FET3572-C System on Module
CPU: Rockchip RK3572
Architecture: 2x [email protected] + 6x [email protected]
Frequency: [email protected]，[email protected]
RAM: 2GB / 4GB / 8GB LPDDR5
ROM: 64GB eMMC
System: Android 16，ForlinxDesktop 24.04，Linux 6.12，Debian 13
Rockchip RK3572 System on Module - 8-Core AIoT Platform with 4 TOPS NPU
Empower your next-generation industrial and AIoT applications with the Forlinx FET3572-C System on Module (SoM) / Computer on Module. Powered by the advanced Rockchip RK3572 processor with an 8-core heterogeneous architecture (2x Cortex-A73 + 6x Cortex-A53) and an integrated 4 TOPS NPU, it delivers robust computing power for complex edge workloads.
Engineered with a high-throughput architecture featuring dual Gigabit Ethernet, PCIe 2.1, and a unique DSMC parallel bus, the FET3572-C simplifies ARM-to-FPGA/DSP interconnects. Fully tested for rigorous environments, it guarantees 10-15 years of longevity to secure your long-term production lifecycle.
Highlights:
- Advanced Heterogeneous Compute: 2x Cortex-A73 @2.2GHz + 6x Cortex-A53 @2.1GHz with high-speed LPDDR5 support.
- 4 TOPS Embedded AI: Versatile NPU supporting mixed-precision ( INT4/INT8/INT16/FP16/BF16) and popular AI frameworks.
- Industrial Interconnect: Unique DSMC parallel bus, 4x CAN-FD, 12x UART (supporting native RS485 mode), 2x GbE, and 3x Combo SerDes lanes.
- Future-Proof Upgrade: Pin-compatible with the FET3576-C SoM, allowing seamless performance scaling without redesigning your carrier board.
- True Industrial Reliability: Available in Industrial Grade (-40°C to +85°C) with 10-15 years supply assurance.
FET3572-C SoM
Rockchip RK3572, an AIoT SoC that balances high performance, low power consumption, and full-stack AI capability.
Rockchip Strategic Partnership
Delivering Enterprise-Grade AIoT Solutions
As a strategic partner of Rockchip, Forlinx Embedded has won multiple awards, including the Rockchip 2024 Outstanding Cooperation Award and 2025 Best Contribution Award.
Over the years, it has developed a series of mature embedded SoMs based on processors like
RV1126B, RK3576, RK3562, RK3506,
RK3588 , RK3568, and RK3399.
Building on this collaboration, Forlinx Embedded now introduces the FET3572‑C SoM, marking a new phase in its partnership with Rockchip.
Facing the opportunities of the mobile intelligence era, we will continue to work together to deliver superior products and services, creating greater value for customers and the industry.
Octa‑Core High‑Performance Ultra‑HD Decoding AI Chip
RK3572 is an octa-core SoC based on 8nm technology launched by Rockchip in 2026. With a 4 TOPS NPU, 8K decoding, industrial-grade interfaces and low power consumption, it fills the mid‑range performance gap between RK3568 and RK3576, offering a cost-effective solution for AIoT and edge computing.
Rich Display Capabilities
RK3572 supports versatile display interfaces including HDMI, eDP, RGB, EBC, and MIPI DSI, enabling dual-screen setups such as 4K@60 Hz + 2K@60 Hz. HDMI and eDP support up to 4K@60 Hz, RGB supports 1920×1080@60 Hz, and EBC resolution reaches 1872×1404.
4TOPS NPU Empowering AI Capabilities
Equipped with an in-house 4 TOPS NPU that supports mixed precision (INT4/INT8/INT16/FP4/FP8/FP16/BF16) and W4A16 asymmetric MAC operations. It is compatible with mainstream AI frameworks (TensorFlow, Caffe, TFLite, PyTorch, ONNX, Android NN, MXNet) and backed by the user-friendly RKNN toolchain.
