 40 eTOPS M.2 Edge AI accelerator for real-time generative AI and industrial inference.
Ara240 AI Acceleration Card
FAI-ARA240-M AI Acceleration Bundle
Ara240 AI Acceleration Card Parameters
Category
Key Item
Technical Specifications
Core USPs & Advantages
Core Performance
AI Performance
Up to 40 eTOPS (Equivalent TOPS)
Top-tier computing power, easily handling complex industrial AI inference tasks.
Processor & Memory
Architecture
NXP Ara240 | 8GB / 16GB LPDDR4
Global simultaneous launch; high-capacity memory options support complex model loading.
Model Compatibility
AI Architectures
CNN, Transformer, LLM, MMLM, VLM, VLA
Full support for Generative AI (GenAI), breaking through traditional vision limitations.
Interface
Hardware Form Factor
M.2 2280 (M-Key) | PCIe Gen4 x4 & USB 3.2 Gen1
Standard size, plug-and-play; compatible with multiple high-speed protocols to lower integration costs.
Software Development
Frameworks & Compiler
TensorFlow, PyTorch, ONNX | INT4, INT8, MSFP16
Includes robust tools and development examples to balance performance, storage, and accuracy.
Security
System Security
Secure Boot & Root-of-Trust
Industrial-grade security foundation ensures end-to-end data integrity at the edge.
Reliability
Thermal & Testing
Industrial Thermal Architecture & Rigorous Simulation
Optimized for 24/7 stable operation in demanding high-temperature industrial environments.
Ecosystem
Supported Platforms
Linux/Windows (Supports i.MX8MP, i.MX95, etc.)
NXP Gold Partner assurance with continuously updated documentation and expert support.
Application Areas
Industrial Control: Industrial Multimodal Sensing, Real-time Visual Processing;
Smart Transportation: Roadside Edge Computing, Complex Traffic Flow Analysis;
Smart Healthcare: AI-assisted Medical Imaging, Real-time Monitoring;
Energy and Power: Equipment Status Inspection, New Energy Smart O&M.
RK1820/RK1828 M.2 Computing Card
Rockchip RK1820/RK1828-powered 20 TOPS (INT8) M.2 Edge AI accelerator featuring 3D stacked DRAM for offline 3B-7B LLM/VLM inference.
RK1820/RK1828 M.2 Computing Card
RK182x Edge AI Acceleration Bundle
RK1820/RK1828 M.2 Computing Card Parameters
Category
Key Item
Technical Specifications
Core USPs & Advantages
Core Performance
AI Performance
20 TOPS (INT8)
Robust computing power, smoothly supports offline inference of 3B-7B level large models.
Processor & Memory
Architecture & RAM
Rockchip RK1820 / RK1828 | 2.5GB / 5GB 3D Stacked DRAM
In-package DRAM eliminates external DDR dependency, overcoming "memory and bandwidth walls" with hundreds of GB/s bandwidth.
Model Compatibility
AI Architectures
LLM, VLM, CNN, Audio Models, Object Detection
Runs 3B/7B models (e.g., Qwen, LLaMA2) independently offline, achieving 100+ tokens/s for low-latency AI.
Interface
Hardware Form Factor
M.2 2280 (M-Key) | PCIe 2.1 1-Lane
Standard plug-and-play package; flexible expansion requiring minimal bandwidth to fully unleash AI power.
Software Development
Frameworks & Tools
RKNN, TensorFlow, PyTorch, ONNX | INT4, INT8, FP16
Developer-friendly ecosystem with comprehensive RKNN SDK for rapid conversion and seamless model migration.
System Architecture
Decoupled Design
Dedicated AI Co-Processor
Handles only AI inference, eliminating competition for host CPU and memory resources to ensure maximum system stability.
Efficiency
Power & Cost
Low Power Consumption Architecture
Comparable to Jetson Orin Nano, offering lower power consumption and better cost-effectiveness for edge scenarios.
Ecosystem
Supported Platforms
Linux / Android (Supports RK3588, RK3576, RK3568, RK3572)
Highly adaptable to mainstream host controllers for simplified, quick integration without complex modifications.
Application Areas
Industrial IoT: Industrial Inspection, Automated Object Recognition;
Smart Transportation: Traffic Recognition, Real-time Edge Monitoring;
Smart Healthcare: Medical Terminals, Multimodal Perception;
Energy and Power: Smart Power Grids, New Energy Operations and Maintenance.
Edge AI Box
FCU3101 Edge AI Computing Box
Reliable Edge Computing: Wide-Temperature, Dual Ethernet, and Rich I/O
Edge AI Computing Box Parameters
Item
Parameter
Item
Parameter
Processor
Rockchip RV1126B / RV1126BJ,
4× Cortex-A53 @ 1.6GHz
RAM
2GB / 4GB
ROM
16GB / 64GB
OS
Linux
Ethernet
2 x (1 x 10/100/1000Mbps, 1 x 10/100Mbps)
4G Cellular
1 x (Supports optional 4G Cat1 module)
SIM Slot
1 x (Push-push Nano SIM slot)
Wi-Fi & Bluetooth
1 x (Supports Wi-Fi 4, BT 4.2)
RS485
2 x (115200bps, default no 120Ω termination resistor;
selectable via internal DIP switch)
RS232
2 x (115200bps)
DI
2 x (Dry contact input)
DO
2 x (Contact capacity: 5A 30VDC, Normally Open)
USB
2 x (1 x USB 3.0 Host, 1 x USB 2.0 Host)
TF Card Slot
1 x (Supports up to 128GB)
HDMI
1 x (Max resolution 1920x1080)
Audio Output
1 x (3.5mm AUX analog audio output)
Debug Port
1 x Type-C (Connects to PC via Type-C cable for debugging)
Reset Button
1 x (Supports one-key network parameter recovery;
function is customizable)
Programmable Light Bar
1 x (Default blue flowing LED effect; customizable lighting logic)
Buzzer
1 x (Built-in)
RTC
1 x (Internal battery-powered, maintains time during power loss)
Hardware Watchdog
1 x (Supports hardware reset)
Power Supply
DC 24V (Supports 9V~36V wide voltage input);
Features reverse polarity and overcurrent protection
EMC Protection
Level 3
Operating Temperature
Industrial Grade: -40℃ ~ +85℃;
Extended Commercial Grade: -20℃ ~ +85℃
Cooling
Passive cooling, fanless
Dimensions
202mm × 123mm × 42mm
Weight
0.8kg
Installation
Desktop, Wall-mounting brackets (Screw spec: M3)
Test Reports
High/Low Temperature, Cold/Hot Start, and EMC test reports
Third-Party Certifications
CE, FCC, RoHS
(Certification reports expected in Q4 2026)
Product Overview
Powered by Rockchip RV1126B / RV1126BJ processor, designed for efficient edge AI and IoT applications;
Industrial - grade fanless design, supporting -40℃ to +85℃ wide temperature operation and 9V~36V wide voltage input;
Rich communication interfaces including Dual Ethernet, RS485, RS232, DI/DO, and optional 4G Cat1 / Wi-Fi support;
Built - in hardware watchdog, RTC, and programmable LED light bar for highly reliable deployment in complex environments.
FCU3011 Edge AI Computing Box with 5G Support
4G/5G network communication and enable "5G + AI"
Edge AI Computing Box Parameters
Item
Parameter
Item
Parameter
CPU
nVIDIA Jetson Orin Nano
RAM
4GB / 8GB
ROM
128GB NVMe SSD
OS
Forlinx Desktop 22.04
AI Computing Power 4GB
20TOPS, 512 NVIDIA® Ampere cores,
16 Tensor cores
AI Computing Power 8GB
40TOPS,1024 NVIDIA® Ampere cores,32 Tensor cores
Debug
Graphical configuration
SSH
Network port
Hard Disk
1 x M.2 NVMe SSD hard drive bay inside the case,
with a default 128GB SSD at the factory
Ethernet
4 x 10M/100M/1000M self-adaptive, ESD3
RS485
1 x, 1.5kV isolation protection
CAN
1 x CAN2.0B, 1.5kV isolation protection
DI
2 x, 1.5kV isolation protection
DO
2 x, electromagnetic relay isolation;
Contact capacity: 5A 30VDC / 5A 250VAC
USB
2 x USB3.0, 2 x USB2.0 (standard USB Type - A sockets);
1 x OTG (for system flashing), all with ESD3 protection
4G/5G
Either 5G or 4G function
Wi-Fi
Dual - band 2.4G/5G,
supports AP and STA modes
Watchdog
Support
RTC
Support
Button
1 x RECOVERY button
LED
1 x SYS indicator,
1 x POW indicator
HDMI Output
1 x HDMI 2.0, supports up to 4K display
Mechanical Dimensions
170mm × 110mm × 55mm
Installation Method
Ear - hanging installation
Power Supply
DC24V5A
Working Environment
Humidity: 5% - 95%, no condensation;
Working temperature: 0℃ - 70℃;
Storage temperature: - 20℃ - 125℃.
Power Consumption
13.8W~21.9W
Heat Dissipation Method
Passive heat dissipation, fan - less.
Product Overview
High - performance AI edge computing terminal, supporting 5G and multi - interface expansion;
Reserves multiple peripheral interfaces for AI computing in embedded and edge systems;
Industrial - grade fanless design, suitable for deployment in complex environments;
Supports high - definition video encoding/decoding and edge AI inference.
FCU3501 AI Edge Computing Terminal
8K video simultaneous editing and decoding: decode up to 8K @ 60fps
AI Edge Computing Terminal Parameters
Item
Parameter Description
Item
Parameter Description
Main ControL
4 × Cortex-A76 + 4×Cortex-A55, Rockchip RK3588J
RAM
8GB/16GB
ROM
64GB / 128GB eMMC
OS
Forlink Desktop 22.04
AI Computing Power
RK3588J: 6TOPS
Extended Computing Power
Optional Hallo - 8 Computing Card: 26TOPS
Debug
1 x RS232, RJ45 Interface
SSH
Network port
TF Card
1 x TF card slot
Hard Disk
1 x M.2 SSD hard disk bay at the bottom
Ethernet
2 x 10/100/1000M self-adaptive
RS485
2 x, EMC 3
RS232
4 x, EMC 3
DI
2 x, dry contact input
DO
2 x, isolated by electromagnetic relays
USB
2 × USB3.0 + 2×USB2.0(standard USB Type - A sockets)
4G/5G
Either 5G or 4G
Wi-Fi
2.4G, supports AP/STA modes
Watchdog
Support
RTC
Support
Button
RECOVERY / BOOT / RESET / PWR
LED
RUN indicator x1, POW indicator× 1
HDMI Output
1 x, up to 8K
HDMI Input
1 x, up to 4K
Audio
1 x earphone/speaker
Dimensions
232.5mm × 140.5mm × 56.5mm
Installation Method
Ear - hanging installation
Power Supply
DC24V, wide - voltage DC 9~36V
Working Environment
Humidity 5% - 95% Non - Condensing;
Temperature - 40℃ - +85℃; Storage - 40℃~+85℃
Heat Dissipation Method
Passive heat dissipation, fan - less
Product Overview
The FCU3501 embedded control unit features a fanless design that utilizes passive heat dissipation. It has successfully passed rigorous environmental and electromagnetic compatibility (EMC) tests, ensuring stable long-term operation. This unit is ideal for edge-side AI computing applications in various industries, including intelligent transportation, smart factories, and smart buildings.
