OKMX8MP-C Single Board Computer

CPU: iMX8M Plus

Architecture: 4*A53+M7

Frequency: 1.6GHZ

RAM: 4GB LPDDR4

ROM: 16GB eMMC

System: Linux5.4.70+Qt5.15, Android

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OKMX8MP-C Single Board Computer

OKMX8MP-C single board computer(SBC) is powered by the high-performance processor, NXP i.MX 8M Plus , built-in NPU, ISP, AI computing capacity up to 2.3TOPS, can meet most compact Edge AI Solution. The flexible I/O interfaces are convenient for users' application developments. The SBC supports 2 Gigabit Ethernet, 2 CAN-FD, 4 UART, 4G, 5G, dual-band WiFi, PCIe3.0, USB3.0, HDMI2.0, LVDS, MIPI_CSI, MIPI_DSI and other interfaces. Industrial-grade design with ESD,EMI solutions, OKMX8MP-C is widely used in various fields, such as smart cities, industry 4.0, smart medical devices, intelligent transport and other applications.

Features

  • 1. a Neural Processing Unit (NPU) operating at up to 2.3 TOPS;
  • 2. Dual Image Signal Processor (ISPs): Resolution up to 12MP and input rate up to 375MPixels/s;
  • 3. Powerful quad Arm® Cortex®-A53 processor plus real-time control with Cortex-M7, up to 800MHz;
  • 4. Robust control networks supported by dual CAN FD and dual Gigabit Ethernet with Time Sensitive Networking (TSN);
  • 5. Dual 8LVDS display.

Advantages Of OKMX8MP-C Single Board Computer

  • 1. UBOOT adds MIPI and LVDS display drivers;
  • 2. Increase UBOOT LOGO Keep function;
  • 3. Increase UBOOT's use of the kernel device tree to configure hardware functions;
  • 4. Adapt to the WIFI module, and solve a series of bugs in the module;
  • 5. Fix a series of problems in the three-screen display and HDMI startup and plug-in process.

iMX8M Plus Core Board Features:

  • 1. EEPROM chip is reserved on the core board to ensure hardware consistency;
  • 2. The core board adopts LPDDR4, up to 8MP, 4GT/S;
  • 3. Some high-speed signal circuits of LPDDR4 have passed the simulation test, and the stability is guaranteed;
  • 4. The bottom structure considers the shell and industry design, which is convenient for productization;
  • 5. The communication interface considers EMC protection requirements, and adds static electricity and isolation design.

Industrial-grade system on module with high performance and low power consumption

Industrial-grade system on module with high performance and low power consumption
Industrial-grade system on module with high performance and low power consumption

High-speed Communication Interface

High-speed Communication Interface
High-speed Communication Interface

4K picture quality and HiFi voice experience

The HDMI interface supports up to 4K display output;
it also has LVDS, MIPI-DSI display interfaces, and can support three display interfaces, three screens with the same display, and three screens with different displays;

The latest audio technology, Cadence® Tensilica® HiFi 4 DSP @ 800 MHz, 6x I2S TDM, DSD512, S/PDIF Tx + Rx, 8-channel PDM microphone input, eARC, ASRC.

4K picture quality and HiFi voice experience
4K picture quality and HiFi voice experience

Advanced Multimedia Technology

Advanced Multimedia Technology
Advanced Multimedia Technology

3D/2D Graphics Acceleration

3D/2D Graphics Acceleration
3D/2D Graphics Acceleration

Machine Learning And Vision

Built-in NPU, AI computing capability 2.3TOPS, meeting the needs of lightweight edge computing

Machine Learning And Vision
Machine Learning And Vision

Built-in image signal processor (ISP)

Built-in image signal processor (ISP)
Built-in image signal processor (ISP)

High version and high stability operating system

High version and high stability operating system
High version and high stability operating system

Industrial grade quality

Industrial-grade temperature width test -40℃~+85℃ (except WiFi module) Communication interface static electricity level 4 and 1.5KV isolation protection

