Qualcomm QCS9075-AA System on Module - Forlinx FET9075AA-C 8-Core Edge AI SoM with 100 TOPS NPU
Unlock the next tier of on-device intelligence with the Forlinx FET9075AA-C System on Module (SoM) / Computer on Module. Built around the Qualcomm Dragonwing QCS9075-AA processor, it combines eight Kryo Gen 6 cores running at 2.36GHz with a 100 Dense TOPS NPU, an Adreno 663 GPU and an Adreno VPU 765, backed by 36GB LPDDR5 and 256GB UFS 3.1 storage—enough headroom for multi-model AI inference, high-resolution vision and rich HMI in a single module.
The module exposes the I/O that industrial systems actually need: triple Ethernet (2x 2.5GbE SGMII + 1x GbE RGMII) with TSN, PCIe Gen4 in both 2-lane and 4-lane configurations, three USB ports including two USB 3.1 Gen2, and a dedicated 4-core real-time subsystem with 8x CAN-FD for deterministic control. Rated for -40°C to +85°C and measuring 90mm x 73mm on a 699-pin Mirror Mezz connector, the FET9075AA-C is built for long-lifecycle edge AI, machine vision and industrial automation designs.
Highlights:
- 8-Core Kryo Gen 6: 8x Kryo Gen 6 @2.36GHz with 36GB LPDDR5 and 256GB UFS 3.1.
- 100 Dense TOPS NPU: 100 INT8 Dense TOPS for multi-stream edge AI, vision inspection and robotics.
- 4-Core Real-Time Subsystem: Dedicated RTSS with 8x CAN-FD and 79 RTSS GPIOs for deterministic control.
- TSN Ethernet & PCIe Gen4: 2x 2.5GbE SGMII + 1x GbE RGMII, PCIe Gen4 (2-lane + 4-lane), 2x USB 3.1 Gen2.
- Rich Multimedia: 4x MIPI CSI, 2x MIPI DSI, 4x eDP/DP 1.4, up to 123 Gbps CSI aggregate bandwidth.
- Industrial Grade: -40°C to +85°C, 90mm x 73mm SoM, 699-pin Mirror Mezz connector.
Qualcomm Dragonwing QCS9075-AA Edge AI SoC
QCS9075-AA is a high-end industrial SoC from the Qualcomm Dragonwing IQ-9 family. It pairs an 8-core Kryo Gen 6 CPU with an Adreno 663 GPU, an Adreno VPU 765, a 100 Dense TOPS NPU and a 4-core real-time subsystem, delivering data-center-class AI throughput at the edge while keeping deterministic real-time response for industrial control .
8-Core Kryo Gen 6 Compute
Eight Kryo Gen 6 cores clocked at 2.36GHz are matched with 36GB LPDDR5 memory and 256GB UFS 3.1 storage, giving the FET9075AA-C the memory capacity and bandwidth to host multiple AI models, large vision pipelines and full Linux application stacks on a single module.
100 Dense TOPS NPU for Edge AI
The integrated NPU delivers 100 INT8 Dense TOPS of dedicated AI compute—more than double the previous generation—enabling real-time multi-camera inspection, transformer-based vision models, autonomous navigation and generative AI workloads directly on the device.
4-Core Real-Time Subsystem
Deterministic Control
A dedicated 4-core real-time subsystem with up to 79 RTSS GPIOs and 8x CAN-FD runs deterministic, low-latency control loops alongside the main Linux system—suited to motion control, robotics and time-sensitive industrial networks.
TSN Ethernet & High-Speed I/O
Triple Ethernet (2x SGMII up to 2.5GbE + 1x RGMII GbE) with TSN support, PCIe Gen4 in 2-lane and 4-lane links (RC + EP), two USB 3.1 Gen2 ports and one USB 2.0 port provide the bandwidth for multi-sensor fusion, industrial cameras and high-speed storage expansion.