NXP System on Module
FET-MX9596-C SoM
FET-MX9596-C
OK-MX9596-C
SoM Parameter
Item
Parameter
Item
Parameter
CPU
NXP i.MX9596
NPU
2 TOPS
Architecture
6 × Cortex-A55 + 1 × Cortex-M7 + 1 × Cortex-M33
VPU
H.264/H.265 decoding and encoding, up to 4K@30fps
Clock
1.8GHz + 800MHz + 333MHz
JTAG
1 x, supporting 4-pin JTAG debugging interface
RAM
8GB LPDDR4X
UART
≤ 8 x, up to 5 Mbps
ROM
64GB eMMC
SPI
≤ 8 x, supporting master-slave mode
OS
Linux
XSPI
≤ 1 x, supporting 2 x SPI Flash
Working Voltage
12V
CAN-FD
≤ 5 x, supporting ISO11898-1, CAN 2.0B
Operating Temperature
−40℃ ~ +85℃
SD Card
≤ 1 x(SD 3.0)
Connection
Board to board connector (40 × 80pin,0.5mm spacing)
SDIO
≤ 1 x(SDIO 3.0)
Mechanical dimensions
50mm × 68mm
USB 3.0
1 x, Host/Device
GPU
Mali-G310, supporting OpenGL ES 3.2, Vulkan 1.2, OpenCL 3.0
USB 2.0
1 x, Host/Device
PCIe
2 x, PCIe Gen3
LVDS
Up to 1080P@60Hz, 2×4-lane or 1 × 8-lane
MIPI-DSI
1 x, 350MHz 4-lane
PDM
≤ 1
IIC
≤ 7
PWM
≤ 6
SPDIF
≤ 1
Application Areas
Industrial Automation
Medical Electronics
Power Inspection
Smart Cockpit
Environmental Monitoring
IoT Terminal
FET-MX8MPQ-SMARC SoM
FET-MX8MPQ-SMARC
OK-MX8MPQ-SMARC
SoM Parameter
Item
Parameter
Item
Parameter
CPU
NXP i.MX8MPQ
NPU
2.3 TOPS
Architecture
4 × Cortex-A53 + Cortex-M7
Clock
1.6GHz + 800MHz
RAM
2GB / 4GB LPDDR4
ROM
16GB / 32GB eMMC
OS
Linux 6.1
Working Voltage
5V
Operating Temp.
-40℃ ~ +85℃
Mechanical Size
50mm × 80mm
Connection
SMARC 2.1
PCIe
1 x, PCIe Gen3
Ethernet
2 x Gigabit (1x TSN)
HDMI
1 x, 4K@30
LVDS
2 x, up to 1920×1080p60
MIPI-DSI
1 x
MIPI CSI
≤ 2
USB 3.0
≤ 2
USB 2.0
≤ 5
CAN-FD
≤ 2
UART
4 x, up to 4 Mbps
SDIO
1 x (SDIO 3.0)
I2C (IIC)
≤ 5
I2S (IIS)
≤ 2
SPI
≤ 2
PWM
≤ 3
VPU
H.264/H.265/VP9/VP8 decoding 1080p@60fps;
H.264/H.265 encoding 1080p@60fps
Application Areas
5G Gateway
High Definition Video Processing
Industrial Internet
Smart Home
Medical Equipment
Smart Transportation
FET-MX9352-C SoM
FET-MX9352-C
OK-MX9352-C
SoM Parameter
Item
Specification
Item
Specification
CPU
NXP i.MX 9352
NPU
0.5 TOPS
Architecture
2x Cortex-A55 + Cortex-M33
UART
Up to 8x
Frequency
1.7 GHz
CAN-FD
Up to 2x
RAM
1GB LPDDR4
USB
Up to 2x
ROM
8GB eMMC
SDIO
Up to 1x
OS Support
Linux 5.15.52
SPDIF
Native capture mode
Input Voltage
5V
PDM
24-bit (Linear phase response)
Operating Temp.
-40°C to +85°C
SPI
Up to 8x (Master/Slave mode)
Interconnect
2x 100-pin B2B (0.4mm pitch)
I2C
Up to 8x (Standard/Fast/Ultra-fast)
Dimensions
33mm x 48mm
ADC
Up to 4-ch (1x 12-bit, 1MS/s)
LCD Interface
24-bit RGB (Up to 1366x768p60 / 1280x800p60)
JTAG
1x (Cortex-M33 debug)
LVDS
1x 4-lane (Up to 1366x768p60 / 1280x800p60)
MIPI DSI
1x 4-lane (v1.2 / D-PHY v1.2), 200 MHz max pixel clock
Ethernet
2x RGMII (10/100/1000 Mbps, 1x TSN support)
Application Areas
Edge Machine Learning Application Acceleration
Automotive Electronics, Industrial Edge Gateway
Smart Healthcare, Power Energy, Industrial Automation
Security and Communication
FET-MX8MP-C SoM
FET-MX8MP-C
OK-MX8MP-C
SoM Parameter
Item
Specification
Item
Specification
CPU
NXP i.MX8M Plus
Ethernet
2x RGMII (1x TSN supported)
Architecture
4x Cortex-A53 + Cortex-M7
UART
Up to 4x
Frequency
1.6 GHz
CAN-FD
Up to 2x
RAM
1GB / 2GB / 4GB LPDDR4
USB
2x USB 3.0/2.0 Host
ROM
8GB / 16GB eMMC
PCIe
1x PCIe Gen3
OS Support
Linux 5.4.70 / Android 11
SDIO
1x
Input Voltage
5V
SPI
Up to 3x (Configurable Master/Slave)
Operating Temp.
-40°C to +85°C
I2C
Up to 5x (Up to 400Kbps)
Interconnect
4x 80-pin B2B connectors (0.5mm pitch)
PWM
Up to 4x
Dimensions
36mm x 62mm
Camera
2x MIPI-CSI (4-lane each)
NPU
2.3 TOPS
ISP
375 Mpixel/s HDR
GPU
OpenGL ES 3.1/3.0, Vulkan, OpenCL
Audio
Up to 6x SAI (I2S, AC97, TDM support)
Display
HDMI 2.0a (3840x2160@30Hz), LVDS (1920x1200@60Hz), MIPI-DSI (2560x1440);
Triple-display support: 2x 1080p60 + 1x 4kp30 (via HDMI)
Video Codec
Decode: 1080p60 HEVC/H.265, VP9, AVC/H.264
Encode: 1080p60 AVC/H.264, HEVC/H.265
Application Areas
Machine Learning and Vision
Advanced Multimedia Processing
High Reliability Industrial Automation
Smart City, Industrial Internet, Smart Healthcare, Smart Transportation
FET-MX8MM-C SoM
FETMX8MM-C
OKMX8MM-C
SoM Parameter
Item
Specification
Item
Specification
CPU
NXP i.MX8M Mini
Display
1 x 4-wire MIPI-DSI
Architecture
4×Cortex-A53 + Cortex-M4
SAI
≤ 5
Clock
≤1.8GHz
UART
≤ 4
RAM
2GB DDR4
IIC
≤ 4
ROM
8GB eMMC
eCSPI
≤ 3
OS
Linux 4.14.78 / Android 9.0
FlexSPI
1 x
Working Voltage
5V
Camera
1 x 4-wire MIPI-CSI
Operating Temperature
0℃~+70℃ / -40℃~+85℃
SD/SDIO
≤ 2
Connection
Board to board connector (3 x 80Pin 0.5mm spacing )
USB
2 x USB 2.0, all configured as OTG
Mechanical Dimensions
56mm x 36mm
PCIe
1 x PCIe 2.0
Power Management
BD71847AMWV-E2
PWM
≤ 4
GPU
3D: GC NanoUltra / 2D: GC320
JTAG
1 x
Video Coder
1080p60 H.265, VP9, H.264, VP8,
Hardware decoding/hard encoding
PDM
1 x
Ethernet
1 x 10/100/1000Mbps self-adaptive
Application Areas
HMI
Streaming Media Playback
Machine Learning
Industrial Control and Automation
FETMX6Q-C / FETMX6DL-C SoM
FETMX6Q-C / FETMX6DL-C
OKMX6Q-C / OKMX6DL-C
SoM Parameter
Item
Specification
Item
Specification
CPU
NXP i.MX6Quad / i.MX6Dual Lite
UART
≤ 5
Architecture
4×Cortex-A9 / 2×Cortex-A9
CAN
≤ 2
Clock
1 GHz
IIC
≤ 3
RAM
1GB DDR3(optional 2GB)
SPI
≤ 5
ROM
8GB eMMC
EIM
32-bit data bus, 27 bit address bus
OS
Android 4.4.2 / Android 6.0 / Linux3.0.35 / Linux4.1.15
Camera
1 x DVP, 1 x MIPI CSI
Working Voltage
4.2V
SD/MMC/SDIO
≤ 3
Operating Temperature
-40℃~+85℃ / 0℃~+70℃
USB
1 x USB 2.0 Host, 1 x USB 2.0 OTG
Connection
Board to board connection (4 x 80Pin, 0.5mm spacing)
SATA
1 x(only FETMX6Q-C)
Mechanical Dimensions
40mm x 70mm
PCIe
1 x
Battery Management
MMPF0100NPEP
PWM
≤ 3
GPU
Vivante GC355 / Vivante GC320
MLB
1 x Media Local Bus
Video Coder
Hardware encoding
SPDIF
1 x
Display
1 x RGB 24 bit, 2 x single 8-bit LVDS, 1x HDMI
JTAG
1 x
IIS
≤ 4
EINT/GPIO
Support
Ethernet
1 x 10/100/1000Mbps self-adaptive
Application Areas
Rich Multimedia Function, Powerful Encoding & Decoding;
Industrial Control, Medical, Multimedia, Security, Automotive, Finance, etc.
