FET3562J-UP4 System on Module
CPU: Rockchip RK3562/RK3562J
Architecture: 4×Cortex-A53
Frequency: [email protected]
RAM: 1GB/2GB LPDDR4
ROM: 8GB/16GB eMMC
System: Linux 5.10
FET3562-UP4 / FET3562J-UP4 SoM: Rockchip RK3562 Industrial System-on-Module
The FET3562-UP4 and FET3562J-UP4 System-on-Modules (SoMs) utilize Rockchip RK3562 and RK3562J processors, featuring four ARM Cortex-A53 cores and an embedded 3D GPU. Engineered for industrial automation and consumer electronics, these modules deliver robust graphics performance with support for OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, and Vulkan 1.1, alongside a built-in 2D hardware engine. The plug-and-play board-to-board connection streamlines integration, while rigorous laboratory testing guarantees stability in industrial environments with a 10 to 15-year supply longevity.
Highlights:
- Graphics & AI Processing: 38.4 GFLOPs 800MHz Mali-G52 GPU and a built-in 1 TOPS NPU tailored for AI edge computing applications.
- Multimedia & Display: Features H.265 high-definition hardware decoding and flexible display interfaces including LVDS, MIPI DSI, and RGB.
- Industrial Interconnect: Equipped with rich industrial bus interfaces such as PCIe 2.1, USB 3.0, and CAN.
- Compact Form Factor: Integrates an LCC+LGA package for space-constrained deployments.
- Universal Compatibility: Standardized package structure ensures seamless compatibility with the broader UP4 series of SoMs.
FET3562-UP4 / FET3562J-UP4 SoM
The FET3562-UP4 / FET3562J-UP4 SoM System-on-Module is based on the Rockchip RK3562, a high-performance, low-power, and feature-rich application processor designed for AIoT and industrial markets.
It features a quad-core 64-bit Cortex-A55 at up to 2.0GHz and an integrated NPU.
What is the UP4 Package?
UP4 is a standardized System-on-Module (SoM) footprint defined by Forlinx Embedded.
"UP" stands for Universal Package, and "4" indicates its 40mm × 40mm physical form factor.
The package features a 487-pin hybrid LCC (Castellated Holes) + LGA (Land Grid Array) layout.
Core Advantages of UP4 SoM
The UP4 System-on-Module (SoM) series establishes an open hardware standard for seamless interchangeability.
By unifying physical dimensions, footprint design, and pin assignments, it significantly reduces embedded development complexity and project risk.
Flexible Supply Chain Options
The SoMs can integrate processors from different vendors, reducing chip supply risks.
▊ Hardware Features
| FET3562-UP4 / FET3562J-UP4 System on Module Basic Features | ||
|---|---|---|
| Processor | SOC | Rockchip RK3562J |
| ARM | 4×Cortex-A53 @ 1.8GHz | |
| NPU | 1TOPS INT8, supporting INT4/INT8/INT16/FP16 | |
| GPU | Mali-G52-2EE, supporting OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.0 and 1.1 | |
| VPU (Encode) | Hardware Encoding: H.264, 1920×1080 @ 60fps | |
| VPU (Decode) | Hardware Decoding: H.265/VP9, 4096×2304 @ 30fps; H.264, 1920×1080 @ 60fps | |
| RAM | 1GB / 2GB LPDDR4 | |
| ROM | 8GB / 16GB eMMC | |
| Operating Temperature | -40℃ ~ +85℃ | |
| Working Voltage | DC 5V | |
| Connection | LCC + LGA (487 pins. LCC stamp hole pitch: 1mm, pin size: 0.7×0.6mm; LGA ball pitch: 1.27mm, ball diameter: 0.8mm) | |
| Dimension | 40mm × 40mm | |
| OS | Linux 5.10.198 + QT5.15 | |
| System Flashing Method | SD card, USB OTG | |
| FET3562-UP4 / FET3562J-UP4 System On Module Function Parameters | ||||
|---|---|---|---|---|
| Function | Max Number | Maximum Capacity Parameter | UP4 Resources | UP4 Parameter |
| USB2.0 | 1 | 1× USB2.0 HOST, up to 480Mbps | 1 | 1× USB2.0 HOST, up to 480Mbps |
| UART | ≤10 | Flow control, max baud rate 4Mbps | 3 | A and B channels support flow control, max baud rate 4Mbps |
| SPI | ≤3 | Master and slave modes | 1 | Master and slave modes |
| I2C | ≤5 | Standard mode 100kbit/s, fast mode 400kbit/s | 3 | Standard mode 100kbit/s, fast mode 400kbit/s |
| Ethernet | ≤2 | 1× RGMII, 1× RMII | 2 | 1× RGMII, 1× RMII |
| PCIe | ≤1 | PCIe 2.1, RC mode only, single lane 5Gbps. Alternates with USB3.0 multiplexing | / | / |
| USB3.0 | ≤1 | Master and slave mode. Alternates with PCIe multiplexing | 1 | Master and slave mode |
| ADC | ≤16 | 10-bit resolution, max sampling rate 1MS/s | 3 | 10-bit resolution, max sampling rate 1MS/s |
| Key ADC | - | - | 1 | 6-bit resolution, 2KHz sampling rate (used for key detection) |
