FET-MX8MPQ-SMARC System on Module

CPU: iMX8M Plus

Architecture: 4x [email protected]+1x Cortex-M7@800MHz

Frequency: 1.6GHZ

RAM: 2GB/4GB LPDDR4

ROM: 16GB / 32GB eMMC

System: Linux 6.1.36

Brief Message Compare

FET-MX8MPQ-SMARC System on Module Based on NXP i.MX 8M Plus Processor

The FET-MX8MPQ-SMARC System on Module(SoM) / Computer on Module leverages the NXP i.MX 8M Plus Quad-Plus (4× [email protected] + Cortex-M7@800 MHz) with a 2.3 TOPS NPU and ISP to deliver ML, vision and advanced multimedia in a high-reliability industrial platform. Built to the SMARC™ 2.1 standard (82 × 50 mm), it’s plug-and-play with all SMARC 1.x/2.x carriers. Rated for –40°C to +85°C on a single 5V supply, it thrives in harsh edge environments—ideal for smart cities, industrial IoT, smart healthcare and intelligent transportation.

NXP i.MX8M Plus Quad-Plus SMARC Module Key Advantages:

  • Fully compliant with the SMARC 2.1 specification
  • NXP i.MX 8M Plus application processor, 4× Cortex-A53 @ 1.6 GHz
  • Cortex-M7 microcontroller core, up to 800 MHz
  • 2.3 TOPS Neural Processing Unit (NPU) and hardware Image Signal Processor (ISP)
  • Dual-band 2.4/5 GHz 2×2 Wi-Fi 5 (802.11ac) + Bluetooth 5.3
  • Industry-leading build quality from Forlinx
  • Preloaded Linux 6.1.36 LTS software stack with BSP, drivers, and sample code

FET-MX8MPQ-SMARC SoM

NXP iMX8M Plus SMARC system on module(SoM)

High-speed Communication Interface

NXP iMX8M Plus SMARC system on module/single board computer High-speed Communication Interface

4K Picture Quality and HiFi Voice Experience

HDMI interface supports up to 4K display output; it also features LVDS, MIPI-DSI display interface, the latest audio technology,
Cadence® Tensilica® HiFi 4 DSP @ 800 MHz, 18x I2S TDM, DSD512, S/PDIF Tx + Rx, 8-channel PDM microphone input, eARC, ASRC.

NXP iMX8M Plus SMARC system on module/single board computer 4K Picture Quality and HiFi Voice Experience

Advanced Multimedia Technology

NXP iMX8M Plus SMARC system on module/single board computer Advanced Multimedia Technology

3D/2D Graphic Acceleration

NXP iMX8M Plus SMARC system on module/single board computer 3D/2D Graphic Acceleration

Machine Learning and Vision

Built-in NPU with 2.3 TOPS of AI computing power to meet lightweight edge computing needs

NXP iMX8M Plus SMARC system on module/single board computer Machine Learning and Vision

Dual Image Signal Processor (ISP)

NXP iMX8M Plus SMARC system on module/single board computer Dual Image Signal Processor (ISP)

Product Application

NXP iMX8M Plus SMARC system on module/single board computer Wide Range of Industry Applications

▊ iMX8MP SMARC Video


Unboxing Forlinx Very First i.MX8M Plus SMARC Development Board

▊ Hardware Features


FET-MX8MPQ-SMARC System on Module(SoM) / Computer on Module leverages the NXP i.MX 8M Plus Quad-Plus front FET-MX8MPQ-SMARC System on Module(SoM) / Computer on Module leverages the NXP i.MX 8M Plus Quad-Plus back


FET-MX8MPQ-SMARC System on Module Basic Features

CPU

NXP i.MX 8M Plus

Architecture

4x [email protected] + 1x Cortex-M7@800MHz

RAM

2GB/4GB LPDDR4

ROM

16GB/32GB eMMC

Supply Voltage DC 5V

Operating temp

-40℃~+85℃

Connection

SMARC2.1, MXM3 Edge Connector(314 pins, 0.5mm pitch)

OS version

Linux 6.1.36

Dimension

82mm x 50mm


FET-MX8MPQ-SMARC System on Module Functional Parameters

Peripheral

NUM

Spec.

USB 3.0

2

Contains 2 USB3.0/ 2.0 controllers integrated with PHY

USB 2.0

5

Highspeed (HS), Full-speed (FS), and Low-speed (LS)

MIPI CSI

2

2x 4-lane MIPI-CSI, up to 1.5 Gbps

MIPI DSI

1

1x 4-lane MIPI-DSI, up to 1.5 Gbps

1080 p60 • WUXGA (1920x1200) at 60 Hz

1920x1440 at 60 Hz

UWHD (2560x1080) at 60 Hz

WQHD (2560x1440) by reduced blanking mode

LVDS

2

Up to 1920x1080p60

HDMI

1

Up to 4kp30

Ethernet

2

EMAC, 10/100/1000 Mbps, 1 is capable of TSN

PCIE x1

1

PCI Express Gen 3

CAN-FD

2

Complies with CAN 2.0B, ISO 11898-1

SDIO

1

SDIO 3.0

I2S

2

SAI, supports I2S, AC97, tdM and codec/DSP

SPI

2

Up to 52Mbit/s,master and slave are configurable

I2C

5

Up to 320kbps

UART

4

Up to 4Mbps

PWM

3

16-bit timer

GPIO

>14

General-purpose input/output (GPIO) modules with interrupt capability

WIFI & BT

1

WiFi 5 MIMO, Bluetooth 5.3, connected to processor by SDIO3.0 and UART

JTAG

1

IEEE 1149.1 testability (JTAG)