FETMX6Q-S / FETMX6DL-S SoM
FETMX6Q-S / FETMX6DL-S
OKMX6Q-S / OKMX6DL-S
SoM Parameter
Item
Specification
Item
Specification
CPU
NXP i.MX6Quad / i.MX6Dual Lite
Display
1 x RGB 24 bit, 2 x 8 bit LVDS, 1 x HDMI
Architecture
4 × Cortex-A9 / dual-core Cortex-A9
IIS
1 x
Clock
1 GHz
Ethernet
1 x 10/100/1000Mbps self-adaptive
RAM
1GB DDR3(optional 2GB)
UART
≤ 4
ROM
8GB eMMC
CAN
≤ 2
OS
Android4.4 / Android6.0 / Linux3.0.35 / Linux4.1.15
IIC
≤ 3
Working Voltage
4.2V
SPI
≤ 2
Operating Temperature
-40℃~+85℃ / 0℃~+70℃
Camera
1 x DVP
Connection
Stamp-hole(220Pin, 1mm spacing)
SD/MMC/SDIO
≤ 2
Mechanical dimensions
60mm x 60mm
USB
1 x USB 2.0 Host, 1 x USB 2.0 OTG
Battery Management
MMPF0100NPEP
SATA
1 x(Only FETMX6Q-S)
GPU
Vivante GC355 / Vivante GC320
PCIe
1 x
Video Coder
Hardware Encoding
EINT/GPIO
Support
Application Areas
Rich Multimedia Functions, Powerful Encoding and Decoding;
Industrial Control, Medical, Multimedia, Security, Automotive, Finance, etc.
FETMX6UL-C SoM
FETMX6UL-C
OKMX6UL-C
SoM Parameter
Item
Specification
Item
Specification
CPU
NXP i.MX6UltraLite
CAN
≤ 2
Architecture
Cortex-A7
IIC
≤ 4
Clock
528 MHz
SPI
≤ 4
RAM
256MB / 512MB
EIM
16-bit data bus, 16 bit address bus
ROM
256MB NandFlash /1GB /8GB eMMC
Camera
1 x DVP
OS
Linux3.14.38 / Linux4.1.15
SD/MMC/SDIO
≤ 2
Operating Temperature
-40℃~+85℃ / 0℃~+70℃
USB
2 x USB 2.0 OTG
Working Voltage
5V
PWM
8 x
Connection
Board to board connector(2 x 80Pin 0.8mm spacing)
SPDIF
1 x
Mechanical dimensions
40mm x 50mm
JTAG
1 x
Video Coder
Software encoding
EINT/GPIO
Support
Display
1 x RGB 24 bit
Keypad Port
1 x, supporting 8 × 8 matrix keyboard
IIS
≤ 3
ADC
≤ 10
Ethernet
2 x 10/100Mbps self-adaptive
QSPI
1 x
UART
8 x
ISO7816-3
≤ 2
Application Areas
SoM Version: Commercial Grade and Industrial Grade;
Vehicle, Industrial Control, Teaching, Electric Power, Communication, Finance, Smart home, Display Control Equipment, etc.
FETMX6ULL-S SoM
FETMX6ULL-S
OKMX6ULL-S
SoM Parameter
Item
Specification
Item
Specification
CPU
NXP i.MX6ULL
UART
≤8, each supports up to 5.0 Mbps
Architecture
Cortex-A7
eCSPI
≤ 4, supporting master/slave mode
Clock
800 MHz
I2C
≤4
RAM
256MB / 512MB
Camera
1 x, 8-bit DVP
ROM
256MB NandFlash / 8GB eMMC
SD/MMC/SDIO
≤2, supporting 1-bit or 4-bit transfer modes
OS
Linux4.1.15
USB
2 x, USB 2.0
Operating Temperature
-40℃~+85℃ / -25℃~+85℃
CAN
≤2, CAN 2.0B
Working Voltage
5V
Ethernet
≤2, 10/100Mbps self-adaptive
Connection
Stamp-hole
PWM
≤8, 16 bit
Mechanical Dimensions
44mm x 35mm
KeyPad Port
Supports 8 × 8 matrix keyboard
LCD
Supports up to RGB888, 1366×768@60Hz
ADC
≤10, 12-bit analog-to-digital converter (ADC)
SAI
≤3, supporting up to 3 x I2S Audio
SPDIF
1 x
Application Areas
IoT, Power, Medical Equipment, Environmental Monitoring, HMI, Smart Agriculture, Charging Piles
FETMX6ULL-C SoM
FETMX6ULL-C
OKMX6ULL-C
SoM Parameter
Item
Specification
Item
Specification
CPU
NXP i.MX6ULL
I2C
≤ 4
Architecture
Cortex-A7
SPI
≤ 4
Clock
800 MHz
CAN
≤ 2
RAM
512MB DDR3
USB
≤ 2
ROM
8GB eMMC
SD/MMC/SDIO
≤ 2
OS
Linux4.1.15
Ethernet
2 x 10/100 Mbps
Operating Temperature
-40℃~+85℃
UART/IrDA
8 x
Working Voltage
3.3V
EINT/GPIO
Support
Connection
Board to board connector (2×80pin 0.5mm spacing)
Video Coder
Software encoding
Mechanical Dimensions
29mm x 40mm
Camera
1 x 8-bit parallel interface (DVP)
LCD
RGB 24 bit, supporting up to WXGA 1366×768
PWM
8 x
Audio
≤ 3
ADC
≤ 10
eSAI
1 x
SPDIF
1 x
Keypad Port
8×8
Application Areas
Electric Power, Medical Care, Industrial Control and Automation, Smart Home, Consumer Electronics, Handheld Devices, Gateways, HMI, etc.
FET1028A-C SoM
FET1028A-C
OK1028A-C
SoM Parameter
Item
Specification
Item
Specification
CPU
NXP LS1028A
eSDHC
≤1, supporting SD3.0
Architecture
2×Cortex-A72
Ethernet
≤6, the CPU has 6 x native MAC and supports TSN.
Clock
1.5 GHz
PCIe3.0
≤ 2, the speed is up to 8GT/s
RAM
2GB DDR4
SATA3.0
≤1, the speed is up to 6Gbps
ROM
8GB eMMC
USB3.0
≤2, up to 5Gbps.
OS
Ubuntu 20.04
UART
≤4, supporting 1 x DUART or 4 x UART
Power supply
DC 12V
CAN FD
≤2
Operating Temperature
-40℃~+85℃
IIC
≤6
Connection
Board to board connector (2 x 80Pin, 0.5mm spacing )
SPI
≤2
Mechanical Dimensions
42mm x 65mm
IIS
≤6
Display Port
≤1, supporting DP1.3 and eDP1.4, up to 4Kp60
SerDes
1 x 4Lane SerDes, can be configured multiple combinations
Application Areas
Industrial Routers TSN, SD-WAN, 5G CPE, Edge Computing Gateway IP-PBX.
FET1046A-C SoM
FET1046A-C
OK1046A-C
SoM Parameter
Item
Specification
Item
Specification
CPU
NXP Layerscape LS1046A
Dimensions
84mm x 55mm
Architecture
4x Cortex-A72
RAM
2GB / 4GB DDR4
Frequency
Up to 1.8 GHz
ROM
8GB eMMC, 16MB QSPI, Nor Flash
OS Support
Ubuntu 18.04.1 / OpenWrt v18.06.0-rc2
Input Voltage
12V DC
Operating Temp.
-40°C to +75°C
Interconnect
COM Express (220-pin, 0.5mm pitch)
USB 3.0
Up to 3x (5Gbps)
UART
Up to 4x (including 1x Debug port)
I2C
Up to 2x
eSDHC
1x (SD 3.0 / eMMC 4.5 support; bootable)
JTAG
NXP CodeWarrior TAP support
Ethernet
8x Native MACs. Configurable options:
• 8x 1Gbps
• 1x 10Gbps + 7x 1Gbps
• 2x 10Gbps + 5x 1Gbps
PCIe 3.0
Up to 3x (x1/x2/x4 configurations via SerDes); Max 8GT/s per lane
SerDes
8x High-speed lanes: SATA 3.0 / SGMII / XFI / QSGMII / PCIe 3.0
SATA 3.0
1x (Configured via SerDes), up to 6Gbps
Application Areas
Smart Light Poles, Industrial Safety, Information Security, Intelligent Transportation, Energy IoT, Smart Cities, Video Control, etc.
FET1043A-C SoM
FET1043A-C
OK1043A-C
SoM Parameter
Item
Specification
Item
Specification
CPU
NXP Layerscape LS1043A
Dimensions
84mm x 55mm
Architecture
4x Cortex-A53
RAM
2GB DDR4
Frequency
Up to 1.6 GHz
ROM
8GB eMMC, 16MB QSPI, Nor Flash
OS Support
Ubuntu 18.04.1 / OpenWrt v18.06.0-rc2
Input Voltage
12V DC
Operating Temp.
-40°C to +80°C
Interconnect
COMe (220-pin, 0.5mm pitch)
USB 3.0
Up to 3x (5Gbps)
UART
Up to 4x (including 1x Debug port)
I2C
Up to 2x
eSDHC
1x (SD 3.0 / eMMC 4.5; boot/flash support)
JTAG
NXP CodeWarrior TAP support
Ethernet
7x Native MACs; Max configuration: 1x 10Gbps + 6x 1Gbps
PCIe 2.0
Up to 3x (Configured via SerDes), up to 5Gbps
SerDes
4x High-speed lanes: PCIe 2.0 / SATA 3.0 / SGMII / XFI / QSGMII
SATA 3.0
1x (Configured via SerDes), up to 6Gbps
Application Areas
Industrial Routers, Edge Computing Gateways, IP - PBX, Edge Computing, Energy IoT, Smart Cities, Industrial Automation
FET1012A-C SoM
FET1012A-C
OK1012A-C
SoM Parameter
Item
Specification
Item
Specification
CPU
NXP LS1012A
Ethernet
≤2, 10/100/1000Mbps
Architecture
Cortex-A53
PCIe2.0
≤ 1, up to 5Gbps, expandable Gigabit Ethernet or dual-band WiFi module
Clock
≤1GHz
SATA3.0
≤1, up to 6Gbps
RAM
512MB DDR3L
USB3.0
1 x, up to 5Gbps
ROM
8GB eMMC, 16MB QSPI, NorFlash
QSPI
1 x , SoM QSPI nor flash download program interface
OS
Ubuntu-18.04.1 / OpenWrt v18.06.0-rc2
SAI
≤5
Working Voltage
4.2V
UART
≤2, 1 x is debug serial port
Operating Temperature
-40℃~+80℃
IIC
≤1
Connection
Board to board connector
SDHC
1 x, supporting SD storage card
Mechanical Dimensions
45mm x 40mm
JTAG
1 x
Application Areas
NAS, IoT Gateway, Industrial Router, Industrial Automation, and Low-power Market Applications
Rockchip Series System on Modules
FET3588-C SoM
FET3588-C
OK3588-C
SoM Parameter
Item
Specification
Item
Specification
CPU
Rockchip RK3588/RK3588J
NPU
6TOPS, supporting INT4/INT8/INT16/FP16
Architecture
4 × [email protected] + 4 × [email protected]
GPU
Mali-G610 MP4, OpenGLES 1.1/2.0/3.2, OpenCL 2.2, Vulkan 1.2
RAM
4GB/8GB LPDDR4x
ROM
32GB/64GB eMMC
VPU
Dec: H.265/VP9 up to 8K@60fps, H.264 up to 8K@30fps; Enc: H.265/H.264 up to 8K@30fps
Display Out
3-ch simultaneous: RGB, LVDS, MIPI DSI, HDMI, eDP (Up to 8K@30Hz)
Camera In
2-ch MIPI DPHY V1.2 (or 4-lane combined); Supports DVP (8/10/12/16-bit)
MIPI DC PHY
DPHY V2.0 (4.5Gbps/line) or CPHY V1.1 (2.5Gbps/line)
PCIe 3.0
2 x PCIe3.0, 1x2 Lanes or 2x1 Lane (Up to 8Gbps, RC mode)
Ethernet
2 x GMAC (RGMII/RMII), 10/100/1000Mbps
SATA / USB 3.0
3 x SATA3.0 (Multiplexed with PCIe2.0/USB HOST2)
USB 2.0
2 x USB2.0 Host + 1 x USB2.0 OTG
UART / CAN
10 x UART (Auto flow control); 3 x CAN 2.0B
Other IO
5 x I2C, 16 x PWM, SDIO 3.0
Operating Temp.
