Forlinx FET527N-UP4 SoM: Allwinner T527 Industrial AI System-on-Module
The FET527N-UP4 System-on-Module (SoM) is powered by the Allwinner T527 series high-performance processor, featuring a robust multi-core architecture with eight ARM Cortex-A55 cores, one RISC-V core, and one HiFi4 DSP core. Engineered for advanced edge intelligence, it integrates a 2 TOPS NPU to deliver efficient AI acceleration. Validated through rigorous industrial-grade testing at the Forlinx Embedded Laboratory, this module ensures uncompromising reliability and is backed by a 10 to 15-year supply longevity to secure your long-term product lifecycle.
Highlights:
- Heterogeneous Compute & AI: Eight ARM Cortex-A55 cores, a RISC-V core, and a HiFi4 DSP, paired with a 2 TOPS NPU for powerful edge AI acceleration.
- Multimedia & Vision: Supports 4K high-definition hardware decoding and features five display interfaces ( MIPI DSI, RGB, LVDS, eDP, HDMI) with dual-screen heterogeneous display capability.
- High-Speed Interconnects: Equipped with rich industrial bus interfaces including PCIe 2.1, USB 3.1, and CAN.
- Compact Form Factor: Integrates an LCC+LGA package to facilitate easy integration into space-constrained products.
- Universal Compatibility: Standardized package structure ensures seamless compatibility with the broader UP4 series of SoMs.
FET527N-UP4 SoM
Powered by the Allwinner T527 processor, the FET527N-UP4 is an octa-core industrial SoM featuring a 2 TOPS NPU,
dual-display output across 5 display interfaces, rich high-speed I/O (PCIe 2.1/USB 3.1),
and a 10–15 year long-term supply for reliable UP4-compatible edge AI solutions.
What is the UP4 Package?
UP4 is a standardized System-on-Module (SoM) footprint defined by Forlinx Embedded.
"UP" stands for Universal Package, and "4" indicates its 40mm × 40mm physical form factor.
The package features a 487-pin hybrid LCC (Castellated Holes) + LGA (Land Grid Array) layout.
Core Advantages of UP4 SoM
The UP4 System-on-Module (SoM) series establishes an open hardware standard for seamless interchangeability.
By unifying physical dimensions, footprint design, and pin assignments, it significantly reduces embedded development complexity and project risk.
Flexible Supply Chain Options
The SoMs can integrate processors from different vendors, reducing chip supply risks.
▊ Hardware Features
| T527N-UP4 System on Module Basic Features | ||
|---|---|---|
| Processor | SOC | Allwinner T527N |
| ARM | 4×[email protected] + 4×[email protected] | |
| RISC-V | 200MHz | |
| DSP | 600MHz HiFi4 | |
| NPU | 2 TOPS, supporting INT8/INT16 precision, and 40 operators (including Conv, Activation, Pooling, etc.) and custom operators. | |
| GPU | ARM G57 MC1 | |
| VPU (Decode) | Hardware Decoding: H.265, 4K@60fps; H.264; 4K@30fps | |
| VPU (Encode) | Hardware Encoding: H.264; 4K@25fps | |
| RAM | 2GB / 4GB LPDDR4 | |
| ROM | 16GB / 32GB eMMC | |
| Operating Temperature |
Industrial level: -40℃ ~ +85℃, Temperature range: -25℃ ~ +85℃ |
|
| Operating Voltage | DC 5V | |
| Connection | LCC + LGA (487 pins, pin center pitch of stamp hole is 1mm, single pin size: 0.7 * 0.6mm, ball pitch of LGA is 1.27 mm, single ball diameter is 0.8mm) | |
| Dimension | 40mm × 40mm | |
