Forlinx FET3568-UP4 / FET3568J-UP4 SoM: Rockchip RK3568 AIoT & Industrial System-on-Module
The FET3568-UP4 and FET3568J-UP4 System-on-Modules (SoMs) are engineered around the high-performance, low-power Rockchip RK3568B2 and RK3568J processors. Built specifically for AIoT and industrial markets, they feature a quad-core 64-bit ARM Cortex-A55 architecture running at up to 2.0 GHz. These modules maximize the exposure of the processor's functional pins to facilitate seamless evaluation and secondary development. Having undergone rigorous environmental, stability, and aging tests, they guarantee reliable and stable operation in demanding deployments.
Highlights:
- Graphics & AI Processing: 38.4 GFLOPs 800MHz Mali-G52 GPU and a built-in 1 TOPS NPU optimized for AI edge computing applications.
- Vision & Multimedia: Integrated ISP supporting 2x MIPI-CSI cameras, plus comprehensive displays ( HDMI up to 4K, LVDS, MIPI-DSI, RGB, eDP) with triple-screen independent or duplicated output.
- High-Speed Interconnects: Features extensive high-speed expansion including 2x PCIe 3.0, 3x SATA 3.0, 2x USB 3.0, and Dual Gigabit Ethernet.
- Compact Form Factor: Integrates an LCC+LGA package to facilitate easy integration into space-constrained products.
- Universal Compatibility: Standardized package structure ensures seamless compatibility with the broader UP4 series of SoMs.
FET3568-UP4 / FET3568J-UP4 SoM
Powered by Rockchip RK3568B2/RK3568J processors, the FET3568-UP4 / FET3568J-UP4 is a high-performance AIoT industrial System on Module featuring a 2.0 GHz quad-core Cortex-A55 architecture,
1 TOPS NPU, Mali-G52 GPU, dual Gigabit Ethernet, triple-independent-display support, and rich high-speed I/O (PCIe 3.0/SATA 3.0)
delivering a highly stable, UP4-compatible solution for edge computing and industrial automation.
What is the UP4 Package?
UP4 is a standardized System-on-Module (SoM) footprint defined by Forlinx Embedded.
"UP" stands for Universal Package, and "4" indicates its 40mm × 40mm physical form factor.
The package features a 487-pin hybrid LCC (Castellated Holes) + LGA (Land Grid Array) layout.
Core Advantages of UP4 SoM
The UP4 System-on-Module (SoM) series establishes an open hardware standard for seamless interchangeability.
By unifying physical dimensions, footprint design, and pin assignments, it significantly reduces embedded development complexity and project risk.
Flexible Supply Chain Options
The SoMs can integrate processors from different vendors, reducing chip supply risks.
▊ Hardware Features
| FET3568-UP4 / FET3568J-UP4 System on Module Basic Features | ||
|---|---|---|
| Processor | SOC | Rockchip RK3568B2 / RK3568J |
| CPU | Quad-core [email protected] / 1.8GHz | |
| NPU | 1TOPS, supporting INT8/INT16/FP16/BFP16 mixing operation | |
| GPU | Mali-G52-2EE; OpenGL ES 1.1, 2.0, 3.2, Vulkan 1.0, 1.1, OpenCL 2.0 | |
| VPU (Decode) |
Hardware Decoding： • H.264, H.265, VP9：up to 4096x2304@60fps • VP8：up to 1920x1088@60fps • VC1, MPEG-4, MPEG-2, MPEG-1：up to 1920x1088@60fps • H.263：up to 720x576@60fps |
|
| VPU (Encode) |
Hardware Encoding： • H.264/AVC, H.265/HEVC：up to 1920×1080@60fps |
|
| RAM | 1GB / 2GB / 4GB / 8GB LPDDR4X | |
| ROM | 8GB / 16GB / 32GB / 64GB eMMC | |
| Operating Temperature | -40℃ ~ +85℃ / 0℃ ~ +80℃ | |
| Working Voltage | DC 5V | |
| Connection | LCC + LGA (487 pins, pin center pitch of stamp hole is 1mm, single pin size: 0.7 * 0.6mm, ball pitch of LGA is 1.27 mm, single ball diameter is 0.8mm) | |
| Dimension | 40mm × 40mm | |
| OS | Linux5.10+Qt5.15.8 | |
| System Flashing Method |
• SD card • USB OTG |
|
| FET3568-UP4 / FET3568J-UP4 System On Module Function Parameters | ||||