0℃~+80℃ / -20℃~+85℃ / -40℃~+85℃
Connection
4x100pin Board-to-board connector (0.4mm pitch)
Working Voltage
12V
Dimensions
50 x 68 mm
Application Areas
The FET3588 - C SoM has undergone rigorous testing and provides stable performance support for high - end applications;
AGV, Edge Computing, Smart Large - screen Displays, High - end Tablets, Intelligent NVR, Visualization Gateways.
FET3576-C SoM
FET3576-C
OK3576-C
SoM Parameter
Item
Specification
Item
Specification
CPU
Rockchip RK3576
GPU
Mali GPU + NPU 6 TOPS
Architecture
4 × Cortex-A72 + 4× Cortex-A53
NPU
6 TOPS, supporting INT8/FP16
RAM
2/4GB LPDDR4
ROM
32GB eMMC
VPU
Supports H.264/H.265/VP9 4K video decoding
OS
Linux 6.1 / Android / Ubuntu / Debian
Working Voltage
12V
Connection
Board to board connector(4×100pin)
Structural Dimensions
68×50 mm
Operating Temperature
0℃~+70℃ / -40℃~+80℃
Audio
5 x SAI, supporting I2S/TDM/PCM
Camera
5 × MIPI-CSI
USB
3 × USB3.0, Type-C supports DP AltMode
Ethernet
2× 1Gbps
PCIe
1 x PCIe2.1/SATA combo
CAN-FD
≤ 2
I2C
≤ 10
UART
≤ 12
SPI
≤ 5
Display
HDMI 2.1 / eDP 1.3 / MIPI-DSI / EPaper / RGB / LVDS
Application Areas
Industrial, AIoT, Edge Computation, Smart Mobile Terminal;
Digital Multimedia Related Application
FET3572-C SoM
FET3572-C
OK3572-C
SoM Parameter
Item
Parameter
Item
Parameter
CPU
Rockchip RK3572
NPU
4 TOPS INT8 (supports INT4/8/16, FP4/8/16, BF16)
Architecture
2 × Cortex-A73 + 2 × Cortex-A53 + 4 × Cortex-A53
VPU
Enc: H.264/265 4K@60fps; Dec: 8K@30fps or 4K@120fps
GPU
Mali-G310V2 Mc1 (OpenGL ES 3.2, OpenCL 3.0, Vulkan 1.4)
Combo Interface
3 x (PCIe 2.1 / SATA 3.1 / USB 3.0 multiplexed)
RAM
2GB/4GB/8GB LPDDR5
Ethernet
≤ 2 x GMAC (RGMII/RMII, 10/100/1000 Mbps)
ROM
64GB eMMC
MIPI-CSI
2 x MIPI CSI-2 (up to 4-lane, supports max 4 cameras)
OS
Linux 6.12, Forlinx Desktop, Android 16, Debian 13
MIPI-DSI
1 x MIPI DSI 1.2 (4-lane)
Working Voltage
DC 5V-13V
HDMI/eDP TX
1 x Multiplexed (up to 4K@60Hz)
Operating Temp
0℃ ~ +80℃ (FET3572-C) / −40℃ ~ +85℃ (FET3572J-C)
DVP
1 x (up to 150 MHz)
Connection
Board to board connector (4 × 100pin, 0.4mm pitch)
PARA
1 x Parallel display (max 1080P@60Hz)
Flashing
USB OTG, TF card
EBC
1 x E-ink EPD
UART
≤ 12 (supports RS-485 / AFC)
USB 2.0
2 x OTG
I2C / I3C
≤ 9 x I2C / 1 x I3C Master
SDIO
≤ 2 x SDIO 3.0
SPI
≤ 5 (Master/Slave mode)
ADC
≤ 8 x 12-bit
CAN-FD
≤ 4 (CAN / CAN FD)
PWM
≤ 16
SAI
≤ 5 (up to 192kHz)
SPDIF
≤ 2 x TX, 1 x RX
DSMC
1 (8/16-bit transfer modes)
PDM
1 (up to 8 channels)
GPIO
n (Supports interrupt)
Mechanical dimensions
68mm × 50mm
Application Areas
AIoT & Edge Computing
Industrial Automation
Smart Cockpit / Display
Machine Vision
Medical Electronics
Robotics
FET3568-C SoM
FET3568-C
OK3568-C
SoM Parameter
Item
Specification
Item
Specification
CPU
Rockchip RK3568 / RK3568J
GPU
Mali-G52-2EE (OpenGL ES 1.1/2.0/3.2, Vulkan 1.1, OpenCL 2.0)
Architecture
4x Cortex-A55 @ 2.0/1.8 GHz
NPU
1.0 TOPS (INT8/INT16/FP16/BFP16 mixed)
RAM
1/2/4/8GB DDR4 (2GB standard)
ROM
8/16/32GB eMMC
VPU
Decoding: H.264/H.265/VP9 (Up to 4096x2304@60fps), VP8 (1920x1088@60fps), VC1/MPEG-4/2/1 (1920x1088@60fps), H.263 (720x576@60fps)
Encoding: H.264/H.265 (Up to 1920x1080@60fps)
OS Support
Linux 4.19/5.10, Android 11, Ubuntu, Debian, OpenHarmony 4.1
Input Voltage
5V DC
Dimensions
45mm x 70mm
Operating Temp.
0°C to +80°C / -40°C to +85°C
Interconnect
4x 80-pin B2B connectors (0.5mm pitch)
Display
Triple-display simultaneous output; Supports RGB, LVDS, MIPI DSI, HDMI, and eDP
Ethernet
2x GMAC (RGMII/RMII)
Camera
2x (1x DVP + 1x 4-lane MIPI-CSI)
USB 3.0
2x (1x Host + 1x OTG)
USB 2.0
2x (1x Host + 1x OTG)
PCIe 3.0
2x (1x2 lane or 2x1 lane), 8Gbps/lane; RC/EP
PCIe 2.1
1x PCIe 2.1 x1 (5Gbps), RC mode
SATA
3x SATA 3.0 (Up to 6Gb/s), eSATA support
CAN
3x CAN 2.0B
Audio
4x (1x 8-ch I2S/TDM, 2x 2-ch I2S, 1x 8-ch PDM)
SDIO
2x SDIO 3.0 (Up to 104MB/s)
SPI
4x (Master/Slave mode, software-configurable)
PWM
16x (32-bit timer/counter)
I2C
5x I2C (7-bit/10-bit addressing, up to 1Mbit/s)
Application Areas
The FET3568-C SoM has comprehensive advantages of high performance, low cost, multi-function, and industrial grade;
Industry, Medical, Power, Vehicle Transportation, Environmental Monitoring, Security, New energy, and Communication.
FET1126Bx-S SoM
FET1126Bx-S
OK1126Bx-S
SoM Parameter
Item
Parameter
Item
Parameter
Core Specification
Processor
Rockchip RV1126B / RV1126BJ
CPU
Quad Cortex-A53 @ 1.6GHz (B)
CPU
Quad Cortex-A53 @ 1.3GHz (BJ)
NPU
3 TOPS @ INT8
GPU
2D RGA
Memory
1GB / 2GB / 4GB LPDDR4
eMMC
64GB (B) / 8GB–32GB (BJ)
OS
Linux 6.1.141
Power
DC 5V
Vision & Video
ISP
VICAP, up to 12MP @ 30fps
AI ISP
Up to 8MP @ 30fps
Video Decode
H.264 / H.265, 4K @ 30fps
Video Encode
H.264 / H.265 / JPEG, 12MP @ 30fps
Display & Camera Interface
Display
RGB / MIPI-DSI / BT.656 / BT.1120
Resolution
1920 × 1080 @ 60fps
MIPI CSI
≥ 2 × 4-lane
DVP
1 × Parallel Input
Connectivity
Ethernet
1 × MAC (10/100 or RGMII)
USB
USB Host + USB DRD
CAN
≥ 2 × CAN 2.0
UART
≥ 8
Expansion & IO
SD / SDIO
TF + SDIO 3.0
I2C / SPI
I2C ≥ 5 / SPI ≥ 2
PWM
≥ 27
ADC
≥ 24, 13-bit
SAI
≥ 3
GPIO
≥ 118
Mechanical & Environment
Operating Temp.
-20℃ ~ +85℃ (B)
Operating Temp.