▊ Carrier Board


NXP i.MX 8M Plus SMARC Development Board
OK-MX8MPQ-SMARC Development Board

To minimize your development workload, we can provide starter kits that can be used as complete development platforms for evaluation and application development.
The OK-MX8MPQ-SMARC Single Board Computer from Forlinx is powered by the NXP i.MX 8M Plus processor, which features 4x [email protected] + 1x Cortex-M7, 2GB/4GB LPDDR4 RAM, and 16GB/32GB eMMC ROM. With a split design and 314 pins, it offers seamless functionality and easy customization, and supports the Linux 6.1.36 system. With an open system architecture design, it can provide technical information for your secondary development.




OK-MX8MPQ-SMARC Single Board Computer Features

Peripheral interfaces

NUM

Spec.

USB 3.0

1

USB Type A, only for HOST, with over-voltage and over-current protection;

USB 2.0

3

USB Type A, only for HOST, with over-voltage and over-current protection;

USB 2.0 OTG

1

USB Type C, HOST / SLAVE switchable by DIP, with over-voltage and over-current protection;

MIPI CSI

2

CSI1: daA3840-30mc-IMX8MP-EVK, 3840X2160;

CSI0: dual data lanes, by 26Pin FPC connector;OV5645 is well supported;

Complies with SMARC, SBC can support DSI0 mode and LVDS0 mode controlled by Switch chip;

4-lane MIPI DSI by FPC connector;

Fit with Forlinx 7'' MIPI-DSI module with resolution of 1024 x 600@30fps;

LVDS

2

Complies with SMARC, SBC can support DSI0 mode and LVDS0 mode controlled by Switch chip;

Supports 2x 4-lane LVDS with 1080P, LVDS0 and DSI0 with shared data bit;

Fit with Forlinx 10.1'' LVDS module;

HDMI

1

HDMI 2.0a, up to 3840 x 2160@30fps;

Ethernet

2

10/100/1000Mbps adaptive, RJ45 connector, 1 supports TSN;

Carrier board is with PCIe X1 slot, complies with PCI Express Gen3;

TF Card

1

1x SDIO, supports UHS-I TF card, up to 104MB/s;

4G/5G

1

Carrier board is preserved with M.2 B-KEY slot, 4G and 5G are alternative;

Recommended 4G model: EC20/ EC25;Recommended 5G module: RM500Q;

On-board MicroSIM card slot;

I2S

2

1x I2S connected to CODEC for audio;

1x I2S by pin headers for user's expanding;

Audio

1

On-board NAU88C22YG, I2S;

Supports Phone and MIC, by 1x 3.5mm jack;

Supports 2x 1W 8Ω speaker, by XH2.54 whiter header;

CAN FD

2

Industrial isolated CAN FD chip, up to 8Mbps;

Complies with CAN2.0B, by DG128 green header;

RS485

2

Industrial isolated RS485, up to 4Mbps, by DG128 green header;

QSPI

1

2x 16MB FLASH, one based on QSPI;

SPI

1

2x 16MB FLASH, one based on SPI;

Can be configured to SPI booting mode;

RTC

1

Complies with SMARC, equipped with one CR2032 cell

I2C

4

Can be mounted with audio, camera, TP and other related devices;

Debug UART

2

2 UARTs converted to 1 USB for debug device;

UART1 and UART2 on carrier board are used as Debug ports;

UART

2

UART0 and UART3 are used for RS485;

PWM

5

For display backlight control and LED breathing;

GPIO


By pin headers, contains some special functional pins defined according to SMARC standard;

▊ Download


Catalog: Forlinx Catalog

Product Brief: FET-MX8MPQ-SMARC SoM and OK-MX8MPQ-SMARC SBC introduction

▊ Accessories


Please click here to get more information about the supported modules and accessories.

▊ Technical Support


1. Files to be provided after buying

Hardware related: datasheet, user guide, carrier board schematic, carrier board PCB, SoM pinmux;

Firmware related: OS image, testing demo, source code, manual;

Compiling environment

2. Fast response after-sale technical support service


Contact Us

Welcome to get in touch with us, our experts will reply to your email within 24 hours.

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▊ How To Buy


1. Order Online

We have an online store on Alibaba, please contact us for details.

2. Order Offline

Please send your inquiry to [email protected];

3. Payment Terms

100% T/T in advance.

▊ Shipment


1. Delivery: Goods will be shipped by express upon the receipt of the payment;

2. Lead time: Goods will be shipped out within five working days for sample orders and 6 weeks for bulk orders;

3. Shipping charge: Buyers should bear the shipping cost.

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