In embedded product development, switching the main processor typically necessitates redesigning the carrier board, repeating prototype verification, and potentially facing risks from single-supplier dependency or discontinuation. These pain points not only extend development cycles but also significantly increase the hidden costs of product line iteration.

To address these challenges, Forlinx Embedded has introduced the UP4 Universal SoM Package Standard. By unifying hardware physical specifications and pin interfaces, UP4 establishes a compatible ecosystem across various chip platforms. With five SoMs ready for mass production and covering various architectures and compute tiers, the UP4 Standard offers a flexible, reliable, and hardware foundation secure for long-term supply chains in embedded device development.

What is UP4 Packaging?

UP4 stands for Universal Package. It is a standardized hardware architecture for SoMs introduced by Forlinx Embedded, featuring:

• Unified Dimensions: 40mm×40mm, suitable for compact internal layout

• Standardized Pins: LCC +LGA design, totaling 487 pins. The pin definitions and electrical layout are fully standardized.

• Cross-Compatibility: Different UP4 SoMs with various main controllers can be swapped on the same carrier board without requiring redesign, re-prototyping, or re-sampling.

UP4 Package Advantages:

Hardware Design Reusability to Improve R&D Efficiency

A single carrier board design can work with multiple SoMs that vary in performance levels. When you want to upgrade the computing power of a product or make improvements, you only need to replace the SoM. This approach eliminates the lengthy processes of redesigning, prototyping, and debugging the carrier board, which significantly reduces research and development costs as well as time to market.

Multi-Vendor Coverage for More Controllable Supply Chains

It covers three mainstream chip platforms: NXP, Rockchip, and Allwinner. In the event of a single chip supply shortage, it enables a rapid switch to an alternative solution within the same package with zero hardware modifications. This effectively hedges against risks of chip shortages and price hikes, ensuring stability in mass production.

Industrial-Grade Quality with Ultra-Long Supply Guarantees

All SoMs in the series have passed rigorous industrial environment testing, operating stably in a wide temperature range of -40°C to +85°C. Backed by original manufacturers’ long-term supply plans, they are guaranteed a 10 to 15-year stable supply cycle, perfectly matching the operational and maintenance needs of long-lifecycle products in industrial and automotive fields.

Comprehensive Development Support for Efficient Implementation

Each product is accompanied by a full suite of development materials, including carrier board schematics, underlying source code, compilation manuals, debugging examples, and more. Coupled with professional technical support, this lowers the barrier to software adaptation and helps customers bring products to market quickly.

Five Products for Comprehensive, Precise Scenario Coverage

Currently, the Forlinx Embedded UP4 series includes five established products that thoroughly meet the needs for lightweight control, edge AI, industrial HMI, and high-computing systems.

FET-MX9352-UP4 SoM

Core Configuration: Dual-core ARM Cortex-A55 + Cortex-M33 real-time core, integrated with a 0.5 TOPS NPU.

Key Features: Native support for TSN and CAN-FD industrial buses, with industrial-grade wide-temperature characteristics.

Target Scenarios: Vehicle gateways, industrial Ethernet devices, lightweight edge AI terminals.

FET3562J-UP4 SoM

Core Configuration: Quad-core ARM Cortex-A55 @ 2.0GHz with a built-in 1 TOPS NPU.

Key Features: Abundant peripheral interfaces and outstanding cost-effectiveness, optimized for BOM cost.

Target Scenarios: Industrial controllers, IoT gateways, edge data acquisition devices.

FET3568J-UP4 SoM

Core Configuration: High-performance platform with quad-core ARM Cortex-A55, supporting triple independent display and 4K encoding/decoding.

Key Features: Provides high-speed expansion interfaces like PCIe and SATA, delivering excellent multimedia and data throughput capabilities.

Target Scenarios: Industrial HMI, edge computing gateways, video surveillance, digital signage.

FET527N-UP4 SoM

Core Configuration: Octa-core ARM Cortex-A55 architecture, integrated with a 2 TOPS NPU and a powerful Graphics Processing Unit (GPU).

Key Features: Supports multi-channel 4K display and multi-task parallel processing, meeting high-performance edge computing requirements.

Target Scenarios: Industrial robots, high-end industrial PCs, smart cockpits.

FET536-UP4 SoM

Core Configuration: Heterogeneous architecture featuring Quad-core ARM Cortex-A55 + RISC-V security MCU, integrated with a 2 TOPS NPU.

Key Features: Incorporates hardware-level security encryption mechanisms and multiple industrial control interfaces, providing extremely high system real-time performance and security.

Target Scenarios: EV charging piles, rail transportation, control systems with high-security requirements.

From reducing costs through hardware reuse and mitigating supply chain risks via multi-vendor strategies to comprehensive product coverage across all scenarios, Forlinx Embedded’s UP4 Universal Package is providing a standardized and sustainable hardware solution for embedded device development. In the future, Forlinx Embedded will continue to expand the UP4 ecosystem, assisting global clients in building more competitive end-products with resilient supply chains.

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