-40℃ ~ +85℃ (BJ)
Form Factor
40 × 40 mm, Stamp Hole + LGA
Application Areas
Power Transmission Line Monitoring Intelligent Transportation Gas Station Monitoring Smart Construction Site See-through Kitchen Intelligent Warehouse
FET1126Bx-C SoM
FET1126Bx-C
OK1126Bx-C
SoM Parameter
Item
Parameter
Item
Parameter
Core Specification
Processor
Rockchip RV1126B / RV1126BJ
CPU
Quad Cortex-A53 @ 1.6GHz (B)
CPU
Quad Cortex-A53 @ 1.3GHz (BJ)
NPU
3 TOPS @ INT8
GPU
2D RGA (No 3D GPU)
Memory
1GB / 2GB / 4GB LPDDR4
eMMC
64GB (B) / 8GB–64GB (BJ)
OS
Linux 6.1.141
Power
DC 5V
Flashing
USB OTG, TF
Connector
Board-to-Board (3 × 80-pin, 0.5mm pitch, 2.0mm height)
Vision & Video
ISP
VICAP, up to 12MP @ 20fps
AI ISP
Up to 8MP @ 30fps (Max 4096 × 4096)
Video Decode
H.264 / H.265, 4K @ 30fps
Video Encode
H.264 / H.265 / JPEG, 12MP @ 30fps
JPEG Decode
48 × 48 to 65520 × 65520 (YUV400/420/422/440/411/444)
Display & Camera Interface
Display
RGB / MIPI-DSI / BT.656 / BT.1120
Resolution
1920 × 1080 @ 60fps
MIPI CSI
≤ 2 × 4-lane (2.5Gbps/lane)
DVP
1 × Parallel Input (up to 150MHz)
Connectivity
Ethernet
1 × MAC (10/100 or RGMII)
USB
1 × USB 2.0 Host + 1 × USB 2.0/3.0 DRD
CAN
≤ 2 × CAN 2.0/B
UART
≤ 8 (up to 4Mbps, UART1-7 Flow Control)
Expansion & IO
SD / SDIO
TF + SDIO 3.0
I2C / SPI
I2C ≤ 5 / SPI ≤ 2
DSMC
≤ 1 (FPGA Connection, 4 CS)
FSPI
≤ 1 (Boot support, 1/2/4-bit)
PWM
≤ 27
ADC
≤ 24 (13-bit, 2 MSPS)
SAI
≤ 3
Audio ADC
2 × MIC In + 2 × DSM Out
GPIO
≤ 118
Mechanical & Environment
Operating Temp.
-20℃ ~ +85℃ (B)
Operating Temp.
-40℃ ~ +85℃ (BJ)
Form Factor
Ultra-thin Board-to-Board Connector Type
Application Areas
Power Transmission Line Monitoring
Intelligent Transportation
Gas Station Monitoring
Smart Construction Site
See-through Kitchen
Intelligent Warehouse
FET3562J-C SoM
FET3562J-C
OK3562J-C
SoM Parameter
Item
Specification
Item
Specification
CPU
Rockchip RK3562J
GPU
Mali GPU(On-board video decoding/encoding support)
Architecture
4 × [email protected]
NPU
-
RAM
1/2GB LPDDR4
ROM
8/16GB eMMC
VPU
Hardware decoding: H.264/H.265 1080p@60fps, 4K@30fps;
Hardware encoding H.264 1080p@60fps
OS
Linux 5.10/RT/AMP
Working Voltage
12V
Connection
Board to board connector(various interfaces)
Structural Dimensions
56×36 mm
Operating Temperature
-40℃~+80℃
Audio
SoM built-in codec, supporting Speaker,
MIC, headphone output
Camera
4 x MIPI-CSI
SDIO
1 x
Ethernet
2 x GMAC, supporting RGMII/RMII
USB 2.0
1 x
USB 3.0
1 x, supporting master-slave mode
PCIe
1 x PCIe 2.0
CAN
2 x CAN
I2C
≤5
ADC
≤16 10bit, the sampling rate is up to 1MS/s
SPI
≤3
LVDS
1 x
Display
MIPI-DSI / RGB / LVDS
-
-
Application Areas
Industrial, Medical, Power, New Energy, Communications and Other Industries, Consumer Electronics, Power Systems, Environmental Monitoring, Security, Smart Cities, etc.
FET3506J-C SoM
FET3506J-C
OK3506J-C
SoM Parameter
Item
Specification
Item
Specification
CPU
Rockchip RK3506J: 3x Cortex-A7 (1.5GHz) + 1x Cortex-M0 (200MHz); 2D GPU
RAM
256MB / 512MB DDR3
ROM
256MB Nand Flash / 8GB eMMC
OS Support
Linux 6.1
Input Voltage
5V DC
Operating Temp.
-40°C to +85°C
Dimensions
40mm x 29mm
Interconnect
Board-to-board connector (2x 80-pin, 0.5mm pitch)
Display
1x MIPI DSI, ≤1x RGB; Single VOP controller
Audio
1x 4-ch PDM, 1x Audio ADC, 2x Audio DSM
Ethernet
2x RMII (10/100 Mbps)
CAN-FD
2x (Supports CAN 2.0 and CAN-FD)
UART
≤6 (UART0 is debug port)
SAI
≤3
I2C
≤3
SPI
≤3
USB 2.0
2x (1x supports OTG)
SDMMC/SDIO
≤1 (Unavailable with eMMC)
PWM
≤11
GPIO
≤76
SARADC
≤4-ch (10-bit, 1MS/s)
Touch Key
≤8
SPDIF
1x TX/RX
FSPI
≤1
FLEXBUS
1x (High-speed IO switching)
JTAG
≤1
DSMC
≤1 (Supports Master/Slave mode)
Application Areas
Industrial Automation
Consumer Electronics
Smart Medical
New Energy
Communication Device
FET3506J-S SoM
FET3506J-S
OK3506J-S
SoM Parameter
Item
Parameter Description
Item
Parameter Description
CPU
Rockchip RK3506J
Architecture
3×Cortex-A7 up to 1.5GHz; 1×Cortex-M0
RAM
256MB / 512MB DDR3
ROM
256MB Nand Flash / 8GB eMMC
GPU
2D GPU
Operating Temperature
−40℃ ~ +85℃
Mechanical Dimensions
44mm × 35mm
Connection
Stamp-hole
OS
Linux 6.1
MIPI DSI
≤1, 2-lane,1.5Gbps/Lane
RGB
≤1, RGB888 24 bit, up to 1280×1280@60Hz
FLEXBUS
1 x flexible parallel FLEXBUS, bus high-speed IO
DSMC
Supports PSRAM / FPGA expansion, master/slave mode ×8/×16
USB 2.0
2 x, hight speed USB2.0, 1 x supports OTG
SDMMC
≤1 x SDIO 4bits
Ethernet
2 x RMI, 10/100Mbps, full-duplex/half-duplex
CAN-FD
2 x, supports CAN2.0 & CAN-FD
SPI
3x: SPI0/1 master-slave configurable; SPI2 slave mode
UART
≤ 6, UART0 is the debugging port
I2C
3 x, 7/10-bit address, master-slave mode, up to 1Mbps
FSPI
≤1
SARADC
≤4
PWM
≤11
JTAG
≤1
GPIO
≤76
Application Areas
Industrial Automation, Consumer Electronics, Intelligent Medical Treatment, Power, New Energy, Communications and Other Industries and Related Application Scenarios.
Allwinner Series System on Modules
FET527N-C SoM
FET527N-C
OK527N-C
SoM Parameter
Item
Specification
Item
Specification
CPU
Allwinner T527
RISC-V
200 MHz
Architecture
4 × Cortex-A55 + 4 × Cortex-A55
RGB
≤2
Clock
1.8GHz + 1.4GHz
LVDS
≤2
RAM
2GB/4GB LPDDR4
MIPI DSI
≤2
ROM
16GB/32GB eMMC
HDMI2.0
1 x, supporting 2D/3D display, 4K@30/60fps
OS
Linux 5.15
eDP1.3
1 x, supporting 2.5K@60fps and 4K@30fps
Working Voltage
5V
MIPI CSI
≤4
Operating Temperature
-40℃~+85℃
Parallel CSI
1 x, supporting 8/10/12/16-bit width
Connection
Board to board connector (4×80Pin, 2.0mm spacing )
Ethernet
≤2 , GMAC, supporting RMII/RGMII
Mechanical Dimensions
46mm x 70mm
UART
≤10
GPU
ARM G57 MC1
CAN
≤2, the baud rate is up to 1Mbps
NPU
2TOPS
USB 2.0
≤2, USB0: USB2.0 OTG 480Mbps; USB1; USB2.0 Host 480Mbps
PCIe 2.1
≤1, only supporting RC mode, 1-lane 5Gbps
USB 3.1
≤1, USB3.1 DRD mode 5Gbps
SDIO
≤ 2, used for SD card, up to 200MHz SDR mode
SPI
≤ 4, supporting master-slave mode, up to 100MHz
Application Areas
Commercial Displays, Cash Registers, Cloud Computers, Robots, Industrial Intelligence, Edge Computing Gateways, Aftermarket Central Control Systems, Commercial Vehicles, Industrial Control Computers, etc.
FET536-C SoM
FET536-C
OK536-C
FET536-C SoM Parameter
Item
Parameter
Item
Parameter
CPU
Allwinner T536
ARM
4 × Cortex-A55 @ 1.6GHz
RISC-V
XuanTie E907 @ 600MHz
NPU
2 TOPS
Video Decoding
MJPEG 4K@15fps; JPEG 1080p@60fps
Video encoding
H.264 4K@25fps; MJPEG 4K@15fps
ISP
8M@30fps; WDR; 3DNR
RAM
1GB / 2GB LPDDR4
ROM
8GB / 16GB eMMC
Operating Temperature
−40℃ ~ +85℃
Working Voltage
DC 5V
Display
MIPI DSI / RGB LCD / ≤2 LVDS
Camera
≤1 Parallel CSI; ≤4 MIPI CSI
Audio
Codec / DMIC / I2S / Single line audio
GMAC
≤2, 10/100/1000 Mbps
UART
≤17
CAN-FD
≤4
TWI
≤8 (compatible with I2C)
SPI
≤5, up to 100MHz
USB
USB3.1 ×1; USB2.0 HOST ×1; USB2.0 DRD ×1
SDIO
≤2
PCIe2.1
≤1, 1-lane, 5Gbps
ADC
≤28 GPADC; 1 x LRADC; 1 x TPADC
PWM
≤34, 0~24MHz / 0~100MHz
Local Bus
≤1, 8/16/32 bit width, 100MHz
Connection
Board to board connector (4×80Pin, 0.5mm spacing )
OS
Linux 5.10
Application Areas
Concentrator, DTU, Charging pile, Traffic, Robot, Industrial Control
FETT507-C SoM
FETT507-C
OKT507-C
SoM Parameter
Item
Specification
Item
Specification
CPU
Allwinner T507
GPU
G31 MP2 (OpenGL ES 3.2/2.0/1.0, Vulkan 1.1, OpenCL 2.0)
Architecture
4x Cortex-A53
Frequency
1.5 GHz
RAM
2GB DDR3L
ROM
8GB eMMC
OS Support
Linux 4.9, Ubuntu 18.04, Android 10
Input Voltage
5V DC
Dimensions
40mm x 70mm
Operating Temp.
