On November 10, electronica – the biennial international trade fair for electronic components and production technology – kicked off at Messe München, Germany. This 2026 edition gathers around 3,500 exhibitors from 60 countries and regions across 18 pavilions, bringing together global semiconductor manufacturers, solution providers and end-user manufacturing enterprises. It stands as a pivotal platform for the electronics industry to track market trends and connect with key resources.

Forlinx Embedded is showcasing at Booth 331, Hall C5, with two core exhibition themes: ''Embodied Intelligence Master & Slave Controllers + On-Device AI Technical Solutions'', presenting the product and technological strength from China to the global market.

Returning to electronica Munich after two years, the focus of Forlinx Embedded's booth has been upgraded from ''product display + industry-specific solutions'' to ''global debut products + embodied intelligence controllers + dynamic demonstrations of cross-platform on-device AI''.

1. Concentrated Showcase of Global Debut Products

The first highlight at the booth is the globally launched SoMs and computing power platforms:

The FET-MX952x-C SoM, built on NXP i.MX952 chip, targets industrial and robotics scenarios that require both real-time control and multimedia processing.

The all-new FET3588S2-C SoM inherits the RK3588 platform's advantages in high-performance interfaces and computing power, offering end devices greater expansion space in display and multi-channel data access.

The DEEPX DX-M1/M1M computing card adopts the M.2 standard interface, delivering 25 TOPS INT8 computing power while keeping typical power consumption at 3W~5W. It is suitable for a wide range of scenarios including local visual inference, security surveillance, autonomous driving and consumer electronics.

2. Embodied Intelligence Master & Slave Controllers

The second highlight is new products in the embodied intelligence field: The FCU3021 Embodied Intelligence Master & Slave Controller (up to 157 TOPS) developed based on NVIDIA Jetson Orin NX, and the FCU3031 Embodied Intelligence Master & Slave Controller (up to 2070 TFLOPS) based on the new-generation Jetson AGX Thor, are both first-time releases from Forlinx Embedded. Tailored for robots' integrated demand for ''large model inference + real-time motion control'', the two products provide an all-in-one computing platform for robots with different computing power tiers.

3. Comprehensive On-Device AI Solution Matrix

While the embodied intelligence master & slave controllers address the question of ''where to deploy computing power'', the on-device AI solution matrix answers ''what the computing power is used for'':

i.MX9596 + ARA240 Monocular Multi-Modal Intelligent Vision Solution: Assigns ''detection'' and ''understanding'' to different computing units, leveraging the real-time control capability of i.MX9596 and the AI acceleration capability of ARA240 to achieve multi-modal scene understanding with monocular vision.

RV1126B Fisheye Panoramic Stitching Intelligent Recognition Solution: Designed for wide-angle surveillance and robot surround-view needs, it completes front-end closed-loop processing including fisheye correction, panoramic stitching and target recognition on a low-power platform.

FCU3502 36-Channel Multi-Algorithm Intelligent Solution: Based on the dual computing architecture of RK3588 + RK1828, it supports access to 36 cameras, with built-in multiple algorithms that can be independently configured per channel, targeting large-scale parallel inference scenarios in security, energy and production line vision.

RK3576 AMP + FPGA 64-Channel Power Data Acquisition Solution: Adopts a heterogeneous collaborative design, where FPGA undertakes hard real-time synchronous acquisition, and the RK3576 multi-core processor handles protocol processing and visualization. It can be applied to scenarios such as multi-interval monitoring of ring main unit DTU and high-precision power monitoring at industrial sites.

FCU3021 Depth Camera + LiDAR Fusion Solution: Directly connects depth vision and LiDAR point cloud to the embodied intelligence controller, which can be used for near-field 3D environmental perception and interaction of robots.

RAG Digital Human Intelligent Q&A Solution: Completes speech recognition, retrieval-augmented generation and digital human driving on the on-device side, with the entire workflow closed locally without relying on the cloud, suitable for interactive scenarios with strict requirements for data privacy and response latency.

This solution matrix covers multiple chip platforms including Rockchip, NXP and NVIDIA, spanning directions from visual perception to power data collection, multi-algorithm fusion to large model applications. Every solution is dynamically demonstrated on-site at the booth, allowing visitors to view up close and get hands-on experience.

4. Communication and Support from Model Selection to Mass Production

On the first day of the exhibition, Forlinx Embedded's technical team engaged in one-on-one exchanges with global clients and partners at the booth, focusing on topics such as computing power selection, multi-sensor fusion, cross-platform solution adaptation and mass production implementation. All products and solutions are available for viewing, demonstration and in-depth discussion.

electronica 2026 has newly set up the edge lab LIVE! edge technology zone in Hall C5, which focuses on edge computing and embedded implementation, with on-device AI as one of the key topics. Leveraging this platform, Forlinx Embedded can more targeted help customers solve post-selection implementation challenges such as adaptation, mass production and compliance.

electronica 2026 will run until November 13. Forlinx Embedded will continue to demonstrate its products and solutions at Booth 331, Hall C5. All global clients and partners are warmly welcomed to visit and communicate, to jointly explore the implementation path of embodied intelligence and on-device AI, and build a smarter future together.

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