|---|---|---|---|---|
| Function | Max Number | Maximum Capacity Parameter | UP4 Resources | UP4 Parameter |
| MIPI-DSI | 2 | 2 x 4 - lane MIPI display serial interfaces, supporting MIPI V1.2 version. The maximum resolution of a single channel is 1920×1080@60Hz, and the maximum resolution of dual channels is 2560×1600@60Hz. | 1 | 1 x 4 - lane MIPI display serial interfaces, supporting MIPI V1.2 version. The maximum resolution of a single channel is 1920×1080@60Hz, and the maximum resolution of dual channels is 2560×1600@60Hz. |
| HDMI | 1 | Supports HDMI 2.0 with resolutions up to 1080p @ 120Hz or 4096 × 2304 @ 60Hz | 1 | Supports HDMI 2.0 with resolutions up to 1080p @ 120Hz or 4096 × 2304 @ 60Hz |
| LVDS | 1 | Single lane（4 lanes）supports 1280×800@60Hz | 1 | Single lane（4 lanes）supports 1280×800@60Hz |
| eDP | 1 | 1 x 4-lane eDP display interface, supporting eDP V1.3, and the maximum resolution is 2560×1600@60Hz | 1 | 1 x 4-lane eDP display interface, supports eDP V1.3, and the maximum resolution is 2560×1600@60Hz |
| RGB | 1 | Supports RGB 888, maximum resolution 1280 x 800 | 1 | Supports RGB 888, maximum resolution 1280 * 800 |
| Camera | 3 | Supports 1 x 4 Lanes MIPI-CSI，2 x 2Lanes MIPI-CSI | 2 | Supports 2 x 2Lanes MIPI-CSI |
| IIS | ≤4 | 1×8ch I2S/TDM，2×2ch I2S，1×8ch PDM | / | |
| Audio | 1 |
Built - in codec, which directly outputs audio analog signals with a sampling rate ranging from 48KHz to 192KHz: Mono speaker, class - D, 1.3W; Stereo headphone output with a 32Ohm load; one differential MIC input. |
1 |
Built - in codec, which directly outputs audio analog signals with a sampling rate ranging from 48KHz to 192KHz: Mono speaker, class - D, 1.3W; Stereo headphone output with a 32Ohm load; one differential MIC input. |
| SDIO | ≤2 | SDIO 3.0 with up to 104MB/S data throughput | 2 | SDIO 3.0 with up to 104MB/S data throughput |
| Ethernet | ≤2 | 2 x GMAC, RGMII/RMII interface are routed out | 2 | 2 x GMAC, RGMII/RMII interface are routed out |
| USB 2.0 | 2 | USB 2.0 Host, independent port, not multiplexed with USB 3.0 | 2 | USB 2.0 Host, independent port, not multiplexed with USB 3.0 |
| USB 3.0 | 2 |
1 x USB 3.0 Host port, which can be used independently as a USB 2.0 Host; 1 x USB 3.0 OTG port, which can be used independently as a USB 2.0 OTG. |
2 |
1 x USB 3.0 Host port, which can be used independently as a USB 2.0 Host; 1 x USB 3.0 OTG port, which can be used independently as a USB 2.0 OTG. ； |
| SATA | ≤3 | SATA 3.0 up to 6.0 Gb/s with eSATA support | / | |
| PCIe2.1 | ≤1 | PCIe 2.1×1，up to 5.0Gbps，RC mode | 1 | PCIe 2.1×1，up to 5.0Gbps，RC mode |
| PCIe3.0 | ≤2 | PCIe 3.0，1×2Lanes or 2×1Lane, up to 8.0 Gbps per Lane; 1Lane supports Root Complex (RC) mode only; 2 Lanes supports Root Complex (RC) and End Point (EP) model. | 1 | PCIe 3.0, 1x2Lanes, up to 8.0 Gbps per Lane; 1Lane supports Root Complex (RC) mode only; 2Lanes supports Root Complex (RC) and End Point (EP) model. |
| UART | ≤10 | Up to 4Mbps | 3 | Up to 4Mbps |
| CAN | ≤3 | Supports CAN2.0 B up to 1Mbps | 2 | Supports CAN2.0 B up to 1Mbps |
| SPI | ≤4 | Support master & slave mode, with configurable software | / | |
| I2C | ≤5 | Supports 7bits and 10bits address modes up to 1 Mbit/s | 3 | Supports 7bits and 10bits address modes up to 1 Mbit/s |
| PWM | ≤16 | 32bits timer/counter | 4 | 32bits timer/counter |
| FSPI | ≤1 | Supports serial NOR Flash/NAND Flash and Boot | / | |
Note*: The maximum number of parameters in the table is the theoretical value of hardware design or CPU; The number of interface resources defined by UP4 in the table is the maximum number supported by the UP4 universal package.
