Forlinx i.MX6 Quad ​​core board cooling solution reference

Heat dissipation has always been a problem that R&D personnel pay more attention to, especially for high-heating components such as CPUs. The Forlinx embedded FETMX6Q-C core board is based on the i.MX6 Quad processor design of NXP's Cortex-A9 architecture. As a core board equipped with a high-performance quad-core processor, after actual measurement, running the Android system for a long time at room temperature to play high-definition video, the temperature of the processor on the core board is maintained between 50-55 degrees Celsius, which is an ideal range. Of course, many engineers hope that the processor temperature can be lower. At this time, choosing to add a suitable heat sink can not only reduce the temperature of the processor one step further, but also extend the life of the processor.

When choosing a heat sink, you must first consider the needs of the platform, without excessive pursuit of efficiency; secondly, from the perspective of installation, the heat sink and the core board must be simple and firm; finally, considering the economy, the heat sink is only an auxiliary tool after all, and there is no need to choose the cost Too high.

Two specifications of heat sinks are recommended for the Forlinx embedded FETMX6Q-C core board.

The following is a comparison of the data before and after installing the heat sink.

Before installation:

Enter the CPU temperature self-check command, and the display is 51 degrees Celsius

[email protected]_6dq:/ # cat /sys/class/thermal/thermal_zone0/temp               
  After installation

Enter the CPU temperature self-check command, and the display is 45 degrees Celsius

[email protected]_6dq:/ # cat /sys/class/thermal/thermal_zone0/temp               

After experiment, the cooling effect is about 6 degrees Celsius, which is quite impressive.

This heat sink can also be used for OK4418-C development boards and OK4418 development boards for Forlinx Embedded Samsung S5P6818 and S5P6818 series products.