Industrial grade quality
Industrial grade quality

Rich communication interface

Rich communication interface
Rich communication interface

Flexible optional wireless module

Support dual-band WiFi, 4G module, 5G module with SDIO3.0 interface

Flexible optional wireless module
Flexible optional wireless module

Interface resources

OKMX8MP-C Single Board Computer Interface resources
OKMX8MP-C Single Board Computer Interface resources

▊ Product Video


OKMX8MP-C SBC Demo | NXP iMX8M Plus processor based

▊ Hardware Features


iMX8M Plus System On Module Basic Parameters
CPU NXP i.MX 8M Plus
Architecture Quad-Core Cortex-A53,Single-Core Cortex-M7
Frequency 1.6GHz
RAM 2GB/4GB/6GB/8GB LPDDR4(Standard 4GB)
Flash 16GB eMMC
OS Linux5.4.70+Qt5.15, Android11
Working Voltage 5V
Interface Mode Ultra-thin board-to-board connector (4*80pin pitch 0.5mm)
Working Temperature -40℃~+85℃
Mechanical dimensions 62mm × 36mm, Thickness 1.6mm, 8-layer ENIG PCB

iMX8M Plus System On Module Function Parameters
Peripheral source QTY Parameters
USB 2

The CPU contains 2 USB 3.0/2.0 controllers with integrated PHY;

Host mode: Support Super-speed (5Gbit/s), high-speed (480Mbit/s), full-speed (12Mbit/s), low-speed (1.5Mbit/s).

Device mode: SS/HS/FS

PCIE 1 Support 1 PCI Express Gen3.
MIPI_CSI 2 Provides two 4-lane MIPI camera serial interfaces, which can work up to 1.5 Gbps.
MIPI_DSI 1

Provides a 4-lane MIPI display serial interface, which can work up to 1.5 Gbps.

• 1080 p60• WUXGA (1920x1200) at 60 Hz

• 1920x1440 at 60 Hz

• UWHD (2560x1080) at 60 Hz

• WQHD (2560x1440) by reduced blanking mode

HDMI 1 Supports HDMI 2.0a display resolution up to 4Kp30Supports HDMI2.1 eARC
LVDS 1

Single channel (4 lanes) supports 720p60

Dual asynchronous channels (8 data, 2clocks) support 1920x1200p60

Ethernet ≤2 Ethernet ≤2 supports 2 RGMII interfaces, one of which supports TSN
SD ≤2 SD2, 4-bit, support 1.8/3.3V mode switching SD1, 8-bit, only support 1.8V mode
UART ≤4 The maximum baud rate supported is 4Mbps.
SPI ≤3 The maximum supported rate is 52Mbit/s, master-slave mode can be configured
I2C ≤5

The highest rate supported in standard mode is 100Kbit/s;

The highest rate supported in fast mode is 400Kbit/s.

CAN ≤2 The CAN FD protocol is used to implement the CAN communication controller, and the CAN protocol conforms to the CAN 2.0B protocol specification. (CAN FD requires CPU version support)
SAI ≤6 Synchronous Audio Interface (SAI), a full-duplex serial interface that supports frame synchronization, such as I2S, AC97, tdM, and codec/DSP interfaces.
SPDIF ≤1 A standard audio file transmission format, jointly developed by Sony and Philips.
PWM ≤4 With 16-bit counter;
QSPI ≤1 Has been occupied by the core board, connected to the 16MB Nor Flash
JTAG 1

Note: *TBD is under development

Note: The parameters in the table are hardware design or CPU theoretical values.

iMX8M Plus Development Board Function Parameter
Peripheral source QTY Parameter
USB3.0 Type-C 1 USB 3.0 of USB Type-C supports DFP, UFP and DRP
USB3.0 2 USB Type A socket lead out, only used as Host
MIPI_CSI 2 CSI1: daA3840-30mc-IMX8MP-EVK, resolution 3840X2160CSI2: OV5645, the camera supports a maximum resolution of 2592X1944
MIPI_DSI 1 The backplane leads to the 4 lane MIPI_DSI interface through the FPC socket, which is adapted to the Forlinx 7-inch MIPI screen by default, with a resolution of 1024 x [email protected]
LVDS 1 LVDS 1 dual asynchronous channels (8 data, 2clocks) support 1920x1200p60, all signals are led out
HDMI 1 Support HDMI 2.0a display resolution up to [email protected] Support HDMI2.1 eARC
Ethernet 2 Support 10/100/1000Mbps self-adaption, lead through RJ45. One of them supports TSN
PCIE 1 The backplane adopts standard PCIEx1 card interface and supports PCI Express Gen3
TF Card 1 The development board supports one TF Card, and can support UHS-I TF cards, with a rate of up to 104MB/s.
4G 1 Use it with 5G modules, support 4G modules using miniPCIE sockets, and use Quectel EC20 by default
5G 1 Use it with 4G modules, support 5G modules using M.2 Key B socket, and use Quectel RM500Q by default
WiFi 1