Rich Multimedia & Vision Interfaces
Four 4-lane MIPI CSI inputs configurable as D-PHY or C-PHY scale to 123 Gbps aggregate bandwidth, while two MIPI DSI outputs and four eDP/DP 1.4 ports (32.4 Gbps per port) drive multi-display HMI, machine vision arrays and 4K video pipelines.
▊ Hardware Features
| FET9075AA-C System On Module Basic Parameters | |
|---|---|
| Processor | Qualcomm QCS9075-AA |
| ARM：8x Kryo Gen 6 @2.36GHz | |
| NPU：100 Dense TOPS | |
| GPU：Adreno 663 (800 MHz) | |
| VPU：Adreno VPU 765 | |
| RAM | 36GB LPDDR5 |
| ROM | 256GB UFS 3.1 |
| Operating Temperature | -40°C ~ +85°C |
| Operating Voltage | DC 24V |
| Connection | Mirror Mezz 699-pin board-to-board connector |
| OS | Linux 6.18.44 |
| Flashing | USB Type-C |
| FET9075AA-C System On Module Function Parameters | ||
|---|---|---|
| Function | QTY | Spec. |
| MIPI DSI | 2 |
2 x 4-lane MIPI DSI with VESA DSC v1.2 support; D-PHY v1.2: 2.5 Gbps/lane, 4 lanes per port, 10 Gbps per port, up to 20 Gbps total; C-PHY v1.1: 5.7 Gbps/trio, 3 trios per port, 17 Gbps per port, up to 34 Gbps total. |
| eDP/DP 1.4 | 4 | 4 x Embedded DisplayPort (eDP)/DisplayPort (DP) v1.4, 8.1 Gbps per lane, 32.4 Gbps aggregate port bandwidth. |
| MIPI CSI | 4 |
4 x 4-lane MIPI CSI configurable as D-PHY or C-PHY mode; D-PHY v1.2: 2.5 Gbps/lane, 4 lanes per port, 10 Gbps per port, up to 40 Gbps total; each 4-lane port can be split into 1-lane + 2-lane or 1-lane + 1-lane combinations; C-PHY v1.2: 10.2 Gbps/trio, 3 trios per port, 31 Gbps per port, up to 123 Gbps total; each 3-trio port can be split into 1-trio + 2-trio, or three independent 1-trio ports. |
| I2S/PCM | Up to 10 |
LS-I2S: up to 10, multiplexed with PCM/TDM pins — 9 x 2-lane data plus 1 x 4-lane data (22 data lanes in total), 3 x MCLK up to 24.576 MHz; HS-I2S: up to 5, of which 2 are multiplexed with LS-I2S and can be configured as LS-I2S when needed. |
| PCIe | 2 |
1 x 2-lane PCIe Gen4: PCIe0 (RC + EP); 1 x 4-lane PCIe Gen4: PCIe1 (RC + EP). |
| USB | 3 |
1 x USB 3.1 Gen2 – USB0 (HS + SS, supports device and host modes); 1 x USB 3.1 Gen2 – USB1 (HS + SS, supports device and host modes); 1 x USB 2.0 – USB2 (HS, supports device and host modes). |
| eMMC | 1 | 1 x 8-bit eMMC 5.1 interface. |
| RGMII | 1 | 1 x RGMII interface (RTSS domain). |
| SGMII | 2 | 2 x SGMII interfaces, up to 2.5GbE. |
| CAN-FD | Up to 8 | 8 x CAN-FD (RTSS domain). |
| QUP | 25 |
MD domain: 20 QUP serial engines — UART (64B FIFO), all QUP SEs configurable as UART; MD domain: HS UART (128B FIFO), QUP0_SE_2/3, QUP1_SE_2/3, QUP2_SE_2/3 configurable as HS UART; MD domain: I2C master, all QUP SEs configurable as I2C; MD domain: SPI master, all QUP SEs except QUP1_SE_6 configurable as SPI master; MD domain: SPI slave, QUP0_SE_4/5, QUP1_SE_4/5, QUP2_SE_4/5 configurable as SPI slave; RTSS domain: 5 QUP serial engines — UART (64B FIFO), all QUP SEs configurable as UART; RTSS domain: HS UART (128B FIFO), QUP0_SE_2/3 configurable as HS UART; RTSS domain: I2C master, all QUP SEs configurable as I2C; RTSS domain: SPI master, all QUP SEs configurable as SPI master; RTSS domain: SPI slave, QUP0_SE_0/1 configurable as SPI slave. |
| GPIO (MD domain) | Up to 149 | Main domain supports 149 GPIOs (GPIO_0 to GPIO_148). |
| GPIO (RTSS domain) | Up to 79 | RTSS domain supports 79 GPIOs (RTSS_IO_0 to RTSS_IO_78). |
Note*: The parameters listed above are based on hardware design or theoretical CPU limits. Interfaces may be multiplexed; numbers represent maximum theoretical availability.
