As edge AI moves from proof of concept to full-scale deployment, striking the right balance between efficiency and computing power has become a critical challenge. In key fields such as industrial vision, intelligent security, and lightweight robotics, it's clear that simply relying on algorithmic enhancements or hardware stacking is no longer enough to win the market. What customers truly need is a solution that can steadily process 12‑megapixel video streams under strict power and cost constraints, capture useful detail in ultra‑low‑light conditions down to 0.01 Lux, and rapidly translate technical designs into real‑world products.

3 TOPS NPU: Empowering On‑Device AI Inference

The Rockchip RV1126B processor features a dedicated NPU delivering up to 3 TOPS @ INT8 AI computing power—a 50 % increase over the previous‑generation RV1126. It supports INT8/INT16 mixed‑precision operations, W4A16/W8A16 mixed‑precision quantization, and Transformer model optimization, enabling smooth execution of 2B parameter large language models and multimodal models.

This means the RV1126B can efficiently run a variety of typical edge‑AI recognition models—including face detection, hard‑hat identification, smoke‑and‑fire alerts, and intrusion detection—allowing for real‑time local decision‑making without relying on the cloud.

Multiple models were tested on the Forlinx Embedded OK1126B‑S development board. Below are the measured performance results of the RV1126B's NPU:

Large Language Models & Multimodal Models

Object Detection

Image Segmentation

Human & Facial Keypoint Recognition

The test data clearly shows that the Forlinx OK1126B‑S board equipped with the RV1126B delivers outstanding performance across various models, with particularly noticeable NPU improvements compared to its predecessor.

AI‑ISP: A More Efficient Visual Intelligence Engine

In edge AI systems, obtaining high‑quality image input is fundamental to enhancing perceptual capabilities. Traditional approaches face a bottleneck: the images output by the ISP are already compressed digital signals, making NPU‑based analysis akin to "seeing through a haze". The RV1126B's dedicated AI‑ISP integrates advanced AI algorithms directly into the ISP's raw‑data processing pipeline, achieving the dual goal of "enhancing image quality while pre‑optimizing visuals for AI understanding".

The AI model processes key stages such as 3DNR (3D Digital Noise Reduction), HDR synthesis, distortion correction, and defogging in real time. Combined with AI Remosaic technology, this enables "dual-mode day-night adaptive" imaging, producing not only visually superior images but also "AI-friendly" ones. This lays the optimal foundation for the precise and efficient inference of the backend NPU.

Notably, when running AI-ISP, the RV1126B does not occupy NPU resources, making it more bandwidth- and power-efficient compared to traditional solutions where ISP and NPU are processed together.

Versatility Across Scenarios Empowers Intelligent Upgrades

Rockchip's RV1126B, with its balanced performance, is precisely tailored for diverse edge AI scenarios:

• In smart construction sites, it enables safety monitoring features such as helmet/reflective vest detection, high-altitude object falling recognition, and unauthorized fire warnings;

• In smart warehousing, it efficiently performs tasks like barcode recognition, shelf inventory management, personnel trajectory tracking, and intrusion alerts;

• In industrial vision scenarios, it excels at identifying defects in photovoltaic panels and lithium batteries;

• In automotive applications, it supports DMS (Driver Monitoring Systems);

• For lightweight robots, it enables dynamic obstacle avoidance and path planning.

Translating chip capabilities into stable and reliable products requires a robust hardware carrier and service system. The FET1126B-S/FET1126BJ-S SoM, designed and developed by Forlinx Embedded based on the RV1126B processor series, serves this exact purpose.

The Forlinx Embedded FET1126BJ-S SoM (industrial grade) operates reliably in temperatures ranging from -40°C to 85°C, offering outstanding durability and environmental adaptability. Meanwhile, the FET1126B-S SoM (wide-temperature grade) holds a competitive edge, with commercial-grade configurations meeting operational requirements from -20°C to 85°C. Equipped with high-bandwidth LPDDR4 memory, the board achieves a balance of low cost and wide-temperature performance. Unlike DDR4, which is limited to 0°C–70°C in commercial-grade applications, LPDDR4 commercial-grade chips cover -20°C to 85°C.

Furthermore, Forlinx Embedded provides comprehensive resources—from hardware design to software deployment—along with efficient technical support services. Coupled with a stable supply chain, this significantly shortens project development cycles, reliably helping clients across industries quickly implement solutions and achieve mass production.

Conclusion: Empowering Edge AI with Rockchip's RV1126B

As edge AI transitions from concept to large-scale deployment, Rockchip's RV1126B processor delivers powerful computational support for edge intelligence, precisely addressing the core needs of various scenarios. The Forlinx Embedded FET1126B-S/FET1126BJ-S SoM series acts as a key implementation bridge. It effectively transforms the RV1126B chip capabilities into real-world product performance through robust hardware, algorithmic strengths, reliability, and technical support. Enabling rapid intelligent upgrades across industries, it is a trusted core hardware solution for scalable edge AI deployment.

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