-40°C to +85°C
Interconnect
Board-to-board connectors (3x 80-pin, 0.5mm pitch)
Display
HDMI 2.0a (4K@60fps), RGB/LVDS (1920x1080@60fps), CVBS (NTSC/PAL)
Video Codec
Decoding: H.265, VP9, VP8, AVS2 (Up to 4K@60fps); H.264 (Up to 4K@30fps)
Encoding: H.264 (Up to 4K@25fps); MJPEG (Up to 4K@15fps)
Ethernet
2x: 1x 10/100/1000M RGMII, 1x 10/100M RMII
USB
4x USB 2.0 (1x OTG + 3x Host)
Camera
MIPI_CSI: 1x 4-lane (8M@30fps or 4x 1080p@25fps)
DVP: 1x (5M@15fps or 1080p@30fps)
UART
≤6 (Up to 4Mbit/s)
I2C
≤5
SPI
≤1
SD/MMC/SDIO
≤2
PWM
≤6
GPADC
4x Channels
Audio CODEC
1x
IIS/PCM
≤4 (3x External + 1x Internal HDMI)
SCR
1x (ISO/IEC 7816-3 support)
CIR
1x (Remote control/Wireless keyboard support)
Application Areas
Automotive Electronics, Power Industry, Medical Electronics, Industrial Control, IoT, Intelligent Terminals and Other Fields With High Stability Requirements.
FET153-S SoM
FET153-S
OK153-S
SoM Parameter
Item
Parameter
Item
Parameter
CPU
Allwinner T153
Architecture
4× Cortex-A7
Clock
1.6 GHz
RISC-V
E907, up to 600MHz
GPU
G2D
RAM
256MB / 512MB / 1GB DDR3
ROM
256MB/512MB NandFlash / 8GB eMMC
Operating Temperature
−40℃ ~ +85℃
Connection
Stamp-hole + LGA
Mechanical dimensions
44mm × 35mm
OS
Linux 5.10
Parallel CSI
≤1, 8/10/12/16 bit width
MIPI CSI
≤2, 4-lane or 2+2-lane
MIPI DSI
≤1, 4-lane, 1920×1200@60fps
RGB LCD
≤1, RGB888/666/565
LVDS
≤2, 1920×1080@60fps(Dual link)
SDIO
≤2, SMHC0 is applicable to SD card
Audio
≤1, built-in Codec
I2S
≤3, 8kHz~384kHz
DMIC
≤1, 8ch,8kHz~48kHz
OWA IN/OUT
≤1, single line audio
USB2.0 DRD
1 x, both master & slave mode are OK.
USB OTG
1 x, only supporting master mode
Application Areas
Industrial Control, Power, New Energy, Transportation, and Healthcare
FETA40i-C SoM
FETA40i-C
OKA40i-C
SoM Parameter
Item
Specification
Item
Specification
CPU
Allwinner A40i
UART
8 x
Architecture
4 × Cortex-A7
IIC
≤ 5
Clock
1.2 GHz
SPI
≤ 4
RAM
1GB DDR3(Optional 2GB)
Camera
2 x DVP, 4 x TVIN
ROM
8GB eMMC
SD/MMC/SDIO
≤ 4
OS
Linux5.10, Android7.1
USB
2 x USB 2.0 HOST, 1 x USB 2.0 OTG
Working Voltage
5V
SATA
1 x
Operating Temperature
-25℃~+85℃ / -40℃~+85℃
PWM
8 x
Connection
Board to board connector (4 x 80Pin 0.5mm spacing )
AUDIO CODEC
1 x
Mechanical Dimensions
45mm x 68mm
JTAG
1 x
Battery Management
AXP221S
KeyPad Port
1 x
GPU
Mali400MP2
KEYADC
≤ 2
Video Coder
Hardware video encoding
SMC
≤ 2
Display
2 x RGB24 bit, 2 x 8 bit LVDS, 1x HDMI, 1x MIPI, 4 x TVOUT
PS2
≤ 2
IIS/PCM
≤ 2
CIR
≤ 2
Ethernet
1 x 10/100Mbps self-adaptive;
1 x 10/100/1000Mbps self-adaptive
AC97
1 x
Application Areas
Advertising Machines, Digital Signage, Intelligent Self-service Terminals, O2O Intelligent Devices, In-vehicle Displays, etc.
FET113i-S SoM
FET113i-S
OK113i-S
SoM Parameter
Item
Specification
Item
Specification
CPU
Allwinner T113-i (Dual-core Cortex-A7)
Frequency
1.2 GHz
Coprocessor
RISC-V (XuanTie C906)
DSP
HiFi 4 DSP
RAM
512MB DDR3
ROM
8GB eMMC / 256MB Nand Flash
OS Support
Linux 5.4.61
Input Voltage
DC 5V
Operating Temp.
-40°C to +85°C
Interconnect
Stamp-hole connector (Castellated holes)
VPU
Decoding: H.265 (4K@30fps), H.264 (4K@24fps), H.263/MPEG/JPEG/Xvid (1080p@60fps)
Encoding: JPEG/MJPEG (1080p@60fps)
Display Output
Multiplexed Interface (Select 1 of 3): 1x RGB, 1x LVDS, or 1x MIPI_DSI ;
Independent Output: 1x CVBS_OUT
Camera Interface
1x CSI (Pixel clock up to 148.5MHz)
Video Input
2x CVBS_IN (NTSC/PAL support)
Audio I/O
Audio Out ≤2, Audio In ≤5
I2S / DMIC
I2S ≤3, DMIC 1x
UART
≤5
USB
1x USB DRD, 1x USB HOST
Ethernet
1x EMAC
OWA
1x (One Wire Audio)
Application Areas
Rail Transit, Power Energy, Industrial Control, Security Monitoring, Conference Systems, Portable Devices, etc.
Texas Instruments Series System on Module
FET62xx-C SoM
FET62xx-C
OK62xx-C
SoM Parameter
Item
Specification
Item
Specification
Processor
SoC: TI AM62x (AM6254/AM6231/AM6232), 1/2/4x Cortex-A53 @ 1.0/1.4GHz
MCU: Cortex-M4F @ 400 MHz
GPU: AXE1-16M @ 500MHz (OpenGL 3.x/2.0/1.1, Vulkan 1.2)
RAM
1GB / 2GB DDR4
ROM
8GB eMMC
OS Support
Linux 6.1.33
Input Voltage
5V DC
Operating Temp.
-40°C to +85°C
Dimensions
38mm x 60mm
Interconnect
Board-to-board connectors (4x 80-pin, 0.5mm pitch)
LVDS
2x 4-lane Serial Display Port
RGB Parallel
1x 24-bit Parallel RGB Interface
MIPI CSI
1x 4-lane Camera Interface
SD/SDIO
2x 4-bit (Up to UHS-I)
Ethernet
≤2
USB
2x USB 2.0
UART
≤9
CAN-FD
≤3
SPI
≤5
I2C
≤6
PWM
≤3
Audio
≤3
eQEP
≤3
eCAP
≤3
GPMC
1x
OSPI/QSPI
1x
JTAG
1x
Application Areas
Industrial Automation, Power, Medical Instruments, Transportation, Industrial HMI, Charging Pile TCU, Industrial Controller, Data Acquisition Gateway, PCR, Blood Analyzer, etc.
Nuvoton Series System on Module
FET-MA35-S2 SoM
FET-MA35-S2
OK-MA35-S2
SoM Parameter
Item
Parameter Description
Item
Parameter Description
Processor
Nuvoton MA3501
CPU
2 × Cortex-A35@800MHz + Cortex-M4@180MHz
GPU
2D GPU
Decoding Capability
H.264 / MVC / SVC, up to 1080p@45fps
RAM
512MB / 1GB DDR3L
ROM
8GB eMMC
Working Voltage
DC 5V
Operating Temperature
−40℃ ~ +85℃
Connection
LCC+LGA(260pin)
Dimensions
40mm × 48mm
USB
1 × USB2.0 Host, 1×USB2.0 OTG
RGB
1 x RGB888, up to 1920×1080
CSI
≤2, up to 3MP
EPWM
≤18 EPWM
ADC
8 x, 10bit, 500K SPS, supporting resistive touch (4/5 wire)
EADC
≤8, 10bit,4.7M SPS
OS
Linux 5.10
Ethernet
≤2, 10/100/1000M(RGMII/BMII)
UART
≤17, up to 9.5Mbps
ISO7816
≤2, supporting ISO-7816-3
QSPI
≤2, master/slave mode, up to 100MHz
SPI
≤4, master/slave mode, up to 100MHz
I2S
≤2, supporting master and slave
I2C
≤ 5, 7/10 bit address mode, up to 1Mbit/s
CAN-FD
≤4, supporting CAN-FD 1.0 and CAN2.0A/B
SDIO
1 x(SD0), 4bit, only 3.3V
Application Areas
Charging Piles, Industrial Control, Edge Gateways, New Energy, Power, and Fire Protection
Pin2Pin UP4 System on Module
FET-MX9352-UP4 SoM
FET-MX9352-UP4
OK-MX9352-UP4
SoM Parameter
Feature/Function
Max Support
UP4 Standard
Notes/Details
Processor
-
NXP i.MX9352
2×Cortex-A55 @1.7GHz + 1×Cortex-M33 @250MHz
AI Support
-
0.5 TOPS NPU
Integrated NPU
Memory/Storage
-
1GB / 8GB
LPDDR4 / eMMC
Operating Voltage
-
DC 5V
System power supply
Operating Temp
-
-40℃ ~ +85℃
Industrial grade
Connection
-
LCC+LGA
487 pins, LCC pitch 1.0mm, LGA pitch 1.27mm
MIPI CSI
1
1
Up to 2 Rx lanes, 1.5 Gbps per lane, 150Mpixel/s
Ethernet
2
2
RGMII, 1x TSN, 2x IEEE 1588
LCD (RGB)
1
1
24-bit parallel RGB, up to 1366x768p60
LVDS
1
1
Single ch (4-lane), up to 1366x768p60
MIPI DSI
1
1
4-lane, up to 1920x1200p60, 1.5Gbps per lane
USB 2.0
2
2
Integrated PHY, Master-Slave switch
SD/SDIO
2
2
uSDHC2 (4-bit SD3.0, 100MB/s), uSDHC3 (4-bit SDIO3.0)
CAN-FD
2
1
ISO11898-1 / CAN 2.0B
UART
8
-
Max baud rate 5Mbps
I2C
8
3
Supports modes up to 5000 Kbit/s
I3C
2
-
Improved I2C, Backward compatible
SPI
8
-
Support Master/Slave mode configurations
ADC
4
4
12-bit, 4-ch, 1MS/s
SAI (Audio)
3
1
I2S, AC97, TDM, DSP, Sampling 8kHz-384kHz
MQS
2
-
Medium quality audio via GPIO
PDM
3
-
24-bit, High AOP MIC support
TPM (PWM)
6
3
16-bit Timer/PWM/Capture
JTAG
1
1
2x4 2.54mm pin lead out
FET3568J-UP4 SoM
FET3568J-UP4
OK3568J-UP4
SoM Parameter
Feature/Function
Max Support
UP4 Standard
Notes/Details
Processor
-
Rockchip RK3568B2/J
Quad-core Cortex-A55 @2.0GHz/1.8GHz
AI Support
-
1 TOPS NPU