The default onboard AW-CM358M IEEE 802.11 a/b/g/n/ac dual-band WIFI, up to 433.3Mbps transceiver rate;

Bluetooth 5, up to 3Mbps rate

Bluetooth 1
Audio 1 The development board is adapted to the WM8960 chip, the headphone output and MIC input are integrated into a 3.5mm headphone jack, and it supports 2 channels of 1W8Ω speaker output, which are led out through the XH2.54 white terminal.
I2C 3 Used to mount audio, RTC, camera and other equipment on the backplane.
PWM 2 Used to adjust the backlight brightness of the display
RTC 1 With independent RTC chip on board, the time can be recorded by button battery after the bottom board is powered off.
UART 4 The backplane board carries USB to 4 serial ports, which are led out through socket pins for users to plug in equipment.
ECSPI 1 The development board leads to ECSPI2 through a 2 x 5 2.0mm pitch socket for users to plug in equipment.
CAN 2 Electrical isolation, support CAN-FD (requires CPU version support), and conform to CAN2.0B protocol
RS485 1 Electrical isolation, automatic control of the sending and receiving direction.
KEY 4 Switch machine, reset button, and 2 user-defined buttons.
LED 2 User-defined LED lights, red and green.
DEBUG UART 2 Cortex-A53 and M7 debug serial port, the default baud rate is 115200
JTAG 1 The development board leads to the JTAG signal through a 2 x 5 2.0mm pitch socket.

Note: The parameters in the table are hardware design or CPU theoretical values.

Product Name Description
FETMX8MP-C System On Module General name of products for Forlinx external promotion
FETMX8MPQ-C System On Module Quad-core processor, currently on sale
FETMX8MPD-C System On Module Dual-core processor, unreleased
FETMX8MPX-C It means that the PCB is compatible with quad-core (Quad) and dual-core (Dual)

▊ Downloads


Datasheet: FETMX8MP-C System on Module Datasheet

Product Manual: OKMX8MP-C Single Board Computer Overview

Hardware Manual: iMX8M Plus EVK Hardware Manual

▊ Accessories


Provides the modules and accessories used in Forlinx's iMX8M Plus SBC.

See here for communication modules, Evaluation Kit, LCD screen, SBC expansion module and further accessories »


Optional Module
Forlinx 5G Module Camera Module DVP OV5640 MIPI
4G/5G Module OV5645 Camera
10.1 inch LVDS Screen 7-inch MIPI Screen
10.1 inch LVDS Screen 7-inch MIPI Screen

Technical Support

Forlinx provides software resources including kernel and driver source code, together with detailed user manual, schematic documentations to help customer start their development rapidly.

▊ How To Buy iMX8M Plus SBC?


1. Order Online

We have an online store on Alibaba, please contact us to start ordering

2. Order offline

pls send your inquiry to our mailbox [email protected];

3. Payment Terms

Samples(100% T/T in advance), Bulk Order(please contact with our sales)

▊ Shipment


1. Delivery: Goods will be sent out by express as requested

2. Lead time: generally, goods could be sent out within five working days for a sample order, for a bulk requirement order, please contact us to check stock status and estimated delivery time.

3. Shipping charge: buyers should bear related shipping cost.

▊ Related News


▊ Other Forlinx iMX8 Series Products


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i.MX8M Mini Development Board
i.MX8M Plus Computer on Module
OKMX8MQ-C Development Board OKMX8MM-C Development Board FETMX8MP-C Computer on Module