▊ Carrier Board
|
|
| OK3568-UP4 / OK3568J-UP4 Development Board Function Parameters | ||
|---|---|---|
| Function | Quantity | Parameter |
| WiFi & Bluetooth | 1 | Single antenna 2.4G & 5GHz Wi-Fi Dual-band 1X1 802.11ac + Bluetooth 4.2 |
| Audio | 1 | Mono speaker connector, class-D, 1.3 W; Stereo headphone output, 32 Ohm load; Headphone recording + on-board MIC recording |
| MIPI-CSI | 3 | Led out from the FPC socket, 4lane+ 2lane+ 2lane |
| TF Card | 1 | Data rate up to SDR104; |
| 4G | 1 | Supports 4G modules with a miniPCIE interface, integrating USB2.0 communication signals. |
| UART Debug | 2 | Integrated into a single Type-C port, enabling connection to a PC for debugging. |
| USB3.0 | 2 | USB_A can switch the master-slave mode and perform USB programming, while USB_C only supports the master mode. |
| USB2.0 | 2 | 1 x USB-D native USB2.0 and 1 x USB-HUB are led out |
| Ethernet | 2 | 2 x Gigabit ports led out via a standard RJ45 socket |
| HDMI | 1 | Supports HDMI 2.1 resolution up to 4096× 2304 @ 60Hz |
| EDP | 1 | Supports eDP 1.3 resolution up to 2560× 1600 @ 60Hz |
| MIPI-DSI | 1 | 4-lane MIPI-DSI, supporting capacitive touch screen and backlight brightness adjustment. The maximum resolution of a single channel is 1920 × 1080@60Hz, and the maximum resolution of dual channels is 2560×1600@60Hz. |
| RTC | 1 | On-board CR1220 battery, keep going when power is off |
| LCD | 1 | RGB888 interface, supporting capacitive touch and resistive touch, and allowing backlight brightness adjustment. The maximum resolution is 1280×800. |
| LVDS | 1 | 4-lane LVDS, supporting capacitive touch screen and backlight brightness adjustment, up to 1280×800@60Hz |
| RS485 | 1 | Electrical quarantine |
| CAN | 2 | Supports CAN2.0B, electrical quarantine |
| ADC | 3 | Led out from the pin header and can be connected to the on-board sliding rheostat |
| UART | 1 | 5 x UART, led out through pin headers. |
| KEY ADC | 5 | 5 keys are led out via 1 x LRADC |
| PCIe | 2 | PCIe _ B 2.1, can only do RC mode, PCIe _ A 3.0, can do EP and RC mode |
▊ Accessories
Please click here to get more information about the supported modules and accessories.
▊ Documentation
Reference Manuals
Hardware Related
Product Datasheet
User Guide
Carrier Board Schematic
Carrier Board PCB
SoM Pinmux
Software & BSP
OS Image
Testing Demo
Source Code
Manual
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