INT8/INT16/FP16/BFP16
Memory/Storage
-
4GB/8GB + 32GB/64GB
LPDDR4X / eMMC
Operating Temp
-
-40℃ ~ +85℃
Industrial grade
Connection
-
LCC + LGA
487 pins, Pin pitch 1mm
MIPI DSI
2
1
4-lane, up to 1920x1080@60Hz
HDMI
1
1
HDMI 2.0, up to 4096x2304@60Hz
LVDS
1
1
Single ch (4-lane), up to 1280x800@60Hz
eDP
1
1
4-lane eDP V1.3, up to 2560x1600@60Hz
LCD (RGB)
1
1
RGB 888, up to 1280x800
MIPI CSI
2
2
2x 2-lane MIPI-CSI
Ethernet
2
2
2x GMAC, RGMII/RMII
USB 2.0
2
2
Host, independent port
USB 3.0
2
2
1x Host, 1x OTG (operable as USB 2.0)
PCIe 2.1
1
1
1-lane, up to 5.0Gbps, RC mode
PCIe 3.0
2
1
2-lane, up to 8.0Gbps, RC/EP mode
SDIO
2
2
SDIO 3.0, up to 104MB/s
UART
10
3
Up to 4Mbps
CAN
3
2
CAN 2.0B, up to 1Mbps
I2C
5
3
7/10-bit address, up to 1Mbit/s
PWM
16
4
32-bit timer/counter
ADC
8
8
10-bit, single-ended, 1MS/s
FSPI
1
1
Serial NOR/NAND Flash & Boot
Audio
4
0
Native MIC, phone, speaker
SPI
4
0
-
SATA
3
0
-
FET3562J-UP4 SoM
FET3562J-UP4
OK3562J-UP4
SoM Parameter
Feature/Function
Max Support
UP4 Standard
Notes/Details
Processor
-
Rockchip RK3562J
4×Cortex-A53 @1.8GHz
GPU
-
Mali-G52-2EE
OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.0/1.1
VPU
-
H.264/H.265/VP9
Enc: 1080p60; Dec: 4K@30fps / 1080p60
AI Support
-
1 TOPS NPU
INT8 (supporting INT4/INT8/INT16/FP16)
Memory/Storage
-
1GB/2GB + 8GB/16GB
LPDDR4 / eMMC
Operating Temp
-
-40℃ ~ +85℃
Industrial grade
Working Voltage
-
DC 5V
System power supply
Connection
-
LCC+LGA
487 pins, LCC pitch 1mm, LGA pitch 1.27mm
USB 2.0
1
1
Supports 1 x USB2.0 HOST, up to 480Mbps
USB 3.0
1
1
Supports USB3.0 master and slave mode
Ethernet
2
2
Supports one RGMII and one RMII
PCIe
1
/
PCIe 2.1, RC mode only, 5Gbps, muxed with USB3.0
LVDS
1
/
VESA/JEIDA format, up to 800 x 1280 @ 60Hz
MIPI-DSI
1
1
1 x MIPI DSI TX, 4-lanes, up to 2048 x 1080 @ 60Hz
RGB
1
/
RGB 888 format, up to 1280 x 800
MIPI-CSI
4
4
2 ports total; 4-lanes @ 2.5 Gbps; can be split into 2-lanes
SD card
1
1
SDIO 3.0 protocol, 4-bit width
SDIO
1
1
SDIO 3.0 protocol, 4-bit width
UART
10
3
Flow control on A/B, max 4Mbps
SPI
3
1
Support master and slave modes
I2C
5
3
Standard (100kbit/s) and Fast (400kbit/s) modes
ADC
16
4
3x 10-bit (1MS/s) + 1x 6-bit (key detection)
SAI
2
1
I2S, PCM, TDM, up to 192kHz
Audio
1
1
Built-in codec: Mono Speaker 1.3W, Headphone out, 2x MIC
PDM
1
/
Up to 8 channels, 192KHz, master receive
SPDIF
1
/
-
CAN
2
2
CAN2.0 B, 1Mbps
PWM
16
1
-
FET527N-UP4 SoM
FET527N-UP4 SoM
FET527N-UP4 SoM
SoM Parameter
Feature/Function
Max Support
UP4 Standard
Notes/Details
Processor
-
Allwinner T527N
4×[email protected] + 4×[email protected] , RISC-V, DSP HiFi4
GPU
-
ARM G57 MC1
Graphics acceleration
VPU
-
4K H.264/H.265
Enc: 4K@25fps; Dec: 4K@60fps
AI Support
-
2 TOPS NPU
INT8/INT16, 40+ operators
Memory/Storage
-
2GB/4GB + 16GB/32GB
LPDDR4 / eMMC
Operating Temp
-
-40℃ ~ +85℃
Industrial / Extended options
Working Voltage
-
DC 5V
System power supply
Connection
-
LCC+LGA
487 pins, stamp hole pitch 1mm, LGA pitch 1.27mm
Parallel CSI
1
/
8/10/12/16-bit, BT.656/BT.1120
MIPI CSI
≤4
3
4+2+2-lane. Max: 8M@30fps RAW12
MIPI DSI
≤2
1
4-lane, up to 1920x1200@60fps
RGB
≤2
/
DE/SYNC mode, up to 1080p60
LVDS
≤2
1
Dual link 1080p60, single link 768p60
eDP 1.3
1
1
Up to 4K@30fps / 2.5K@60fps, with audio
HDMI 2.0
1
1
4K@60fps (2D), 4K@30fps (3D), with audio
USB
≤3
3
1x USB 3.0 OTG, 1x USB 2.0 OTG, 1x USB 2.0 Host
PCIe 2.1
1
/
RC mode, 1-lane, 5Gbps
SDIO
≤2
2
SDC0 (SD Card), SDC1 (SDIO 3.0), up to 200MHz SDR
GMAC
≤2
2
RMII/RGMII, 10/100/1000 Mbps
Audio Codec
1
1
1x Stereo HP out, 2x Diff Line-out, 1x Diff MIC in
I2S/PCM
≤4
1
8kHz - 384kHz sampling rate
DMIC
1
2
8-channel, 8kHz - 48kHz
OWA IN/OUT
1
/
Single-wire audio
CAN
≤2
2
Up to 1Mbps
SPI
≤4
2
SPI2 (Master/Slave), SPI1 (SPI/DBI), up to 100MHz
TWI (I2C)
≤8
3
I2C compatible, 100/400 kbps
UART
≤10
3
16450/16550 compatible
GPADC
14
3
12-bit resolution, 1MHz max sampling
LRADC
2
1
6-bit resolution, 2KHz (for key detection)
PWM
≤30
3
0~24MHz or 0~100MHz
CIR TX/RX
1
/
IR TX/RX
FET536-UP4 SoM
FET536-UP4
OK536-UP4
SoM Parameter
Feature/Function
Max Support
UP4 Standard
Notes/Details
Processor
-
Allwinner T536
4×Cortex-A55 | RISC-V: XuanTie E907@600MHz
AI Support
-
2 TOPS NPU
Integrated NPU
VPU
-
4K Video Engine
Dec: MJPEG 4K@15fps; Enc: H.264 4K@25fps, JPEG 8Kx8K
Memory/Storage
-
1GB/2GB/4GB + 8GB/16GB/32GB
LPDDR4 / eMMC
Operating Temp
-
-40℃ ~ +85℃
Industrial grade
Working Voltage
-
DC 5V
System power supply
Connection
-
LCC+LGA
487 pins, stamp hole pitch 1mm, LGA pitch 1.27mm
Parallel CSI
≤1
/
8/10/12/16-bit, BT.656 up to 4x 720p30
MIPI CSI
≤4
4
8M@30fps RAW12, Config: 4+4 / 4+2+2 / 2+2+2+2-lane
MIPI DSI
≤1
1
4-lane, up to 1920x1200@60fps
RGB LCD
≤1
/
DE/SYNC mode, up to 1920x1200@60fps
LVDS
≤2
1
Dual link 1080p60, single link 768p60
SDIO
≤2
2
SMHC0 (SD), SMHC1 (SDIO), 1.8V only
USB 3.1
≤1
1
OTG, 5Gbps
PCIe 2.1
≤1
/
RC/EP mode, 1-lane, 5Gbps
USB 2.0 DRD
1
/
DRD (Master/Slave), 480Mbps
USB 2.0 HOST
1
1
Host only, 480Mbps
GMAC
≤2
2
RMII/RGMII, 10/100/1000 Mbps
Audio
≤1
1
Built-in codec, 1x Diff Line-out
I2S
≤4
1
Master/Slave, 8kHz - 384kHz
DMIC
≤1
/
8-channel, 8kHz - 48kHz
OWA IN/OUT
≤1
/
Single-wire audio
CAN-FD
≤4
2
CAN-FD and CAN 2.0B
Local Bus
≤1
/
8/16/32-bit, up to 100MHz
SPI
≤5
2
Master/Slave, up to 100MHz
TWI (I2C)
≤8
3
I2C compatible, 100/400 kbps
UART
≤17
3
16450/16550 compatible
GPADC
≤28
3
12-bit resolution, 2MHz max sampling
LRADC
1
1
6-bit resolution, 2KHz (for key detection)
TPADC
≤1
/
4-wire resistive touch, 12-bit SAR
PWM
≤34
4
0~24MHz or 0~100MHz
LEDC
≤1
/
Programmable LED control, up to 800 kbps
IR TX
≤1
/
Infrared output
IR RX
≤5
/
Infrared receiving
Forlinx Embedded Computer
FCU1103 All - purpose 4G Gateway/Controller
Charging pile billing control unit (TCU), display, communication, data collection, and control
SoM Parameter
Item
Specification
Item
Specification
CPU
NXP i.MX6UltraLite, Cortex-A7, 528MHz
Audio
1 x headphone port, 1 x built - in microphone,
and 2 x reserved speaker interfaces
RAM
256MB/512MB LvDDR3
CAN BUS
2 x electrically isolated ports
ROM
256MB/1GB NAND FLASH, 8GB eMMC
WiFi&BT
RL-UM02WBS-8723BU-V1.2 module
Ethernet
1 x, expandable to 2 x,
10/100M self - adapting
UART
5 x
External storage
Standard SD card interface,
up to 64GB SDXC
RTC
On - board CR2032 battery, keeps working
for at least one year after power - off
Mobile Communication
Supports GPRS/4G, 1 x mini SIM slot
USB
1 x USB OTG, 1 x USB Host
ESAM
Supports ESAM chip, ISO7816 protocol
PSAM
Supports PSAM chip, 1 x mini SIM slot
Switching Output
4 x , isolated by relays
Switching input
4 x, isolated by optocouplers
Display
LVDS display interface (DVI - I socket)
Others
Customizable LOGO
Power In
DC12V, supports DC9 - 15V,
with reverse - connection protection
Power - off detection and maintenance
Super capacitor maintains system
operation for at least 15 seconds
Dimensions
147×103×42mm
Installation
Locked by bolts
Software System
Linux3.14, Linux4.1.15
GCC
gcc-4.6.2-linaro-multilib
Product overview
Widely used in charging piles, communication gateways, data collection, and human - machine interaction;
Aluminum alloy case with mounting holes, compact size, and easy to install.