| OS | Linux 5.15.104 + QT 5.12.5 | |
| System Flashing Method |
• TF card • USB OTG |
|
| T527N-UP4 System On Module Function Parameters | ||||
|---|---|---|---|---|
| Function | Max Number | Maximum Capacity Parameter | UP4 Resources | UP4 Parameter |
| Parallel CSI | 1 | Supports 8/10/12/16-bit widths; ITU-R BT.656 up to 4*720P@30fps, and ITU-R BT.1120 up to 4*1080P@30fps | / | |
| MIPI CSI | ≤4 | 8M@30fps RAW12 2F-WDR, maximum size 3264(H) x 2448(V), supported lane configurations 4+4-lane, 4+2+2-lane, or 2+2+2+2-lane | 3 | 8M@30fps RAW12 2F-WDR, maximum size 3264(H) x 2448(V), supported lane configurations 4+2+2-lane |
| MIPI DSI | ≤2 | Supports 4-lane MIPI DSI, 1280 x 720@60fps and 1920 x 1200@60fps; Supports 4+4-lane MIPI DSI, 2560x1600@60fps, 3840x2160@45fps, 4096 x 2160@45fps | 1 | Supports 4-lane MIPI DSI, 1280 x 720@60fps and 1920 x 1200@60fps |
| RGB | ≤2 | TCON_LCD0 supportsDE/SYNC mode, 1920 x 1080@60fps; TCON_LCD2 supports DE/SYNC mode, 1280x720@60fps | / | |
| LVDS | ≤2 | Supports dual link 1920 x 1080@60fps, single link 1366 x 768@60fps; | 1 | Supports dual link 1920 x 1080@60fps, single link 1366 x 768@60fps; |
| eDP1.3 | 1 | Supports 2.5K @ 60 fps and 4K @ 30 fps; Supports audio, maximum sampling rate 192 kHz. | 1 | Supports 2.5K @ 60 fps and 4K @ 30 fps; Supports audio, maximum sampling rate 192 kHz. |
| HDMI2.0 | 1 | Supports 2D display at 4K @ 60 fps, 3D display at 4K @ 30 fps; Supports audio, maximum sampling rate 192 kHz. | 1 | Supports 2D display at 4K @ 60 fps, 3D display at 4K @ 30 fps; Supports audio, maximum sampling rate 192 kHz. |
| Audio Codec | 1 | One stereo headphone output; two differential LINEOUT outputs; three differential MIC inputs. | 1 | One stereo headphone output; two differential LINEOUT outputs; one differential MIC input. |
| I2S/PCM | ≤4 | The sampling rate supports 8kHz to 384kHz. | 1 | The sampling rate supports 8kHz to 384kHz. |
| DMIC | 1 | Supports 8-channel with sampling rate from 8kHz to 48kHz | / | |
| OWA IN/OUT | 1 | Single line audio | / | |
| CAN | ≤2 | The baud rate is up to 1Mbps | 2 | The baud rate is up to 1Mbps |
| USB | ≤3 |
USB0: USB2.0 OTG, 480Mbps USB1: USB2.0 Host, 480Mbps USB2-U2: USB3.1 OTG, 480Mbps USB2-U3: USB3.1 OTG, 5Gbps |
3 |
1×USB3.0, supporting OTG; 1×USB2.0 supporting OTG; 1×USB2.0HOST |
| PCIe2.1 | 1 | RC mode only, 1-lane, 5Gbps | / | |
| SDIO | ≤2 |
SDC0: for SD card, up to 200 MHz in SDR mode SDC 1: SDIO 3.0, up to 200 MHz in SDR mode |
2 |
SDC0: for SD card, up to 200 MHz in SDR mode SDC 1: SDIO 3.0, up to 200 MHz in SDR mode |
| SPI | ≤4 |
SPI0: Supports SPI master/slave mode, up to 100 MHz; SPI2: Supports SPI master/slave mode, up to 100 MHz; S_SPI0: Supports SPI master/slave mode, up to 100 MHz; SPI1: Supports SPI mode and DBI mode (Display Bus Interface). |
2 |
SPI2: Supports SPI master/slave mode, up to 100 MHz; SPI1: Supports SPI mode and DBI mode (Display Bus Interface). |
| TWI | ≤8 | Compatible with I2C standard, standard mode 100 kbit/s, fast mode 400 kbit/s | 3 | Standard mode 100 kbit/s, fast mode 400 kbit/s |
| UART | ≤10 | Compatible with industry standard 16450/16550. | 3 | Compatible with industry standard 16450/16550. |