▊ Development Board Function Parameters
| Development Board Function Parameters | ||
|---|---|---|
| Function | QTY | Spec. |
| DP | 4 | 4 x DisplayPort v1.4 outputs, up to 4K60fps. |
| MIPI DSI | 2 | Routed via FPC connector, 4-lane output, default matching Forlinx 7-inch MIPI display at 1024x600@30fps. |
| MIPI CSI | 4 | 4 x 4-lane MIPI CSI camera connectors. |
| USB-Debug | 1 | MD and RTSS debug UARTs converted to a Type-C USB port. |
| Type-C OTG | 1 | Native USB Type-C (USB 3.0) with OTG support and reversible plug. |
| USB 2.0 Host | 1 | Native USB 2.0 Type-A port. |
| USB 3.0 Host | 2 | 2 x USB 3.0 Type-A ports expanded via on-board USB hub. |
| Wi-Fi & Bluetooth | 1 | On-board M.2 Key-E slot (PCIe 2-lane), default matching AW-XM458MA Wi-Fi & BT module. |
| Ethernet | 3 |
2 x 2.5GbE ports (SGMII); 1 x 1GbE port (RGMII). |
| Audio | 2 |
1 x I2S with MAX98357AETE+ amplifier, supporting 4Ω 1.3W / 8Ω 0.8W speakers; 1 x I2S with codec chip, supporting speaker, headphone output and MIC input (TBD). |
| PCIe | 1 | 1 x PCIe x4 slot, 4-lane, supporting PCIe Gen4. |
| TF Card | 1 | Shares one SDIO interface, selected via 0Ω resistor. |
| eMMC Module | 1 | Shares one SDIO interface, selected via 0Ω resistor. |
| 4G/5G | 1 | Supports M.2 Key B 4G/5G modules. |
| CAN-FD | 8 | 8 x CAN / CAN-FD ports with isolation and protection. |
| RS485 | 2 | 2 x RS485 ports with isolation and protection. |
| RTC | 1 | I2C interface, onboard RTC chip with button battery holder. |
| JTAG | 1 | JTAG debugging via pin header. |
| FAN | 1 | Fan connector for SoM cooling. |
| GPIO | - | Remaining MD_GPIO and RTSS_GPIO routed via 2.54mm pin headers for expansion. |
Note*: The parameters listed above are based on hardware design or theoretical CPU limits. Interfaces may be multiplexed; numbers represent maximum theoretical availability.
▊ Accessories
Please click here to get more information about the supported modules and accessories.
▊ Documentation
Reference Manuals
Product Brief
Hardware Documents
Product Datasheet
User Guide
SoM Pinmux
Carrier Board Schematic
Carrier Board PCB
Software Documents
Linux BSP User Guide
Driver Source Code
Driver Porting Guide
Flashing Guide (USB Type-C)
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Frequency: 2.36GHz
RAM: 36GB LPDDR5
ROM: 256GB UFS 3.1
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Frequency: 2.35GHz + 2.1GHz + 1.95GHz
RAM: 12GB LPDDR5
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Frequency: 2.35GHz + 2.1GHz + 1.95GHz
RAM: 12GB LPDDR5
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