DSMC Parallel Bus
Seamless FPGA Integration
Supports 16‑bit/32‑bit bus widths, delivering high data throughput and read/write rates. It enables stable, high-speed communication between ARM and FPGA, simplifies hardware/software integration, and meets demanding embedded applications requiring large data transfers and low-latency real-time exchange.
Ultra-Low Power Consumption
Down to 1.3W
Based on an 8 nm process and smart big-little core scheduling, RK3572 doubles the performance of the previous-generation mid-range platform.With dynamic voltage scaling, its idle power consumption can drop to as low as 1.3W under no-load conditions. Typical-scenario power consumption is reduced by over 50%, making the SoC well-suited for fan-less designs and battery-powered devices.
Enhanced System Security
RK3572 features a built-in TEE that isolates secure computing resources, along with a hardware encryption engine supporting mainstream cryptographic algorithms. A complete secure boot mechanism validates firmware integrity, preventing tampering and unauthorized flashing to protect device operation and user data.
ISP Improves Image Quality
RK3572 integrates a professional 12 MP ISP supporting 4096×3072 high-definition imaging. It provides advanced edge-side AI processing including AI-HDR, AI picture quality enhancement, super-resolution, intelligent noise reduction, sharpening, dehazing, distortion correction, voice recognition, and 3DNR. This hardware-software synergy elevates imaging and audiovisual performance, making it ideal for AIoT smart devices.
Continuously Updated User Resources
Broad Industry Applications
It is versatile, suitable for
industrial control , power & new energy, AIoT, medical, and other sectors.
With high performance, extensive interfaces, industrial-grade reliability, competitive pricing, and full after-sales support, it accelerates product time-to-market.
SoM Mechanical Dimensions
▊ Hardware Features
| FET3572-C System On Module Basic Parameters | |
|---|---|
| Processor | Rockchip RK3572 |
| ARM：2×Cortex-A73 + 2×Cortex-A53+ 4×Cortex-A53 | |
| NPU：4TOPS INT8，supporting INT4/INT8/INT16/FP4/FP8/FP16/BF16 | |
| GPU：ARM Mali-G310V2 Mc1, supporting OpenGL ES 1.1/2.0/3.2, OpenCL3.0, Vulkan 1.4 | |
| VPU： | |
| Hardware Encoding：H.264, H265, 4K@60fps | |
| Hardware Decoding：H.264, H.265, VP9, AV1, AVS2, 8K@30fps or 4K@120fps | |
| RAM | 2GB/4GB/8GB LPDDR5 |
| ROM | 64GB eMMC |
| Operating Temperature | FET3572-C SoM：0℃~+80℃ |
| FET3572J-C SoM：-40℃~+85℃ | |
| Operating Voltage | DC 5V-13V |
| Connection | Board-to-board connector (4 × 100Pin, pin pitch 0.4mm, combined height 1.5mm) |
| OS | Linux 6.12, Forlinx Desktop 24.04（R&D), Android 16（R&D), Debian13（R&D） |
| Flashing | USB OTG |
| TF card | |
| FET3572-C System On Module Function Parameters | ||
|---|---|---|
| Function | QTY | Spec. |
| MIPI CSI | 2 | 2 × MIPI CSI-2 interfaces, each supporting 4 data lanes D-PHY v1.2 (2.5 Gbps); |
| Each 4-lane interface can be split into two 2-lane configurations; | ||
| Maximum of four 2-lane cameras supported. | ||
| DVP | 1 | Standard DVP interface (8-bit / 10-bit / 12-bit / 16-bit, up to 150 MHz); |
| Supports BT.601, BT.656, and BT.1120 VI interfaces. | ||
| HDMI/eDP TX | 1 | Supports 1 × multiplexed HDMI and eDP interface; |
| HDMI 2.1 interface supports up to 4 lanes × 6 Gbps, up to 4K @ 60 Hz, and HDCP 2.3; | ||
| eDP 1.3 interface supports up to 4 lanes × 5.4 Gbps, up to 4K @ 60 Hz, and HDCP 1.3. | ||