| GMAC | ≤2 | Supports RMII/RGMII interface and rate 10/100/1000 Mbit/s | 2 | Supports RMII/RGMII interface and rate 10/100/1000 Mbit/s |
| GPADC | 14 | 12-bit sampling resolution and 10-bit accuracy, maximum sampling rate 1MHz | 3 | 12-bit sampling resolution and 10-bit accuracy, maximum sampling rate 1MHz |
| LRADC | 2 | 6-bit sampling resolution, 2KHz sampling rate, used for key detection | 1 | 6-bit sampling resolution, 2KHz sampling rate, used for key detection |
| PWM | ≤30 | Output frequency 0~24MHz or 0~100MHz | 3 | Output frequency 0~24MHz or 0~100MHz |
| CIR TX/RX | 1 | Infrared signal sending/receiving | / | |
Note*: The maximum number of parameters in the table is the theoretical value of hardware design or CPU; The number of interface resources defined by UP4 in the table is the maximum number supported by the UP4 universal package.
▊ Carrier Board
|
|
| T527N-UP4 Development Board Function Parameters | ||
|---|---|---|
| Function | Quantity | Parameter |
| WiFi & Bluetooth | 1 | Single antenna 2.4G & 5GHz Wi-Fi Dual-band 1X1 802.11ac + Bluetooth 4.2 |
| Audio | 2 | Mono speaker connector, class-D, 1.3 W; Stereo headphone output, 32 Ohm load; Headphone recording + on-board MIC recording |
| MIPI-CSI | 3 | FPC socket is led out, 4lane + 2lane + 2lane, of which 4lane can be connected to 4-to-4 analog camera module |
| TF Card | 1 | Data rate up to SDR104; |
| 4G | 1 | Supports 4G modules with a miniPCIE interface, integrating USB2.0 communication signals. |
| UART Debug | 1 | Integrated into a single Type-C port, enabling connection to a PC for debugging. |
| USB3.0 | 1 | USB_A can switch the master-slave mode and perform USB programming, while USB_C only supports the master mode. |
| USB2.0 | 2 | 1 x USB-D native USB2.0 and 1 x USB-HUB are led out |
| Ethernet | 2 | 2 x Gigabit ports led out via a standard RJ45 socket |
| HDMI | 1 | Supports HDMI 2.1 resolution up to 4096× 2304 @ 60Hz |
| EDP | 1 | Supports eDP 1.3 resolution up to 2560× 1600 @ 60Hz |
| MIPI-DSI | 2 | 4-lane MIPI-DSI, supporting capacitive touch screen and backlight brightness adjustment. The maximum resolution of a single channel is 1920 × 1080@60Hz, and the maximum resolution of dual channels is 2560×1600@60Hz. |
| RTC | 1 | On-board CR1220 battery, keep going when power is off |
| LVDS | 1 | 4-lane LVDS, supporting capacitive touch screen and backlight brightness adjustment, up to 1280×800@60Hz |
| RS485 | 2 | Electrical quarantine |
| CAN | 2 | Supports CAN2.0B, electrical quarantine |
| ADC | 3 | Led out from the pin header and can be connected to the on-board sliding rheostat |
| SPI | 2 | Two SPI interfaces, which are led out from the simple bull seat and can be connected to the peripheral debugging function. |
| UART | 1 | 5 x UART, led out through pin headers. |
| JTAG | 1 | JTAG, led out through pin |
| KEY ADC | 5 | 5 keys are led out via 1 x LRADC |
▊ Accessories
Please click here to get more information about the supported modules and accessories.
▊ Documentation
Reference Manuals
Hardware Related
Product Datasheet
User Guide
Carrier Board Schematic
Carrier Board PCB
SoM Pinmux
Software & BSP
OS Image
Testing Demo
Source Code
Manual
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