FCU1104 Extended 4G Gateway
LoRa gateway, 2 x Ethernet, 4 x RS485 (expandable to 8 ports)
SoM Parameter
Item
Specification
Item
Specification
CPU
NXP i.MX6ULL, ARM Cortex-A7 800MHz
4G
C200S (without GPS and voice functions),
supports China Mobile’s 4G/3G/2G,
China Unicom’s 4G/3G/2G, and China Telecom’s 4G.
RAM
256MB DDR3 (NAND) / 512MB DDR3 (eMMC)
WiFi
Supports STA/AP mode (optional module,
choose either this or the 4G module).
ROM
256MB (NAND) / 8GB (eMMC)
Ethernet
2 x, 10/100Mbps, with isolation
protection, ESD 3.
RS485
8 x, 1.5KV isolation protection, ESD 4.
Power IN
DC12V, supporting DC9 - 36V,
with reverse connection protection
and over - current protection.
DI
2 x dry contact inputs, with isolation protection.
RTC
Supports clock retention during power - off
and NTP automatic time synchronization.
DO
2 x relay outputs, contact capacity 5A/250VAC.
OS
Linux4.1.15, Yaffs2, GCC 4.6.2
CAN
1 x, 1.5KV isolation protection, ESD level 4.
Dimensions
150×110×45mm
Buzzer
1 x
TF card
Supports TF cards up to 32GB.
Reset Button
1 x, used for system reset.
BOOT button
1 x, used for system firmware update.
Working Environment
Humidity 5 - 95%, no condensation.
Working temperature: - 25~+85℃ (eMMC) / - 40~+85℃ (NAND).
Storage Temperature
-40~+85℃
Product Overview
Low - cost, high - performance, and highly reliable;
Supports multiple network protocols;
Suitable for harsh industrial environments, enabling efficient and reliable data transmission.
FCU1501 Industrial Embedded Control Unit
RK3506 Tri-core IoT Gateway with Enhanced CAN FD & Multi-RS485 Connectivity
FCU1501 Industrial Gateway Parameters
Item
Basic Version
Extended Version
Description / Details
Hardware Specifications
Processor
Rockchip RK3506J
Tri-core Cortex-A7 @ 1.5GHz
Memory
256MB DDR3
512MB DDR3
High-performance industrial memory
Storage
256MB NAND
8GB eMMC
Industrial-grade flash storage
Operating Temp.
-40°C to +85°C
Wide temperature industrial grade
Power Input
9-36V DC Wide Input
Rated 12V/3A; Reverse polarity & overcurrent protection
EMC Protection
Level 3
Enhanced industrial electromagnetic compatibility
Dimensions
177 x 130.5 x 45 mm
187 x 152 x 45 mm (incl. mounts, terminals & antenna)
Cooling / Weight
0.8 kg
0.9 kg
Fanless / Passive cooling design
Mounting
35mm DIN-Rail / Wall Mount
Dual-mounting options supported
Interface Parameters
LED Indicators
8
8
PWR, RUN, ERR, 3x 4G, 2x User-defined
USB 2.0
1
1
Type-A; Supports OS flashing via USB drive
Debug Port
1
1
Type-C interface for PC debugging
Ethernet
2
2
10/100Mbps auto-sensing; Non-PoE
CAN FD
1
2
Compatible with CAN 2.0B; Independent digital ground
RS485
4
8
Independent digital ground per channel
RS232
2
2
Multiplexed with RS485; Independent digital ground
DI (Dry Contact)
2
8
Digital Input channels
DO (Relay)
2
8
NO (Normally Open); 5A 250VAC / 5A 30VDC
4G LTE
1 (Opt.)
1 (Opt.)
Supports 4G Cat.1 module (Optional SKU)
SIM Slot
1
1
Push-push Nano SIM slot
Wi-Fi & Bluetooth
1
1
Dual-band Wi-Fi, BT 5.0 (Standard)
Reset Key
1
1
One-key network reset; Customizable function
Buzzer / RTC
1 / 1
1 / 1
Built-in buzzer; Internal battery-backed RTC
Watchdog
Supported
Supported
Hardware watchdog for system stability
DC OUT
1
1
Matches input voltage; Reverse polarity protected
Product Overview
A rugged, fanless industrial PC designed for harsh environments, featuring -40°C to +85°C operating temperature and 9-36V DC wide power input;
High-density industrial I/O (up to 8x RS485, 2x CAN FD) with integrated 4G LTE, dual-band Wi-Fi, and flexible DIN-rail/Wall mounting;
FCU2303 High - performance 5G Industrial Gateway
Multiple network ports, high performance, a fan - less design, and is of industrial - grade, supporting both 4G and 5G.
Industrial Gateway Parameters
Item
Parameter
Item
Parameter
CPU
4 x Cortex-A53 1.6GHz + 4 x Cortex-A72 1.8GHz
RAM
2GB/4GB
ROM
8GB eMMC
OS
OpenWRT 21.02
Debug
1 x RS232 port, 3.81 terminal
SSH
Network port
Hard Disk
1 x M.2 NVMe SSD slot
Ethernet
6/8 ports of 10M/100M/1000M
self-adaption, EFT 4, ESD 3
RS485
8 x, 3kV isolation, ESD 3, EFT 3
RS232
4 x, multiplexed with RS485
DI
2 x, optocoupler isolation
DO
2 x, electromagnetic relay isolation;
Contact capacity: 5A 30VDC / 5A 250VAC
USB
1 x USB HOST (USB Type - A), ESD 4
4G/5G
Either 5G or 4G function
Wi-Fi
Dual - band 2.4G/5G, supports AP and STA modes
Watchdog
Support
RTC
Support
Button
1 x reset button;
1 x user-defined key
LED
Communication status indicator
Mechanical Dimensions
232mm × 53mm × 155mm
Installation Method
Ear - hanging installation
Power Supply
DC 12V 5A
Working Environment
Humidity: 5% - 95%, no condensation;
Working temperature: - 40℃ - 80℃;
Storage temperature: - 40℃ - 125℃.
Heat Dissipation Method
Passive heat dissipation, fan - less.
Product Overview
High - performance 5G industrial gateway with industrial - grade fanless design;
Highly integrated, supporting powerful edge computing capabilities;
Stable system operation, with open APIs for easy secondary development;
Supports multiple communication interfaces and industrial protocols.
FCU2601 Industrial & Commercial EMS Control Unit
High performance, multi-interface, low power consumption, industrial grade
Industrial Gateway Parameters
Item
Specification
Item
Specification
CPU
4x Cortex-A55, 1.8 GHz
RAM
2GB / 4GB
ROM
16GB / 32GB eMMC
OS
Linux 4.19
System Hardware
Watchdog & RTC Support
Storage Extension
1x mSATA Bay
Ethernet
2x 10/100/1000 Mbps (EFT Level 4, ESD Level 4 );
2x 10/100 Mbps (EFT Level 4, ESD Level 4 )
Wireless
4G Cat4 / Cat1
Wi-Fi
Dual-band 2.4G/5G (AP/STA Modes)
Debug
1x RS232 (RJ45 Port)
Management
SSH via Network Port
Industrial Serial
11x RS485 (3kV Isolation; EFT Level 3, ESD Level 4 );
2x RS232 (Multiplexed with RS485)
CAN Interface
2x CAN 2.0B (3kV Power Isolation; ESD Level 4, EFT Level 4 )
Digital I/O
DI: 8x Dry Contact;
DO: 6x Relay (Contact Capacity: 5A @ 250VAC / 5A @ 30VDC)
HDMI Output
1x HDMI 1.4 (1080p@60fps, Up to 4K)
USB
2x USB Host 2.0 (ESD Level 4 )
User Interface
1x RESET, 1x User-defined Key
Status Indicators
2x System LED, 2x CAN LED, 2x User LED
Input Voltage
24V DC (9V to 36V wide-range); Reverse polarity, Over-current, and Power-off protection
Environmental
Operating Temp: -40°C to +75°C; Storage: -40°C to +85°C;
Humidity: 5% to 95% (Non-condensing)
Dimensions
214 x 140 x 45 mm
Cooling
Passive (Fan-less)
Mounting
Wall-mount (Ear-hanging)
*These parameters are for the extended version. Please consult the sales for the basic version parameters.
Product Overview
Designed for energy storage EMS, with highly reliable hardware and software;
Supports multiple interfaces and protocols, suitable for industrial and commercial energy storage and grid - side energy storage;
Passive cooling, fanless design, suitable for industrial environments.
StarterKit
Phoenix Contact x Forlinx Embedded vPLCnext verification platform
StarterKit Parameter Table
Item
Parameter Description
Item
Parameter Description
Main ControL
4 × [email protected]
RAM
2GB
ROM
16GB eMMC
OS
Linux 6.1, supporting Phoenix Contact vPLC next
Debug
1 x type - C
SSH
Network port
Ethernet
3 x 10M/100M/1000M adaptive ports
DI
8 x dry contact inputs
DO
8 x relay outputs
USB
1 x USB OTG (For System Flashing)
Wi-Fi
2.4G, supports AP/STA modes
Watchdog
Support
RTC
Support
Button
1 x reset switch
LED Indicator
1 x PWR, 1 x RUN, 1 x ERR, 3 x network port indicators, 16 x IO indicators
Mechanical Dimensions
100mm × 80mm × 57mm
Installation Method
Rail clip installation
Power Supply
DC 24V
Heat Dissipation Method
Passive heat dissipation, fan - less.
Product Overview
The Virtual PLCnext Control Starter Kit is designed for the industrial automation control sector. It natively supports Phoenix Contact's VPLCnext and offers containerized deployment using Podman. The kit includes 3 x Gigabit network ports and 16 I/O ports, enabling users to quickly get started and efficiently test and verify hardware designs from Forlinx, as well as the Phoenix Contact VPLCnext system.