| MIPI DSI | 1 | 1 × MIPI DSI 1.2: Up to 4 lanes × 2.5 Gbps; |
| PARA | 1 | Parallel display interface: |
| RGB (up to 8-bit) / BT.656 / BT.1120; | ||
| Maximum resolution: 1920 × 1080 @ 60 Hz. | ||
| EBC | 1 | E-ink EPD (Electronic Paper Display) support; |
| Supports hardware decoding up to 1872 × 1404 resolution; | ||
| 16-bit data bus bandwidth. | ||
| SAI | Up to 5 | SAI 0/1/4: 4 TX lanes + 4 RX lanes; |
| SAI 2/3: 1 TX lane + 1 RX lane; | ||
| Maximum sample rate: 192 kHz; | ||
| Audio resolution: 16-bit to 32-bit. | ||
| SPDIF TX | Up to 2 | 2 × S/PDIF TX interfaces; |
| SPDIF RX | 1 | 1 × S/PDIF RX interface; |
| PDM | 1 | Up to 8 channels, audio resolution: 16-bit to 24-bit, sample rate: up to 192 kHz; |
| Supports PDM master receive mode. | ||
| Ethernet | Up to 2 | 2 × GMAC with RGMII / RMII interfaces; |
| Data rates: 10 / 100 / 1000 Mbps. | ||
| Combo High-Speed Interface | 3 | 2 × single-lane combo interfaces (PCIe 2.1 / SATA 3.1 / USB 3.0); |
| 1 × single-lane combo interface (PCIe 2.1 / SATA 3.1). | ||
| USB 2.0 OTG | 2 | 2 × USB 2.0 OTG interfaces. |
| SDIO | Up to 2 | SDIO 3.0, 4-bit data bus width. |
| SPI | Up to 5 | 2 chip-selects (CS) per channel; |
| Configurable as serial-master or serial-slave. | ||
| I2C | Up to 9 | Supports 7-bit and 10-bit address modes; |
| Data rate: 100 kbps in standard mode and 400 kbps in fast mode. | ||
| I3C | 1 | Supports 1 × I3C master interface. |
| UART | Up to 12 | Built-in 2 × 64-byte FIFO (separate TX/RX); |
| Supports 5-, 6-, 7-, 8-bit serial data transmission; | ||
| Baud rate up to 4 Mbps; | ||
| 12 × UART all support auto-flow-control (AFC) mode; | ||
| 12 × UART all support RS-485 mode. | ||
| CAN FD | Up to 4 | Compliant with CAN & CAN FD specifications; |
| Supports standard & extended frame transmission; | ||
| 8192-word receive FIFO. | ||
| DSMC | 1 | Up to 4 chip-selects (CS); |
| Supports 8-bit and 16-bit transfer modes; | ||
| Configurable address width: 16-bit or 32-bit. | ||
| PWM | Up to 16 | Supports up to 16 on-chip PWM channels with interrupt-based operation and capture mode. |
| ADC | Up to 8 | 8 × 12-bit single-ended ADC inputs, sample rate up to 1 MS/s. |
| GPIO | n | All GPIOs can be used to generate interrupts; |
| Supports level-triggered and edge-triggered interrupts; | ||
| Configurable trigger polarity (level/edge); | ||
| Supports rising-edge, falling-edge, and both-edge triggering; | ||
| Configurable pull-up / pull-down (weak pull-up / pull-down); | ||
| Configurable drive strength. | ||
Note*: The parameters listed above are based on hardware design or theoretical CPU limits. Interfaces may be multiplexed; numbers represent maximum theoretical availability.
Build Faster with OK3572-C Development Board
Skip the complexity of hardware design with the OK3572-C development board. This production-ready platform combines a proven SoM + Carrier architecture, allowing you to bypass low-level circuitry and focus entirely on your software. Seamlessly transition from initial concept to mass production with minimal risk and versatile cross-platform OS support.
▊ Accessories
Please click here to get more information about the supported modules and accessories.
▊ Documentation
Reference Manuals
Hardware Related
Product Datasheet
User Guide
Carrier Board Schematic
Carrier Board PCB
SoM Pinmux
Software & BSP
OS Image
Testing Demo
Source Code
Manual
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