Meet Forlinx Embedded at electronica 2026

Forlinx Embedded at electronica 2026

München, Germany – November 10–13, 2026 — Forlinx Embedded will participate in electronica 2026, one of the world's leading trade fairs for the electronics industry, taking place at the Trade Fair Center at Messe München.

Come visit us at Hall C5, Booth 331 and discover our latest System-on-Modules (SoMs), single board computers (SBCs), embedded control units (FCUs), and application-oriented embedded solutions. From high-performance Edge AI and Embodied AI platforms to industrial automation and IoT applications, Forlinx Embedded is here to help accelerate your project to market with high reliability and long-term product support.

Forlinx Embedded participate in electronica 2026

What to Expect at electronica 2026

1. Next-Generation Platforms & Hardware Launch

Explore our newly unveiled industrial platforms engineered for high-performance edge computing, flexible scalability, and compact efficiency:

  • Qualcomm Dragonwing™ IQ8 & IQ9 Series: High-performance SoMs & SBCs powered by advanced octa-core architectures and high-throughput NPU engines (delivering up to 100+ TOPS), supporting multi-channel 4K/8K video processing and industrial-grade connectivity.
  • NXP i.MX952 Platform (FET-MX952x-C SoM): Built on a heterogeneous architecture ( Cortex-A55 + M7 + M33 cores) featuring a built-in 2 TOPS NPU, advanced Mali-G310 graphics, and ISO 26262 ASIL-B functional safety support for industrial automation.
  • Rockchip RK3588S2 Solution: Highly compact and cost-effective platform tailored for space-constrained edge computing environments.
  • DEEPX AI Accelerator: High-efficiency DX-M1 and DX-M1M NPU modules designed to boost neural network inference performance at the edge.

2. Cutting-Edge Embodied AI Controllers

Discover our flagship FCU series controllers tailored for advanced humanoid and mobile robotics:

  • FCU3031 (NVIDIA® Jetson Thor™): Powered by the next-gen JetPack stack and Blackwell architecture GPU, delivering up to 2,070 FP4 TFLOPS for multi-modal perception and LLM reasoning ("Brain"), paired with rich industrial interfaces ( 10GbE, GMSL2.0, CAN) for real-time motion control ("Cerebellum").
  • FCU3021 (NVIDIA® Jetson Orin™ NX): Delivering up to 157 TOPS of AI power via the full CUDA ecosystem for smart model inference, equipped with active cooling and robust EMC validation to stabilize humanoid and wheeled service robots.

3. Edge AI Solutions in Action

Experience select live demonstrations highlighting our hardware empowering real-world intelligence:

  • Multimodal Vision & Analytics: High-performance multi-camera recognition powered by i.MX9596 + ARA240 and high-density FCU3502 36-Channel video analytics.
  • Smart Interaction & Search: IQ9075 Text-to-Image Search and RAG Digital Human Q&A solutions driven by next-gen edge LLMs.
  • Robotics & Spatial Fusion: FCU3021 Depth Camera + LiDAR Fusion for precise real-time autonomous navigation.

4. Broad Industrial Portfolio

Explore our extensive legacy lineup of reliable SoMs and development boards driven by market leaders including NXP, Rockchip, Texas Instruments, and Allwinner.


Plan Your Visit

Exhibition Details

Event: electronica 2026

Date: November 10–13, 2026

Location: Trade Fair Center at Messe München, Germany

Forlinx Booth: Hall C5, Booth 331

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