| LVDS | ≤1 | VESA/JEIDA format, up to 800×1280 @ 60Hz | / | / |
| MIPI-DSI | ≤1 | 1× TX, 4-lanes, up to 2048×1080 @ 60Hz | 1 | 1× TX, 4-lanes, up to 2048×1080 @ 60Hz |
| RGB | ≤1 | RGB 888 format, up to 1280×800 | / | / |
| MIPI-CSI | 4 | MIPI_CSI_RX0 and RX1 (2 ports total). Single port supports 4-lanes (2.5Gbps/lane), or can split into two 2-lanes | 4 | MIPI_CSI_RX0 and RX1 (2 ports total). Single port supports 4-lanes (2.5Gbps/lane), or can split into two 2-lanes |
| SD card | 1 | SDIO 3.0 protocol, 4-bit data width | 1 | SDIO 3.0 protocol, 4-bit data width |
| SDIO | ≤1 | SDIO 3.0 protocol, 4-bit data width | 1 | SDIO 3.0 protocol, 4-bit data width |
| SAI | ≤2 | I2S, PCM, TDM protocols, sampling rate up to 192kHz | 1 | Sampling rate up to 192kHz |
| Audio | 1 | Built-in codec (48KHz-192KHz). Mono Speaker class-D 1.3W; Stereo headphone 32Ohm load; 2 single-ended MIC inputs | 1 | Built-in codec (48KHz-192KHz). Mono Speaker class-D 1.3W; Stereo headphone 32Ohm load; 2 single-ended MIC inputs |
| PDM | ≤1 | Up to 8 channels, sampling rate up to 192KHz, master receive mode | / | / |
| SPDIF | ≤1 | - | / | - |
| CAN | ≤2 | CAN2.0 B, data rate 1Mbps | 2 | CAN2.0 B, data rate 1Mbps |
| PWM | ≤16 | - | 1 | - |
Note*: The maximum number of parameters in the table is the theoretical value of hardware design or CPU; The number of interface resources defined by UP4 in the table is the maximum number supported by the UP4 universal package.
▊ Carrier Board
|
|
| OK3562-UP4 / OK3562J-UP4 Development Board Function Parameters | ||
|---|---|---|
| Function | Quantity | Parameter |
| WiFi & Bluetooth | 1 | Single antenna 2.4G & 5GHz Wi-Fi (Dual-band 1×1 802.11ac) + Bluetooth 4.2 |
| Audio | 2 | Mono speaker connector (class-D, 1.3W); Stereo headphone output (32 Ohm load); Headphone recording + on-board MIC recording |
| MIPI-CSI | 3 | FPC socket (4-lane + 2-lane + 2-lane), 4-lane can connect to 4-to-4 analog camera module |
| TF Card | 1 | Supports maximum SDR104 rate |
| 4G | 1 | miniPCIE interface, with USB2.0 communication signal |
| UART Debug | 1 | Integrated Type-C port for computer debugging |
| USB3.0 | 1 | USB_A master-slave switchable, supports programming |
| USB2.0 | 1 | Led out via USB_HUB |
| Ethernet | 2 | Led out via standard RJ45 socket (1× Gigabit port, 1× 100M port) |
| MIPI-DSI | 1 | 4-lane MIPI-DSI, supports capacitive touch and backlight adjustment, max resolution 1920×1080 @ 60Hz |
| RTC | 1 | On-board CR1220 battery, keeps time when powered off |
| RS485 | 1 | Electrical isolation |
| CAN | 2 | Supports CAN2.0B, electrical isolation |
| ADC | 3 | Pin header pin-out, connectable to sliding rheostat for voltage collection |
| SPI | 1 | 2× SPI interfaces, led out from pin headers for peripheral debugging |
| UART | 1 | 5× UART, led out via pin headers |
| KEY ADC | 5 | 1× LRADC exports 5 keys |
▊ Accessories
Please click here to get more information about the supported modules and accessories.
▊ Documentation
Reference Manuals
Hardware Related
Product Datasheet
User Guide
Carrier Board Schematic
Carrier Board PCB
SoM Pinmux
Software & BSP
OS Image
Testing Demo
Source Code
Manual
Request a Quote
Fill out the form below for volume pricing or technical specifications. We'll get back to you within 24 hours.
▊ Ordering Information
1. Online Channels: We have an online store on Alibaba and DigiKey. Please contact us for details.
2. Direct Inquiry: For bulk orders, please email our sales team at [email protected].
3. Payment Method: Standard terms: 100% T/T (Telegraphic Transfer) in advance.
1. Dispatch Method: Orders are shipped via international express upon receipt of payment.
2. Lead Time: 5 working days for samples; 6 weeks for bulk orders.
3. Shipping Policy: Shipping and handling fees are the responsibility of the purchaser.
▊ Forlinx Recommended Products
Architecture: Octa-core ARM Cortex-A55 (4+4 cluster)
Frequency: CPU 1.8GHz/1.4GHz | RISC-V 200MHz | DSP 600MHz
RAM: 2GB/4GB LPDDR4
ROM: 16GB / 32GB eMMC
Architecture: Cortex-A55
Frequency: 1.8GHz，2.0GHz
RAM: 1GB / 2GB / 4GB / 8GB LPDDR4X
ROM: 8GB / 16GB / 32GB / 64GB eMMC
Architecture: 2*A55+M33
Frequency: 1.7GHz
RAM: 1GB LPDDR4
ROM: 8GB eMMC
Architecture: 4x [email protected]+RISC-V@600MHz
Frequency: 1.6GHZ
RAM: 1GB/2GB/4GB LPDDR4
ROM: 8GB/16GB/32GB eMMC
